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Isotropic etching

Known as: Etching (isotropic), Etching (plasma) 
Isotropic etching (e.g. wet etching or chemical etching) is a method commonly used in semi-conductor technology to remove material from a substrate… 
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Related topics

Related topics

3 relations
Dry etchingEtching (microfabrication)Reactive-ion etching

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Newly developed low cost, reliable wafer level hermetic sealing using Cu/Sn system
Wafer level hermetic sealing using Cu/Sn system was studied in this paper. On 8 inch wafer, seal rings with the width of 300 µm… 
2009
2009
High resolution TEM and triple-axis XRD investigation into porous silicon formed on highly conducting substrates
2005
2005
Self-formation of GaN hollow nanocolumns by inductively coupled plasma etching
GaN hollow nanocolumns were formed by inductively coupled plasma etching. It was found that the tops of the GaN nanocolumns were… 
Highly Cited
2003
Highly Cited
2003
Luminescence of GaN nanocolumns obtained by photon-assisted anodic etching
GaN nanocolumns with transverse dimensions of about 50 nm were obtained by illumination-assisted anodic etching of epilayers… 
2002
2002
Morphology and Effects of Hydrogen Etching of Porous SiC
The morphology of the porous network in porous SiC has been studied. It has been found that pore formation starts with a few… 
1999
1999
An 0.03 μm gate-length enhancement-mode InAlAs/InGaAs/InP MODFET's with 300 GHz f/sub T/ and 2 S/mm extrinsic transconductance
We have developed high-performance enhancement-mode InP-based modulation-doped field-effect transistors with 0.03 /spl mu/m gate… 
1996
1996
Surface modification of fibre and polymeric materials by discharge treatment and its application to textile processing
The effect of discharge treatments such as low-temperanire plasma treatment, atmospheric lowtemperature plasma treatment and… 
Review
1987
Review
1987
PANDA2: Program for Minimum Weight Design of Stiffened, Composite, Locally Buckled Panels
Highly Cited
1980
Highly Cited
1980
Fabrication Process for Josephson Integrated Circuits
A process for fabricating experimental Josephson integrated circuits is described that is based primarily on the use of vacuum… 
1972
1972
Sputter-Etching of Heterogeneous Surfaces
In conventional sputter etching, heterogeneous surfaces are eroded at generally unpredictable rates. The reasons for this are… 
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