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Wafer dicing

Known as: Wafer sawing 
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following… Expand
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Papers overview

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2015
2015
The epoxy dispensing process is one of the most commonly used die attach methods in the semiconductors assembly process. Some… Expand
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Highly Cited
2006
Highly Cited
2006
"Stealth Dicing (SD) " was developed to solve such inherent problems of dicing process as debris contaminants and unnecessary… Expand
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2006
2006
ldquoStealth dicing (SD)rdquo was developed to solve inherent problems of a dicing process such as debris contaminants and… Expand
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2006
2006
As telecommunication equipment that supports high-level information networks is being made portable, the requirements for… Expand
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2005
2005
Laser micromaching systems are being used in mainstream high-volume semiconductor applications. Two of those processes, via… Expand
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2005
2005
With the farther shrink of the IC dimension, the low k material has been widely used to replace the traditional SiO/sub 2/ ILD in… Expand
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2004
2004
Multi-project Wafers (MPW) are an efficient way to share the rising costs of mask tooling between multiple prototype and low… Expand
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2003
2003
This paper presents a hollow, silicon microneedle array, integrated with fluidic microchannels for the extraction and analysis of… Expand
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1997
1997
Microriveting, a new technique to join wafers, is presented as an alternative to wafer bonding. Actual microrivets are fabricated… Expand
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1993
1993
  • Udi Efrat
  • Proceedings of 15th IEEE/CHMT International…
  • 1993
  • Corpus ID: 53772869
Wafer dicing is one of the critical elements of the IC assembly process where improvements can make a major contribution to yield… Expand
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