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Dicing tape

Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer microfabrication. The… 
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Related topics

Related topics

5 relations
MicrofabricationSemiconductorWafer (electronics)Wafer dicing

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
An Introduction of Strip Chopping Cut Method to Establish a Robust Strip Based Dicing Process on Tape Dicing Concept
Tape dicing concept is most commonly used in miniature QFN package singulation process due to its low operating cost and high… 
2014
2014
Characterization of dicing tape adhesion for ultra-thin die pick-up process
We observed experimentally that the dicing tape “adhesion” increases during a mimicked die pick-up process when the die thickness… 
2014
2014
Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling
Miniaturization and increased performance demands are driving the industry to explore 2.5D and 3D packaging. Although progress… 
2014
2014
Wafer Dicing Using Dry Etching on Standard Tapes and Frames
To meet the changing demands of consumer product form factors, there has been a steady shift to thinner and smaller semiconductor… 
2012
2012
The applications of wafer vacuum laminator equipment in 3D-IC process technology
The technology of dry film laminator equipment has been developed in CSUN for more than a decade and widely adopted in PCB and… 
2006
2006
Determination of the Interfacial Fracture Toughness of Laminated Silicon Die on Adhesive Dicing Tape from Stud Pull Measurement
Stud pull measurements have been conducted to obtain the normal forces required to detach die attach film (DAF) laminated dice… 
2006
2006
Dicing die attach films for high volume stacked die application
The usage of die attach film (DAF) is rapidly growing propelled by stacked die and 3 dimensional packaging. The die attach film… 
2004
2004
Thin die bonding techniques
Picking and bonding 50-micron thick chips presents new challenges to the die bonder industry. Extensive development efforts have… 
2002
2002
Dicing tape mounter applicable a pre-cut dicing tape and general dicing tape and In-line system having the dicing tape mounter
PURPOSE: A dicing tape mounter capable of mounting a pre-cut dicing tape and a general dicing tape at a wafer and an in-line… 
2002
2002
Antistatic dicing tape
PURPOSE: An antistatic dicing tape is provided, to reduce the variation of contamination to adhered materials or adhesive… 
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