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Stress migration

Stress Migration is a failure mechanism that often occurs in IC metallization (aluminum, copper). Voids form as result of vacancy migration driven by… 
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Related topics

Related topics

3 relations
High-temperature operating lifeHot-carrier injection

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Exploration of baking temperature effects on 28 nm BEOL reliability
Review
2008
Review
2008
Simulation of Migration Effects in Solder Bumps
Due to miniaturization, the width of interconnects, as well as the dimensions of solder bumps, decreases. As a result of the… 
2007
2007
Dynamic void formation in a DD-copper-structure with different metallization geometry
2007
2007
A Detailed Qualitative Model for the Programming Physics of Silicided Polysilicon Fuses
This paper presents a detailed qualitative model for the programming physics of 90-nm silicided polysilicon fuses that is derived… 
2005
2005
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures
2005
2005
Stress migration reliability of wide Cu interconnects with gouging vias
Stress migration (SM) reliability of wide copper (Cu) interconnects with gouging vias was studied using a via chain structure… 
2005
2005
Stress migration lifetime for Cu interconnects with CoWP-only cap
Stress migration lifetime is characterized for a CoWP-only cap process (i.e., no dielectric cap) and a CoWP + SiN cap process… 
1997
1997
Stress in copper films for interconnects
1989
1989
A statistical analysis of seismicity in Italy: The clustering properties
Abstract The clustering properties of Italian seismicity are analyzed statistically on the basis of the Istituto Nazionale di… 
1989
1989
Extrametricality, The Cycle, And Turkish Word Stress
Assuming cyclic stress, Turkish supports a highly restrictive version of extrametricality. 
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