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Wafer dicing

Known as: Wafer sawing 
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following… 
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Chip carrierComputerDicing tapeDie (integrated circuit)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Breakthrough development of new die attach method with high conductive wafer back coating
The epoxy dispensing process is one of the most commonly used die attach methods in the semiconductors assembly process. Some… 
Highly Cited
2006
Highly Cited
2006
Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing
ldquoStealth dicing (SD)rdquo was developed to solve inherent problems of a dicing process such as debris contaminants and… 
2005
2005
Laser technology for wafer dicing and microvia drilling for next generation wafers (Invited Paper)
Laser micromaching systems are being used in mainstream high-volume semiconductor applications. Two of those processes, via… 
2005
2005
The Stealth Dicing Technologies and Their Application
2005
2005
300mm low k wafer dicing saw study
With the farther shrink of the IC dimension, the low k material has been widely used to replace the traditional SiO/sub 2/ ILD in… 
Review
2004
Review
2004
Recent advances in flip-chip underfill: materials, process, and reliability
In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the… 
Highly Cited
2001
Highly Cited
2001
Forces and Energy in Circular Sawing and Grinding of Granite
An investigation is reported of the forces and energy in circular sawing and grinding of gray granite. Measurements were made of… 
1997
1997
Neue Erkenntnisse zur Ätiologie der sogenannten Strahlenkaries
ZusammenfassungFragestellungDie Ätiologie der Strahlenkaries wird trotz vieler Untersuchungen kontrovers diskutiert: Die These… 
1997
1997
Microriveting-a new wafer joining method
  • B. ShivkumarC. Kim
  • Proceedings IEEE The Tenth Annual International…
  • 1997
  • Corpus ID: 53993962
Microriveting, a new technique to join wafers, is presented as an alternative to wafer bonding. Actual microrivets are fabricated… 
Review
1962
Review
1962
Internationaler Stand der Forschung auf dem Gebiet des Sägens
ZusammenfassungNach einem kurzen Überblick über Kenngrößen von Sägemaschinen sowie über die geometrischen und kinematischen… 
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