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TO-220

Known as: TO220 
The TO-220 is a style of electronic component package, commonly used for discrete semiconductors as transistors and silicon-controlled rectifiers, as… Expand
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Papers overview

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2017
2017
In recent years silver sinter materials have attracted rising attention as interconnect materials in the power electronic devices… Expand
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2017
2017
スイッチング特性および熱特性の評価 Evaluation of Switching and Thermal Characteristics of -Ga2O3 Schottky Barrier Diode 株式会社 FLOSFIA,京都大学工学研究科 2… Expand
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2012
2012
Abstract Adhesion of moulding compounds on different surfaces like silicon, copper or silver is the most important parameter to… Expand
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2012
2012
This work introduces a new design approach for the use of fractal structures for low-resistance large area transistors structures… Expand
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2012
2012
Les materiaux composites a base de fibre carbone suscitent un interet grandissant dans l'industrie en general et avionique en… Expand
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2011
2011
This paper presents expressions for the waveforms and design equations to satisfy the ZVS/ZDS conditions in the class-E power… Expand
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2011
2011
Abstract Reliability of Silicon Carbide (SiC) power devices is still an open problem, preventing a wider application of such a… Expand
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2009
2009
Thermal and electrical performances of two conductive adhesive materials loaded with Ag particles suitable for power die bonding… Expand
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2005
2005
In this paper, a transient non-linear dynamic finite element framework is developed and utilized for the optimization of trim and… Expand
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2004
2004
The optical, mechanical and thermal properties of a specialty epoxy-anhydride molding compound are presented. Physical properties… Expand
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