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Microvia

Known as: Micro via, Micro-via 
Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate… Expand
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Papers overview

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2014
2014
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand… Expand
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2012
2012
Embedded actives are to bury thinned active chips into package substrates, as opposed to surface mounted devices (SMDs), which… Expand
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2011
2011
Design of high performance package interconnects using full-wave electromagnetic solvers is necessary due to increased operation… Expand
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2008
2008
Cracking of the laminate under the solder connect pads, known as pad craters, is a reliability issue related to mechanical… Expand
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2008
2008
A computational model for examining the microvia fill process as encountered in the multilayered printed circuit board industry… Expand
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2006
2006
Failure modes and mechanisms under mechanical shock loading were studied by employing the statistical and fractographic research… Expand
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2006
2006
Advances in screen printing and photoimageable paste technologies have allowed low-temperature cofired ceramic (LTCC) circuit… Expand
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2006
2006
Over the past 30 years, IBM has provided leadership in high density I/O density and count interconnects at both chip and package… Expand
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2005
2005
Influences of forced convection during acid copper electroplating on microvia fill of printed circuit boards were studied. The… Expand
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2000
2000
This paper presents ongoing work on an advanced flexible circuit interconnect substrate featuring a 24 x 24 (576 element) pad… Expand
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