Wafer-level packaging

Known as: WL-CSP, WLNSP, WLP 
Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional… (More)
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Papers overview

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2012
2012
The main objective of this work has been to demonstrate the feasibility of combining hermetic high vacuum level MEMS packaging… (More)
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2010
2010
Wafer level packages (WLPs) with various design configurations are rapidly gaining tremendous applications throughout… (More)
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2009
2009
The interest of user for WLP has been raised because of benefits such as reduced package thickness, fan-out capability, high I/O… (More)
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Highly Cited
2008
Highly Cited
2008
  • E. Esashi
  • TRANSDUCERS - International Solid-State Sensors…
  • 2008
Wafer level packaging methods of MEMS are described. These play important roles to reduce cost and to improve reliability. MEMS… (More)
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Highly Cited
2008
Highly Cited
2008
The main challenges of today's device packaging are miniaturization, continuously increasing operating frequencies/high data… (More)
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2008
2008
  • Qiang Han
  • 10th Electronics Packaging Technology Conference
  • 2008
Wafer Level Packaging (WLP) has the highest potential for future single chip packages because the WLP is intrinsically a chip… (More)
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2007
2007
An approach to low-cost, wafer-level packaging of microelectromechanical systems (MEMS), e.g., microresonators, is reported. The… (More)
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2007
2007
Through silicon via (TSV) technology is one of the critical and enabling technologies for 3D chip stacking. Many TSV approaches… (More)
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2007
2007
Northrop Grumman Space Technology (NGST) has developed a MMIC compatible, hermetic wafer-level packaging (WLP) technology that is… (More)
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2003
2003
Kulicke & Soffa s Flip Chip Division (formerly Flip Chip Technologies), the market leader of wafer level packaging (WLP… (More)
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