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Smart cut
Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was…
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Related topics
Related topics
4 relations
Integrated circuit
Semiconductor
Silicon on insulator
Broader (1)
Semiconductor device fabrication
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Influence of Smart Cut™ technological steps on thickness uniformity of SOI wafers : multi-scale approach
A. Alba
,
P. Eduardo
2014
Corpus ID: 136977389
Les substrats de silicium sur isolant (SOI) sont tres prometteurs pour la technologie CMOS. Un substrat SOI est notamment forme d…
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2012
2012
Application and practice of smart cut technology
Wu Xiao-e
2012
Corpus ID: 112076264
The paper introduced the smart cut technology of 7LS8 shearer and its application in 52304 fully mechanized mining face and…
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2011
2011
Fabrication of GaAs-on-Insulator via Low Temperature Wafer Bonding and Sacrificial Etching of Ge by XeF2
Yu Bai
,
G. Cole
,
M. Bulsara
,
E. Fitzgerald
2011
Corpus ID: 45875597
Front end integration of III-V compound semiconductor devices with Si complimentary metal-oxide-semiconductor (CMOS) technology…
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2010
2010
Interface Morphology Investigation of Bonded p-GaAs/p-Si Wafers
C. Hsieh
,
Y. S. Wu
2010
Corpus ID: 137029955
The integration of GaAs and Si can combine the superior electrical and optical properties of GaAs with the mechanical and…
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2007
2007
Etude des mécanismes de rupture du silicium induits par l'implantation ionique d'hydrogène dans le cadre de la technologie Smart Cut TM
S. Personnic
2007
Corpus ID: 91788340
La technologie Smart Cut est un procede d’elaboration de films minces et de substrats SOI base sur l’implantation ionique d’ions…
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Review
2004
Review
2004
Current status and future perspectives of wafer bonding (Smart Cut/spl trade/) SOI technology
Makolo Yoshimi
,
C. Mazure
Proceedings. 7th International Conference on…
2004
Corpus ID: 14267993
Current status and future perspectives for SOI (silicon-on-insulator) using Smart Cut technology will be reviewed. First…
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Review
2003
Review
2003
Thin film transfer by Smart Cut® technology beyond SOI
C. Mazure
2003
Corpus ID: 113656671
The Smart Cute process, based on hydrogen implantation and wafer bonding, is a generic thin layer process transfer. It has…
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2003
2003
Innovative substrate solutions for wide band gap materials: The smart cut approach
F. Letertre
,
N. Daval
,
+5 authors
I. Matko
2003
Corpus ID: 115005711
Wide Band Gap (WBG) materials such as SiC and GaN are today the most attractive materials for out of silicon world applications…
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2001
2001
High Temperature Pressure Sensor Fabricated with Smart Cut SOI Materials
H. Yi
2001
Corpus ID: 112246894
The quality of low temperature bonded silicon wafers has been improved by using a modified RCA cleaning process.A slow annealing…
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2001
2001
Modeling Thermodynamics of Smart Cut Process
Han Wei
2001
Corpus ID: 98869473
A thermodynamic model of hydrogen induced silicon surface layer splitting with the help of an oxidized silicon wafer bonded is…
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