Microvia

Known as: Micro via, Micro-via 
Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

1998-2018
05101519982018

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the… (More)
  • figure 1
  • figure 2
  • figure 6
  • figure 7
  • table 2
Is this relevant?
2011
2011
High density interconnect (HDI) flip-chip ball grid arrays (FCBGA) substrate becoming more and more popular for high end… (More)
Is this relevant?
2009
2009
Taylor & Francis makes every effort to ensure the accuracy of all the information (the “Content”) contained in the publications… (More)
  • figure 1
  • figure 3
  • figure 5
  • table 1
  • figure 4
Is this relevant?
2009
2009
An ultra-thin, flexible package was successfully demonstrated in this paper. The integration of semiconductor chip and flexible… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2008
2008
As higher and higher pin-count semiconductor packages are deployed in telecommunications and data processing applications… (More)
  • figure 2
  • figure 3
  • figure 6
  • figure 8
  • figure 12
Is this relevant?
2007
2007
A control law for microvia fill process optimization is proposed in this paper. The law enables linear growth of either microvia… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 6
  • figure 4
Is this relevant?
2007
2007
This paper introduced a new method to investigate the fracture dynamic response of the PCB materials. Ball impact is used to… (More)
  • figure 1
  • table 1
  • figure 2
  • figure 3
  • figure 4
Is this relevant?
Review
2007
Review
2007
As high-performance, compact semiconductor devices approach physical limitations on the number of input and output pins, board… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2001
2001
This paper presents ongoing work on an advanced flexible circuit interconnect substrate featuring a 24 x 24 (576 element) pad… (More)
  • figure 1
  • figure 3
  • figure 4
  • figure 2
  • figure 6
Is this relevant?
1998
1998
The development of high density circuitry has promoted the introduction of the microvia technology which relies on organic… (More)
  • figure 1
  • figure 2
  • figure 5
  • figure 5
Is this relevant?