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Smart cut

Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was… Expand
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Papers overview

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2016
2016
We present the development, optimization and fabrication of high carrier mobility materials based on GeOI wafers co-doped with Sn… Expand
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2015
2015
Using packet classifier algorithms in packet processing network systems is the key idea to process packets rapidly. These… Expand
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2014
2014
Les substrats de silicium sur isolant (SOI) sont tres prometteurs pour la technologie CMOS. Un substrat SOI est notamment forme d… Expand
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2010
2010
The integration of GaAs and Si can combine the superior electrical and optical properties of GaAs with the mechanical and… Expand
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2010
2010
As layer transfer techniques have been notably improved these passed years, lithium niobate (LiNbO3) appears as a candidate for… Expand
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2009
2009
This paper presents an experimental analysis of the noise measurements performed in germanium on insulator (GeOI) 0.12 μm PMOS… Expand
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2009
2009
Piezoresistive pressure sensors based on SMART CUT® SOI wafer have been developed, which can be used in extreme high temperature… Expand
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2008
2008
In this paper, we propose a novel approach for HBAR devices using the Smart Cuttrade technology to obtain thin homogeneous X-cut… Expand
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2007
2007
La technologie Smart Cut est un procede d’elaboration de films minces et de substrats SOI base sur l’implantation ionique d’ions… Expand
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Highly Cited
2004
Highly Cited
2004
Abstract Strained silicon on insulator wafers are today envisioned as a natural and powerful enhancement to standard SOI wafers… Expand
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