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Dicing tape

Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer microfabrication. The… 
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Related topics

Related topics

5 relations
MicrofabricationSemiconductorWafer (electronics)Wafer dicing

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
A Novel Dicing tape for WLCSP Using Stealth Dicing Through Dicing tape and Back Side Protection-Film
Market demand of information terminals for Internet of Things (IoT) is increasing. So market situation requires various… 
2018
2018
Quantitative investigation of pick-up performance for UV-curable dicing tape
It is known that the materials of base film of dicing tapes affects pick-up property, however it is difficult to evaluate pick-up… 
2016
2016
Investigation of Advanced Dicing Technologies for Ultra Low-k and 3D Integration
The introduction and use of ultra low-k dielectric materials in an attempt to achieve better die performance brought new… 
2014
2014
Characterization of dicing tape adhesion for ultra-thin die pick-up process
We observed experimentally that the dicing tape “adhesion” increases during a mimicked die pick-up process when the die thickness… 
2014
2014
Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling
Miniaturization and increased performance demands are driving the industry to explore 2.5D and 3D packaging. Although progress… 
Highly Cited
2011
Highly Cited
2011
TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Silicon interposers with through silicon vias (TSVs) have become important key components of 3D architectures. They are used as… 
2010
2010
Investigations of the effects of blade type, dicing tape, blade preparation and process parameters on 55nm node low-k wafer
This paper presents an investigation of the effects of blade type, dicing tape, blade preparation and the key process parameters… 
2006
2006
Determination of the Interfacial Fracture Toughness of Laminated Silicon Die on Adhesive Dicing Tape from Stud Pull Measurement
Stud pull measurements have been conducted to obtain the normal forces required to detach die attach film (DAF) laminated dice… 
2004
2004
Thin die bonding techniques
Picking and bonding 50-micron thick chips presents new challenges to the die bonder industry. Extensive development efforts have… 
2002
2002
Antistatic dicing tape
PURPOSE: An antistatic dicing tape is provided, to reduce the variation of contamination to adhered materials or adhesive… 
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