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Smart cut

Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was… 
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Related topics

Related topics

4 relations
Integrated circuitSemiconductorSilicon on insulator

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Increasing the efficiency of TCAM-based packet classifiers using intelligent cut technique in geometric space
Using packet classifier algorithms in packet processing network systems is the key idea to process packets rapidly. These… 
2013
2013
Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration
The wafer stacking technology for 3D integration requires high quality bonding interfaces with uniform bonding films. Two wafer… 
2010
2010
LiNbO3 Film Bulk Acoustic Resonator
As layer transfer techniques have been notably improved these passed years, lithium niobate (LiNbO3) appears as a candidate for… 
2010
2010
Interface Morphology Investigation of Bonded p-GaAs/p-Si Wafers
The integration of GaAs and Si can combine the superior electrical and optical properties of GaAs with the mechanical and… 
2009
2009
igh temperature smart-cut SOI pressure sensor
Piezoresistive pressure sensors based on SMART CUT® SOI wafer have been developed, which can be used in extreme high temperature… 
2009
2009
From silicon direct wafer bonding to surface nano-patterning: a way to innovative substrate elaboration
Self-assembled configurations of nanostructures are expected to play an increasingly important role in devices design, as an… 
2007
2007
Etude des mécanismes de rupture du silicium induits par l'implantation ionique d'hydrogène dans le cadre de la technologie Smart Cut TM
La technologie Smart Cut est un procede d’elaboration de films minces et de substrats SOI base sur l’implantation ionique d’ions… 
2005
2005
200mm germanium-on-insulator (GeOI) by Smart Cut/spl trade/ technology and recent GeOI pMOSFETs achievements
We present our recent achievements on 200mm GeOI formation from bulk Ge wafers and the resulting device characteristics. Pseudo… 
Review
2004
Review
2004
Current status and future perspectives of wafer bonding (Smart Cut/spl trade/) SOI technology
Current status and future perspectives for SOI (silicon-on-insulator) using Smart Cut technology will be reviewed. First… 
2004
2004
Germanium-on-insulator (GeOI) structures realized by the Smart Cut/spl trade/ technology
This paper discusses on the development of germanium-on-insulator (GeOI) structures made by using the smart cut technology, in… 
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