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Interposer
An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection…
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Related topics
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15 relations
Athlon
Ball grid array
Chip-scale package
Die (integrated circuit)
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Verification and Test
J. Henkel
IEEE design & test
2017
Corpus ID: 35522098
This issue is focused on the special issue on “Emerging Challenges and Solutions in SoC Verification” from Guest Editors Magdy…
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2017
2017
Co-Design for Low Warpage and High Reliability in Advanced Package with TSV-Free Interposer (TFI)
F. Che
,
M. Kawano
,
M. Ding
,
Y. Han
,
S. Bhattacharya
Electronic Components and Technology Conference
2017
Corpus ID: 32908650
TSV-Free Interposer (TFI) technology eliminates TSV fabrication and reduces manufacturing and material cost. Co-design modelling…
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2014
2014
Demonstration of 25-Gbps optical data links on silicon optical interposer using FPGA transceiver
D. Okamoto
,
Y. Urino
,
+30 authors
Y. Arakawa
European Conference on Optical Communication
2014
Corpus ID: 7762323
We demonstrated a 25-Gbps error-free data link on a silicon optical interposer. The experimental results verified that our…
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2013
2013
On the potential of 3D integration of inductive DC-DC converter for high-performance power delivery
S. Carlo
,
W. Yueh
,
S. Mukhopadhyay
Design Automation Conference
2013
Corpus ID: 10505942
This paper studies the potential and challenges of integrating an inductor based DC-DC converter based voltage regulator module…
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2013
2013
Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging
G. Pares
,
C. Karoui
,
+9 authors
G. Simon
IEEE 63rd Electronic Components and Technology…
2013
Corpus ID: 8093430
This work aims at answering to the 3D mega trend of silicon based platform and 3D wafer level packaging (3D-WLSiP). We focus on…
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2012
2012
Cost modeling and analysis for interposer-based three-dimensional IC
Ying-Wen Chou
,
Po-Yuan Chen
,
Mincent Lee
,
Cheng-Wen Wu
IEEE VLSI Test Symposium
2012
Corpus ID: 8868648
Three-dimensional (3D) integration has recently become a popular technology for integrated circuits (IC). 3D IC with the passive…
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Review
2011
Review
2011
3D technology roadmap and status
P. Marchal
,
G. van der Plas
,
+16 authors
R. Cartuyvels
IEEE International Interconnect Technology…
2011
Corpus ID: 35613744
The semiconductor industry is witnessing a major shift towards heterogeneous 3D integration. Whether companies are active in high…
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2011
2011
Design, Construction and Test of Cryogen-Free HTS Coil Structure
H. Hocker
,
M. Anerella
,
+4 authors
Y. Shiroyanagi
2011
Corpus ID: 55156926
This paper will describe design, construction and test results of a cryo-mechanical structure to study coils made with the second…
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2005
2005
Ultra-High-Speed Signal Propagation of High-Density Wiring Interposer for 3D Packaging
K. Kikuchi
,
H. Nakagawa
,
K. Tokoro
,
M. Aoyagi
,
S. Segawa
Proceedings Electronic Components and Technology…
2005
Corpus ID: 28286044
We have demonstrated a high-density wiring interposer for 10 GHz 3D LSI packaging using a photosensitive multiblock copolymerized…
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1999
1999
Chip Scale Package Implementation Issues
R. Ghaffarian
1999
Corpus ID: 56278850
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
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