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Interposer

An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection… 
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Related topics

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AthlonBall grid arrayChip-scale packageDie (integrated circuit)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
PCB embedded power package with reinforced top-side chip contacts
This paper presents a novel approach to embed power semiconductor devices into a printed circuit board. Here, IGBTs and diodes… 
2013
2013
Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package… 
2013
2013
High frequency DC-DC converter with co-packaged planar inductor and power IC
The paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency… 
Review
2012
Review
2012
Application of coreless substrate to package on package architectures
The high performance application processors found in today's hand held wireless and mobile computing products, such as smart… 
2011
2011
Passive Equalizer Design for Through Silicon Vias With Perfect Compensation
This paper proposes a novel passive equalizer which is composed of a parallel resistance-capacitance (RC) circuit and capable of… 
2010
2010
Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration
Emerging 3-D multistrata system integration offers the capability for high density interstratum interconnects that have short… 
Highly Cited
2010
Highly Cited
2010
Studies on electrical performance and thermal stress of a silicon interposer with TSVs
The silicon interposer had been desired to have high Imput/Output (I/O) counts and fine wirings such as the global wiring of… 
2010
2010
Thermal characteristics of multi-die, three-dimensional integrated circuits with unequally sized die
  • A. Jain
  • 12th IEEE Intersociety Conference on Thermal and…
  • 2010
  • Corpus ID: 23222377
Three-dimensional integrated circuits (3D ICs) technology involves significant thermal management challenges due to the overlap… 
Highly Cited
2009
Highly Cited
2009
TSV interposer fabrication for 3D IC packaging
In this paper, Through silicon via (TSV) based interposer fabrication processes for 3D stack packaging has been presented. An… 
2008
2008
Development of 3-D Stack Package Using Silicon Interposer for High-Power Application
Stacking of many functional chips in a 3-D stack package leads to high heat dissipation. Therefore, a new platform technology is… 
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