Skip to search formSkip to main contentSkip to account menu

RCA clean

Known as: RCA (disambiguation) 
The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion… 
Wikipedia (opens in a new tab)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
.......................................................................................................................................................................... v Resumé .......................................................................................................................................................................... vi Conferences ................................................................................................................................................................ vii Publications ...................................................................................................................................................... vii Other contributions ............................................................................................................................................ vii Acknowledgement .................................................................................................................................................. vii 
2011
2011
Approval: Committee Chair: Thomas W. Smith Program Director: Bruce W. Smith Dean, KGCOE: Harvey J. Palmer 
2011
2011
Graphene is regarded as a promising material that could be the basis for future generations of low-power, faster, and smaller… 
2008
2008
...................................................................................................................... iii… 
2005
2005
For cleaning silicon wafers via the RCA clean, temperature control is important for stable cleaning performance, but difficult… 
2003
2003
As feature sizes continue their frantic descent into the sub-0.6 pm region, wafer cleaning is on its way toward becoming a true… 
1994
1994
A new wafer cleaning procedure has been developed for ultra-thin thermal oxidation process (<EQ 50 angstrom). This involves a… 
1994
1994
A new wafer cleaning procedure has been developed for ultrathin thermal oxidation process (/spl les/50 /spl Aring/). It consists… 
Highly Cited
1984
Highly Cited
1984
Two types of polysilicon emitter transistors have been fabricated using identical processing except for the surface treatment…