Stress migration

Stress Migration is a failure mechanism that often occurs in IC metallization (aluminum, copper). Voids form as result of vacancy migration driven by… (More)
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2015
2015
This paper extends a previously published model [1] of stress induced voiding (SIV) to the case where diffusion proceeds… (More)
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2012
2012
Stress-induced voiding (SIV) at a narrow metal line connected to a wide metal plate is investigated for Cu/low-k interconnects… (More)
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2010
2010
An exemplified calculation of migration effects especially stress migration was carried out for a via structure of 90nm node… (More)
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2006
2006
Stress migration (SM) behavior in narrow lines is investigated in detail using different kinds of test patterns. The… (More)
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2006
2006
Effect of Cu capping layer processes on stress-migration (SM) is discussed in this paper. Cu cap was demonstrated to reduce the… (More)
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2005
2005
Missing tungsten (W) was observed during the stress migration (SM) test. In this paper, we apply extensive experiments on via… (More)
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2005
2005
Stress migration (SM) reliability of wide copper (Cu) interconnects with gouging vias was studied using a via chain structure… (More)
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2005
2005
Variations in the mechanical properties of copper related to plating chemistry and copper thickness are found to control stress… (More)
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2004
2004
Stress migration (SM) or stress-induced voiding (SIV) experiments were conducted for two BEoL (Back End of Line) technologies: Cu… (More)
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2004
2004
Stress migration (SM) or stress-induced voiding experiments were conducted for two back-end-of-line (BEoL) technologies: Cu/FTEOS… (More)
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