Wafer dicing

Known as: Wafer sawing 
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following… (More)
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Topic mentions per year

Topic mentions per year

1982-2017
010203019822017

Papers overview

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2017
2017
In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of… (More)
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2013
2013
Wafer dicing has been traditionally carried out using mechanical methods, including diamond saw and laser techniques. However… (More)
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2008
2008
Conventional blade dicing is well known as standard process for semiconductor wafer singulation. As of to-date, wafer… (More)
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2007
2007
With the further shrinking of IC dimensions, low- material has been widely used to replace the traditional SiO interlayer… (More)
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Highly Cited
2006
Highly Cited
2006
We have developed a single-wafer vacuum encapsulation for microelectromechanical systems (MEMS), using a thick (20-mum… (More)
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2006
2006
As telecommunication equipment that supports high-level information networks is being made portable, the requirements for… (More)
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2005
2005
A multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In… (More)
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2005
2005
The pervasive use of advanced reticle enhancement technologies demanded by VLSI technology scaling leads to dramatic increases in… (More)
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2005
2005
The aggressive scaling of VLSI feature size and the pervasive use of advanced reticle enhancement technologies has led to… (More)
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2005
2005
With the farther shrink of the IC dimension, the low k material has been widely used to replace the traditional SiO/sub 2/ ILD in… (More)
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