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Thin Small Outline Package
Known as:
TSOP
, Thin small-outline package
Thin Small Outline Package, or TSOP is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low…
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Related topics
Related topics
6 relations
Ball grid array
Chip carrier
Flash memory
Integrated circuit
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Advances in Light Curing Adhesives and Coatings Lead to Process and Quality Benefits in Electronics Manufacturing-an INTERTRONICS white paper
P. Swanson
2017
Corpus ID: 21363885
Radiation curing of adhesives and coatings continues to make technology advances. In particular, curing with light has seen many…
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2013
2013
TSOP(Thin Small Outline Package) 열변형 개선을 위한 전산모사 분석
김상우
,
이해중
,
이효수
2013
Corpus ID: 112106472
TSOP(Thin Small Outline Package)는 가전제품, 자동차, 모바일, 데스크톱 PC등을 위한 저렴한 비용의 패키지로, 리드 프레임을 사용하는 IC패키지이다. TSOP는 BGA와 flip-chip CSP…
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2013
2013
RPM MEASUREMENT AND CALCULATIONSUSING TSOP IR RECEIVER
Ajinkya Chouthai
,
Rathin Karhu
,
S. Kulkarni
2013
Corpus ID: 55785389
This paper illustrates a new method of measurement of revolutions per minute (RPM) using TSOP IR receiver. The principle of opto…
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2011
2011
Sung Solecisms: Hip Hop as Non-Prescriptive Pedagogy.
C. Biggs
2011
Corpus ID: 59930878
Does the music idiom commonly known as rap music have educational merit? With its harshest critics lambasting it with…
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2009
2009
Thin Small Outline Package(TSOP)용 Epoxy Molding Compound(EMC)의 물성변화인자에 관한 연구
김환건
,
이은구
2009
Corpus ID: 137733146
The physical property change factors of epoxy molding compound (EMC) for thin small outline package (TSOP) according to the…
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2009
2009
Investigation on TSOP warpage mechanism and improvement method
Lei Wang
,
Zhenqing Zhao
,
Jianhui Wang
,
L. Wen
,
Qian Wang
,
Jaisung Lee
16th IEEE International Symposium on the Physical…
2009
Corpus ID: 18838197
This paper gives a detailed investigation on TSOP warpage mechanism. The influences of all the factors on warpage behavior…
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2002
2002
Interface monolithique d'interconnexion pour l'empilage de composants electroniques et procede de realisation
Francis Bourrières
,
Clement Kaiser
2002
Corpus ID: 194574091
Interface d'interconnexion (1) permettant la creation d'au moins un niveau de surface d'interconnexion additionnelle pour la…
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2001
2001
Stacked thin small outline package
고준영
,
장옥형
,
김성환
,
배규한
2001
Corpus ID: 140368446
PURPOSE: A stacked thin small outline package is provided to simplify a fabrication process of a connection pin by stacking a…
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1997
1997
An approach to solving the optimization problem under uncertainty
G. M. Ostrovsky
,
Y. Volin
,
M. M. Senyavin
International Journal of Systems Science
1997
Corpus ID: 26803067
Abstract Two problems—calculation of the feasibility test and the two-stage optimization problem (TSOP) —arise in the design of…
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1989
1989
ABSTRACT: Influence of Kerogen Isolation Methods on Petrographic and Bulk Chemical Composition of Woodford Shale Round Robin Sample: Report of the TSOP Research Committee
J. Senftle
1989
Corpus ID: 101057746