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Microvia
Known as:
Micro via
, Micro-via
Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate…
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Related topics
Related topics
4 relations
Broader (1)
Electronic engineering
Input/output
Printed circuit board
Via (electronics)
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Predicting the Lifetime of the PCB-From Experiment to Simulation
P. Fuchs
,
Pccl Leoben
2012
Corpus ID: 20985440
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material…
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Review
2007
Review
2007
Development of a novel high performance electrolyte supported solid oxide fuel cell
P. Gentile
2007
Corpus ID: 92511625
High power solid oxide fuel cell (SOFC) stacks are based on the planar design concept to yield high specific power densities. The…
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2006
2006
Magnetron Sputtering Technology for Microvias Metallization
J. Borecki
,
J. Felba
,
W. Posadowski
,
K. Wojtalik
2006
Corpus ID: 15786436
The increased demand of miniaturized and much more functional electronic devices inspire producers of PCBs (Printed Circuit…
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2005
2005
UV Laser Solutions for Electronic Interconnect and Packaging
Weisheng Lei
,
S. Raman
,
C. Chow
International Conference on Electronic Packaging…
2005
Corpus ID: 30320678
A UV laser can machine a wide variety of circuit board materials and the UV laser beam can be finely focused to generate very…
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2002
2002
The electroplating method of micro via hole for the use of multiple layers printed circuit board using step current density
선우정호
,
박정권
,
이우섭
,
이희용
2002
Corpus ID: 117147032
PURPOSE: A method for electroplating a micro via hole for multi-layered PCB(Printed Circuit Board) using step current density is…
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2001
2001
Microvia formation in PCBs : Optoelectronics World: Microachining
M. Kauf
,
H. Martinez
2001
Corpus ID: 114277192
Laser via formation is most economical for large-scale production of microvias of 150 uM and below.
2000
2000
Advanced multilayer polyimide substrate utilizing UV laser microvia technology
S. Corbett
,
J. Strole
,
B. Ross
,
P. Jordan
,
J. Ketterl
,
T. Hughes
2000
Corpus ID: 16093430
This paper presents ongoing work on an advanced flexible circuit interconnect substrate featuring a 24 x 24 (576 element) pad…
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2000
2000
Accelerated thermal and mechanical testing of CSP assemblies
R. Ghaffarian
2000
Corpus ID: 55734187
Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products…
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Review
1999
Review
1999
CSP Reliability for Single-and Double-Sided Assemblies
R. Ghaffarian
1999
Corpus ID: 107137164
This paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).
1998
1998
Finer micro-via PWB by laser and additive process
R. Maniwa
1998
Corpus ID: 109574805
We have recently developed the high density and high reliability performance printed wiring board (PWB), named DV-MULTI' and μ V…
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