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Interposer

An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection… 
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Related topics

Related topics

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AthlonBall grid arrayChip-scale packageDie (integrated circuit)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
PCB embedded power package with reinforced top-side chip contacts
This paper presents a novel approach to embed power semiconductor devices into a printed circuit board. Here, IGBTs and diodes… 
2016
2016
Accurate Field-Circuit Hybrid Modeling of High-Density Through Glass Via Arrays by Using Perfect Magnetic Conductors and Cylindrical Mode Expansion
In this paper, an accurate wideband modeling approach based on a cylindrical mode expansion of electromagnetic filed around… 
2014
2014
A Micromachined Wiring Board With Integrated Microinductor for Chip-Scale Power Conversion
This paper presents a multilayer wiring board that integrates a copper air-core microinductor to enable a highly compact, chip… 
2013
2013
Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package… 
2013
2013
High frequency DC-DC converter with co-packaged planar inductor and power IC
The paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency… 
2013
2013
3D Integration technologies using self-assembly and electrostatic temporary multichip bonding
We developed a new chip-to-wafer 3D integration technology using self-assembly and electrostatic (SAE) bonding. High-throughput… 
Review
2012
Review
2012
Application of coreless substrate to package on package architectures
The high performance application processors found in today's hand held wireless and mobile computing products, such as smart… 
2011
2011
3D TSV mid-end processes and assembly/packaging technology
Increasing demand for new and more advanced electronic products with a smaller form factor, superior functionality and… 
2011
2011
Passive Equalizer Design for Through Silicon Vias With Perfect Compensation
This paper proposes a novel passive equalizer which is composed of a parallel resistance-capacitance (RC) circuit and capable of… 
2010
2010
I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC
In today's integrated circuits, power consumption has become the most important factor, and must be seriously investigated among… 
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