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Thin Small Outline Package

Known as: TSOP, Thin small-outline package 
Thin Small Outline Package, or TSOP is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low… 
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Related topics

Related topics

6 relations
Ball grid arrayChip carrierFlash memoryIntegrated circuit

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
On Improving Transition Test Set Quality to Detect CMOS Transistor Stuck-Open Faults
Detecting the defects inside the CMOS cells, especially the stuck-open faults, has gained a lot of attentions in recent years. It… 
2013
2013
Parameters optimization of copper wire bonding on thin small outline package
With significant rising of Au price, there is growing demand to implement Cu wire bonding as an alternative method for Au wire… 
2012
2012
The Orienteering Problem under Uncertainty Stochastic Programming and Robust Optimization compared
The Orienteering Problem (OP) is a generalization of the well-known traveling salesman problem and has many interesting… 
2012
2012
Improvement of Solder Joint Reliability for Thin Small Outline Package
The influence of print circuit board design on solder joint reliability(SJR) of thin small outline package(TSOP) has been… 
2012
2012
Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration
Electronics installed in automotive systems are subjected simultaneously to mechanical vibrations and thermal loads in underhood… 
2009
2009
Investigation of thin small outline package (TSOP) solder joint crack after accelerated thermal cycling testing
Solder joint crack is a common failure mode of printed circuit board assembly (PCBA) for electronic products. In order to… 
2003
2003
Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance… 
Review
2003
Review
2003
NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures
The National Electronics Manufacturing Initiative (NEMI) Lead-Free Assembly Project had the following priorities: • to down… 
2003
2003
Vibration behavior of CSP assemblies with and without underfill
The test results for numerous chip scale package assembly performed under MicrotypeBGA Consortium led by the Jet Propulsion… 
2001
2001
Stacked thin small outline package
PURPOSE: A stacked thin small outline package is provided to simplify a fabrication process of a connection pin by stacking a… 
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