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Wafer dicing

Known as: Wafer sawing 
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following… 
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Chip carrierComputerDicing tapeDie (integrated circuit)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Development of wafer sawing capability on 2 mil saw street 4 mil thickness with TiNiAg back metal
For existing industrial trend, increasing the Potential Die per Wafer (PDPW) through saw street reduction has become the common… 
2010
2010
Chapter Forty One – Dicing of MEMS Devices
Review
2006
Review
2006
Review on SiC-recycling in wafer sawing operations
During multi-wire sawing of wafers a large amount of slurry is produced, which contains polyethylene glycol (PEG), silicon… 
2006
2006
Advanced dicing technology for semiconductor wafer -Stealth Dicing
"Stealth Dicing (SD) " was developed to solve such inherent problems of dicing process as debris contaminants and unnecessary… 
2005
2005
Laser technology for wafer dicing and microvia drilling for next generation wafers (Invited Paper)
Laser micromaching systems are being used in mainstream high-volume semiconductor applications. Two of those processes, via… 
2005
2005
The Stealth Dicing Technologies and Their Application
2005
2005
GaAs-Wafer Dicing Using the Water jet Guided Laser
Semiconductor wafers are getting thinner and thinner. GaAs wafers are not excluded by this trend. Since new dicing technologies… 
2004
2004
Multi-project reticle floorplanning and wafer dicing
Multi-project Wafers (MPW) are an efficient way to share the rising costs of mask tooling between multiple prototype and low… 
1997
1997
Microriveting-a new wafer joining method
  • B. ShivkumarC. Kim
  • Proceedings IEEE The Tenth Annual International…
  • 1997
  • Corpus ID: 53993962
Microriveting, a new technique to join wafers, is presented as an alternative to wafer bonding. Actual microrivets are fabricated… 
Review
1962
Review
1962
Internationaler Stand der Forschung auf dem Gebiet des Sägens
ZusammenfassungNach einem kurzen Überblick über Kenngrößen von Sägemaschinen sowie über die geometrischen und kinematischen… 
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