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Reflow oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB).
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8 relations
Ball grid array
Printed circuit board
Process Window Index
Reflow soldering
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Investigation of PBGA solder joint failure in reflow process
Yu Guo
,
Zhili Sun
,
Minghe Liu
,
Xiaoyu Ma
2017
Corpus ID: 59571046
In PBGA package, solder joint provides not only mechanical support, electrical conduction and thermal conduction effect, but also…
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Review
2015
Review
2015
Effective Methods to Get Volatile Compounds Out of Reflow Process
V.
,
Oosterhout
2015
Corpus ID: 106400880
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With…
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2014
2014
Electrolessly-plated ternary nickel alloys as metallization materials for lead-free soldering
Ying Yang
2014
Corpus ID: 138391407
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2013
2013
Monitoring system of reflow oven and control method thereof
曹丹
,
胡鹏飞
,
+7 authors
张翰
2013
Corpus ID: 116637057
The invention provides a monitoring system of a reflow oven. The monitoring system comprises a first sensing device, a second…
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2009
2009
Research of the Thermosolutal Natural Convection in Reflow Oven
Shu-lung Wang
,
W. Liao
,
Z. Hus
,
Ling-Xuan Hus
2009
Corpus ID: 112430006
This study attempts to simulate the phenomenon of thermosolutal natural convection in a horizontal double-opening divided square…
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2006
2006
Lead-Free Reflow Oven Parameter Optimization
M. Mira
,
James Z. Zhang
,
Aaron Ball
2006
Corpus ID: 55340426
Because of the potential danger that Lead poses to human health, Parliament of the European Union approved a law to take effect…
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2005
2005
Laboratories For The Design And Assembly Of Electronic Devices Using Surface Mount Components
G. Blackwell
2005
Corpus ID: 114807171
Purdue’s ECET department has supported surface mount technology (SMT) in its labs for over 10 years. In that time the department…
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Review
2005
Review
2005
Practical Lead-Free Implementation
C. Shea
,
B. Barton
,
J. Belmonte
,
K. Kirby
2005
Corpus ID: 111047657
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that many…
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2004
2004
Development of New Model Reflow Oven for Lead-Free Soldering
Motohiro Yamane
,
N. Orita
,
Miyazaki Koichi
,
Weiming Zhou
2004
Corpus ID: 54505163
The main issue with regard to improving the heating ability of reflow ovens is to minimize the temperature difference ∆T among…
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2004
2004
Effect of parameters of reflow oven on the Reflow Profile
Zhu Yu-he
2004
Corpus ID: 137973600
Parameters of reflow oven have distinct effect on reflow profile and its key specifications.The author adopted Taguchi method to…
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