Dicing tape

Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer microfabrication. The…

Papers overview

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2014

We observed experimentally that the dicing tape “adhesion” increases during a mimicked die pick-up process when the die thickness…

2014

Miniaturization and increased performance demands are driving the industry to explore 2.5D and 3D packaging. Although progress…

2013

During their life cycles, semiconductor devices are exposed to different mechanical loads as a result of assembly and packaging…

2012

The technology of dry film laminator equipment has been developed in CSUN for more than a decade and widely adopted in PCB and…

2011

A has an adhesive force sufficiently holds the wafer in the step of dicing process of semiconductor wafer, and, after package…

2008

[Problem] The invention pickup defects in the pick up step of the inline method of manufacturing a semiconductor device, which…

2006

The usage of die attach film (DAF) is rapidly growing propelled by stacked die and 3 dimensional packaging. The die attach film…

2006

Stud pull measurements have been conducted to obtain the normal forces required to detach die attach film (DAF) laminated dice…

2004

Picking and bonding 50-micron thick chips presents new challenges to the die bonder industry. Extensive development efforts have…

2002

PURPOSE: An antistatic dicing tape is provided, to reduce the variation of contamination to adhered materials or adhesive…