Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 225,138,304 papers from all fields of science
Search
Sign In
Create Free Account
Temperature cycling
Known as:
Temp cycle
Temperature cycling (or temperature cycle) is the process of cycling through two temperature extremes, typically at relatively high rates of change…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
4 relations
Electronic packaging
Failure
Reliability engineering
Stress testing
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Novel design approaches for multifunctional information carriers
M. Ecker
,
Thorsten Pretsch
2014
Corpus ID: 94389725
Two design approaches for multifunctional information carriers are introduced. In the first one, quick response (QR) code…
Expand
2013
2013
Equating damp heat testing with field failures of PV modules
J. Wohlgemuth
,
M. Kempe
Photovoltaic Specialists Conference
2013
Corpus ID: 24666874
Damp heat testing is an integral part of the module qualification test sequence. To develop accelerated stress tests for module…
Expand
2013
2013
A reliability-oriented design method for power electronic converters
Huai Wang
,
Dao Zhou
,
F. Blaabjerg
Applied Power Electronics Conference
2013
Corpus ID: 17223056
Reliability is a crucial performance indicator of power electronic systems in terms of availability, mission accomplishment and…
Expand
2013
2013
Thermal cycling impacts on supercapacitor performances during calendar ageing
Mohamed Ayadi
,
O. Briat
,
A. Eddahech
,
R. German
,
G. Coquery
,
J. Vinassa
Microelectronics and reliability
2013
Corpus ID: 10594122
2012
2012
Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect
Yiwei Wang
,
Seung-Hyun Chae
,
+7 authors
P. Ho
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 40180944
In this study, electromigration (EM) reliability of TSV-microbump (μ-bump) joints was investigated. Sn-based μ-bumps with three…
Expand
2011
2011
Recrystallization behavior of lead free and lead containing solder in cycling
A. Qasaimeh
,
Y. Jaradat
,
+4 authors
P. Borgesen
Electronic Components and Technology Conference
2011
Corpus ID: 23255893
The present work addresses the effects of thermomechanical history on the recrystallization behavior of lead free and backward…
Expand
2011
2011
Recent advances in harsh environment acoustic wave sensors for contemporary applications
M. Pereira da Cunha
,
R. Lad
,
+8 authors
D. McCann
IEEE Sensors. Proceedings
2011
Corpus ID: 24088170
There is a significant need for wireless sensor systems capable of operation up to 1100°C and beyond, in abrasive or corrosive…
Expand
2010
2010
Whisker mitigation measures for Sn-plated Cu for different stress tests
L. Sauter
,
A. Seekamp
,
Y. Shibata
,
Y. Kanameda
,
H. Yamashita
Microelectronics and reliability
2010
Corpus ID: 8187893
2005
2005
Investigation of Environmental Reliability of Optical Polymer Waveguides Embedded on Printed Circuit Boards
M. Immonen
,
M. Karppinen
,
J. Kivilahti
International Conference on Polymers and…
2005
Corpus ID: 5646259
2002
2002
Anisotropic conductive film flip chip joining using thin chips
Erja Jokinen
,
E. Ristolainen
Microelectronics and reliability
2002
Corpus ID: 27688071
By clicking accept or continuing to use the site, you agree to the terms outlined in our
Privacy Policy
(opens in a new tab)
,
Terms of Service
(opens in a new tab)
, and
Dataset License
(opens in a new tab)
ACCEPT & CONTINUE