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Wafer-level packaging

Known as: WL-CSP, WLNSP, WLP 
Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional… 
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Related topics

Related topics

9 relations
Chip-scale packageIntegrated circuitList of integrated circuit packaging typesSmartphone

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2009
2009
Wafer-level packaging for environment-resistant microinstruments
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2007
2007
Cavityless Wafer Level Packaging of SAW Devices
Original implementations of the solution to cavityless WLP by means of isolation of waves are discussed. Variants of waveguiding… 
2006
2006
A Novel Audio Coding Scheme Using Warped Linear Prediction Model and the Discrete Wavelet Transform
In this paper, we present a novel audio coder using the discrete wavelet transform (DWT) and warped linear prediction (WLP). In… 
Review
2005
Review
2005
Wafer Level Micro-Encapsulation
Abstract : Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS… 
2005
2005
Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature Passivation
In the past decade wafer level packaging (WLP) has been proven to be a very competitive solution regarding performance… 
2005
2005
Application of Au-Sn Eutectic Bonding in Hermetic Rf MEMS Wafer Level Packaging
Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should… 
2001
2001
A Polymer reinforced WLP: Why it has superior solder joint reliability
A new wafer level CSP has been developed by Kulicke & Soffa mainly for increasing the solder joint reliability of the current… 
2000
2000
3D wafer level packaging
IC packaging continues to be driven to miniaturization not only in footprint (area of board space used) but also in package… 
2000
2000
Low cost high density Compliant Wafer Level Package
A novel high density and high performance wafer level packaging technology called the Compliant Wafer Level Package (CWLP) is… 
1999
1999
ultra cspTM A Wafer Level Package
There has been a significant amount of work over the past 5 years on chip scale packaging. The majority of this work has been an… 
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