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Multi-chip module

Known as: MCM, Module (disambiguation), Multi-chip package 
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2010
Highly Cited
2010
Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems
Accurate modeling of transmission lines becomes increasingly important in high-speed interconnect system design. However, it is… 
Highly Cited
1999
Highly Cited
1999
Preparation of mesoporous tin oxide for electrochemical applications
Mesoporous tin oxide stable up to 500 °C has been prepared for the first time using both cationic and neutral surfactants. 
Highly Cited
1995
Highly Cited
1995
Modeling and analysis of multichip module power supply planes
A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed. It is… 
Highly Cited
1995
Highly Cited
1995
A practical current sensing technique for IDDQ testing
In this paper, a practical design for built-in current sensors (BICS's) is proposed. This scheme can execute current testing… 
Highly Cited
1995
Highly Cited
1995
Time-limited orthogonal multicarrier modulation schemes
Time-limited orthogonal (TLO) multicarrier modulation (MCM) schemes with waveform shaping are investigated. The waveform shaped… 
1995
1995
Multi-chip module technology
Multi-Chip Modules (MCMs) are typically composed of complex devices mounted into single dense packages. Most MCMs today are used… 
1994
1994
A design technique for a 60 GHz-bandwidth distributed baseband amplifier IC module
A DC-60 GHz, 9 dB distributed amplifier IC module is fabricated with 0.15 /spl mu/m InAlAs-InGaAs low-noise HEMTs with 155 GHz f… 
Highly Cited
1993
Highly Cited
1993
A direct combination of the Prim and Dijkstra constructions for improved performance-driven global routing
Motivated by analysis of distributed RC delay in routing trees, a new tree construction is proposed for performance-driven global… 
Highly Cited
1992
Highly Cited
1992
Wiring And Crosstalk Avoidance In Multi-chip Module Design
Wiring and Crosstalk Avoidance in Multi-Chip Module Design Howard H. Chen and C. K. Wong IBM Research Division Thomas J. Watson… 
Highly Cited
1982
Highly Cited
1982
The thin-film module as a high-performance semiconductor package
This paper discusses a multichip module for future VLSI computer packages on which an array of silicon chips is directly attached… 
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