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Footprint (electronics)
Known as:
Footprint (disambiguation)
, Land pattern
A footprint or land pattern is the arrangement of pads (in surface-mount technology) or through-holes (in through-hole technology) used to physically…
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Related topics
Related topics
9 relations
Chip carrier
Contact pad
List of integrated circuit packaging types
Pin compatibility
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Broader (1)
Electronic engineering
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Declining Trend of Water Inflow in the Dams of Rajasthan State
N. Gupta
,
A. S. Jethoo
2014
Corpus ID: 113233779
Rajasthan is a semi arid state with the highest of the geographical area (343,000.00 square km) of the Indian subcontinent…
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2013
2013
Effect of Tillage Depth and Pattern on Growth and Yield of Grain Sorghum ( Sorghum bicolor L . Moench ) under Rain-fed
Ahmed M. El Naim
,
Mkarem A. M. Baldu
,
Moayad B. Zaied
2013
Corpus ID: 106389535
A field experiment was carried out under rainy season (2010/11),at two locations (Khorelabeid and Kaba) in Sheikan locality…
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2013
2013
Lead frame fanning and broken connecting bars elimination through design change and molding optimization
L. Lim
,
T. Li
Electronic Packaging Technology Conference
2013
Corpus ID: 25199141
Designing of a leadless package is very challenging as there are many manufacturability considerations that need to be considered…
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Review
2012
Review
2012
CONSEQUENCES OF POPULATION GROWTH ON AGRICULTURAL PRODUCTION IN OBINGWA LOCAL GOVERNMENT AREA OF ABIA STATE NIGERIA.
Symbol Adindu
2012
Corpus ID: 156792001
Today, millions of people in the world are without food especially in the developing world which has been of great concern as…
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2010
2010
Effects of obstruction and corridor on the construction land pattern evolving in paralleled ridge-valley area
Zhang Yang-yang
2010
Corpus ID: 131741619
The paralleled ridge-valley area of the Sichuan basin have quite important ecological status,but its land use pattern of mountain…
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Review
2010
Review
2010
Integrated nCTF pad design on PCB for BGA solder joint reliability enhancement
Fook Loon Wooi
,
Ooi Ing Chuan
International Electronics Manufacturing…
2010
Corpus ID: 25391922
In PCBA manufacturing industry, corner adhesive was commonly used on BGA(Ball Grid Arrays) to resolve the solder joint crack…
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2008
2008
Implementing 0201s On High-Density Lead-Free Memory Modules
S. Iyer
,
S. Sajjala
,
P. Damodaran
,
K. Srihari
IEEE transactions on electronics packaging…
2008
Corpus ID: 40010056
The introduction of 0201 components is another step taken in the world of electronics to aid the miniaturization of electronic…
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2007
2007
Construction of urban land demand model base system based on web services
Kang Huang
,
Manchun Li
,
Zhonghua Gao
,
Ting Nie
GEOINFORMATICS
2007
Corpus ID: 62232162
This paper explores a series of methods and models of urban land demand forecast, and these methods and models were dived into…
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2006
2006
Evaluating effects of land pattern with regional characteristic curves: Land cover indicators and estimating building energy use from thermal image data.
G. Lewis
2006
Corpus ID: 126884437
1998
1998
A process of subdivision : creating a therapeutic environment for a Northampton mental health community
Scott M. Tulay
1998
Corpus ID: 140592024
This thesis explores the fractal behavior of subdivision through the design of a new mental health community in Northampton…
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