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Microvia

Known as: Micro via, Micro-via 
Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate… 
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Related topics

Related topics

4 relations

Broader (1)

Electronic engineering
Input/outputPrinted circuit boardVia (electronics)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Methods and designs for improving the signal integrity of vertical interconnects in high performance
Design of high performance package interconnects using full-wave electromagnetic solvers is necessary due to increased operation… 
2012
2012
Novel Chip-Last Method for Embedded Actives in Organic Packaging Substrates
Embedded actives are to bury thinned active chips into package substrates, as opposed to surface mounted devices (SMDs), which… 
2010
2010
Copper electroplating for HDI and IC substrate through hole fill
Established methods for filling through holes in core layers of HDI and IC substrates are labor intensive, multistep processes… 
2008
2008
An ALE Model for Prediction and Control of the Microvia Fill Process with Two Additives
A computational model for examining the microvia fill process as encountered in the multilayered printed circuit board industry… 
2006
2006
DC-50 GHz Low Loss Thermally Enhanced Low Cost LCP Package Process Utilizing Micro Via Technology
This paper describes the design, simulation and measurements of a novel 5times5mm2 surface mount liquid crystal polymer (LCP… 
Highly Cited
2006
Highly Cited
2006
Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions
Failure modes and mechanisms under mechanical shock loading were studied by employing the statistical and fractographic research… 
2006
2006
MCM LGA package with optical I/O passively aligned to dual layer polymer waveguides in PCB
Over the past 30 years, IBM has provided leadership in high density I/O density and count interconnects at both chip and package… 
Review
2004
Review
2004
Vibration and thermo-mechanical durability assessments in advanced electronic package interconnects
The objective of this article is to overview the applications of vibration and thermo-mechanical analyses in advanced electronic… 
2002
2002
CSP and BGA assembly reliability in a fast ramp rate thermal cycle environment
Inspection results along with SEM and optical cross-sectional photos revealing damage and failure mechanisms will also be… 
1996
1996
High Speed Laser Ablation of Microbial Holes in Non‐woven Aramid Reinforced Printed Wiring Boards to Reduce Cost
Emerging ‘chip‐size’ packages, and bare flip‐chips, require new substrate properties if high lead count chips are to be reliably… 
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