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Reflow oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB).
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Ball grid array
Printed circuit board
Process Window Index
Reflow soldering
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Packaging technology of power module for automotive applications
Ayako Shimozuma
,
Hiromasa Hayashi
,
S. Higuchi
,
Y. Sakamoto
,
Sakie Okada
International Conference on Electronics Packaging
2017
Corpus ID: 24526077
The number of in-vehicle power devices has been increasingly for motor controlling purposes. Power device packages should ideally…
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2012
2012
Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes
M. Shu
,
B. Hsu
,
Min-Chuan Hu
Microelectronics and reliability
2012
Corpus ID: 34913753
2010
2010
Test and assessment of the heating system of reflow ovens
Yuming Wang
,
Zengwei Cui
,
Beibei Wang
11th International Conference on Electronic…
2010
Corpus ID: 23511992
As the point interconnects between printed circuit board (PCB) and chips and owning a soft constitutive material property, solder…
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2008
2008
3D mapping of forced convection efficiency in reflow ovens
B. Illés
,
G. Harsányi
2008
Corpus ID: 53459137
In this paper, the investigation of the heating efficiency in forced convection reflow ovens which apply nozzle-matrix blower…
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2007
2007
CFD Aided Reflow Oven Profiling for PCB Preheating in a Soldering Process
I. Belov
,
M. Lindgren
,
P. Leisner
,
F. Bergner
,
R. Bornoff
International Conference on Thermal, Mechanical…
2007
Corpus ID: 16431344
A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non…
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2006
2006
Thermal Simulation of the Solidification of Lead-Free Solder Interconnections
Hao Yu
,
T. Mattila
,
J. Kivilahti
IEEE transactions on components and packaging…
2006
Corpus ID: 24370218
Two thermal models of different level, a component model and an interconnection model, were established to simulate the…
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2004
2004
Development of New Model Reflow Oven for Lead-Free Soldering
Motohiro Yamane
,
N. Orita
,
Miyazaki Koichi
,
Weiming Zhou
2004
Corpus ID: 54505163
The main issue with regard to improving the heating ability of reflow ovens is to minimize the temperature difference ∆T among…
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2004
2004
Effect of parameters of reflow oven on the Reflow Profile
Zhu Yu-he
2004
Corpus ID: 137973600
Parameters of reflow oven have distinct effect on reflow profile and its key specifications.The author adopted Taguchi method to…
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2003
2003
Thermal management system for reflow oven
Bogdan Rosu
,
P. Reyes-Turcu
,
D. Simion-Zanescu
Information Security Solutions Europe
2003
Corpus ID: 109714159
The internal thermal environment of a reflow oven is a complex 3D temperature distribution. Controlling an accurate reflow…
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2002
2002
Reliability of CSP/lead free solder joints with different surface finishes and reflow profiles
D. Me
,
D. Geiger
,
M. Arra
,
D. Shangguan
,
H. Phan
27th Annual IEEE/SEMI International Electronics…
2002
Corpus ID: 25853728
The reliability of chip scale package (CSP) using lead free solder process was studied in this paper. The impact of reflow…
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