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Multi-chip module

Known as: MCM, Module (disambiguation), Multi-chip package 
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple… 
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Papers overview

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2011
2011
Comparison of Three Modeling Methods for Identifying Unknown Magnetization of Ferromagnetic Thin Plate
This study presents three different magnetization models for identifying unknown magnetization of the ferromagnetic thin plate of… 
2006
2006
Niobium Containing Micro-, Meso- and Macroporous Silica Materials as Catalysts for the Epoxidation of Olefins with Hydrogen Peroxide
Niobia–silica mesoporous materials (xerogel, aerogel and MCM type) have been synthesized by sol–gel techniques using different co… 
2000
2000
A Comparison of Various MCM Schemes
An improved lubricant system for magnetic recording media such as helical scan video tapes is disclosed. The resulting improved… 
Highly Cited
1999
Highly Cited
1999
Preparation of mesoporous tin oxide for electrochemical applications
Mesoporous tin oxide stable up to 500 °C has been prepared for the first time using both cationic and neutral surfactants. 
1999
1999
Aluminum Silicon Carbide (AlSiC) Thermal Management Packaging For High Density Packaging Applications
High-density microelectronics require packaging materials and systems that provide superior thermal management and highly… 
1999
1999
Object-oriented thermal placement using an accurate heat model
An MCM's increased throughput and dense circuitry can easily result in failure if the board contains "hot spots". Therefore, an… 
1998
1998
MEMS and Si-micromachined components for low-power, high-frequency communications systems
The next leap beyond the state of the art in multichip module (MCM) for communications systems is the development of a technology… 
1995
1995
Performance driven spacing algorithms using attractive and repulsive constraints for submicron LSI's
This paper proposes one-dimensional spacing algorithms that minimize [maximize] the degree of separation [proximity] among the… 
1994
1994
A design technique for a 60 GHz-bandwidth distributed baseband amplifier IC module
A DC-60 GHz, 9 dB distributed amplifier IC module is fabricated with 0.15 /spl mu/m InAlAs-InGaAs low-noise HEMTs with 155 GHz f… 
1994
1994
Keeping Workflow Models as Simple as Possible
Workflow Management Systems are composed of two basic components: the Workflow Model and the Workflow Execution Module. The…