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Wafer-level packaging

Known as: WL-CSP, WLNSP, WLP 
Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional… 
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Related topics

Related topics

9 relations
Chip-scale packageIntegrated circuitList of integrated circuit packaging typesSmartphone

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
The design, materials, process, fabrication, and reliability of fan-out wafer-level packaging (FOWLP) with chip-first and die… 
Highly Cited
2017
Highly Cited
2017
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed… 
Highly Cited
2016
Highly Cited
2016
InFO (Wafer Level Integrated Fan-Out) Technology
A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application… 
Highly Cited
2016
Highly Cited
2016
Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of… 
Review
2011
Review
2011
Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review
This paper presents a review of the wafer-to-wafer alignment used for 3-D integration. This technology is an important… 
Highly Cited
2010
Highly Cited
2010
Next generation eWLB (embedded wafer level BGA) packaging
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain… 
Review
2008
Review
2008
Wafer level packaging of MEMS
  • M. Esashi
  • TRANSDUCERS - International Solid-State Sensors…
  • 2008
  • Corpus ID: 2066549
Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and… 
Highly Cited
2008
Highly Cited
2008
Embedded Wafer Level Ball Grid Array (eWLB)
Wafer Level Packaging (fan-in WLB, Wafer Level Ball Grid Array) is the upcoming future packaging technology with many advantages… 
Highly Cited
2008
Highly Cited
2008
Embedded Wafer Level Ball Grid Array (eWLB)
The main challenges of today's device packaging are miniaturization, continuously increasing operating frequencies/high data… 
Highly Cited
2004
Highly Cited
2004
Localized induction heating solder bonding for wafer level MEMS packaging
This paper reports a new solder bonding method for the wafer level packaging of MEMS devices. Electroplated magnetic film was… 
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