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Furnace anneal

Furnace annealing is a process used in semiconductor device fabrication which consist of heating multiple semiconductor wafers in order to affect… Expand
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Papers overview

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2014
2014
Channel hot-carrier (CHC) reliability in p-FinFET devices is studied related to the postdeposition anneal (PDA) process. Clearly… Expand
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2013
2013
In this paper, we present a new post-CMOS-compatible piezoelectric thin/thick film technology that allows wafer-level integration… Expand
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2012
2012
Abstract The electric properties of ITO thin film after UV or IR laser annealing and wet etching was analyzed via grazing… Expand
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2012
2012
Efficient lithium-ion batteries will play an important role within the development of future mobile and stationary applications… Expand
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2001
2001
Abstract Crack free Pb(Zr x Ti 1− x )O 3 ( x =0.45) films with various thicknesses were prepared by a sol–gel multiple coating… Expand
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2000
2000
MOSCAPs and MOSFETs of a single-layer thin HfO/sub 2/ gate dielectric with n+ polysilicon gate were fabricated and characterized… Expand
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1997
1997
Ultrathin gate dielectrics are important to realize high performance and low-voltage operation CMOS devices. An advanced… Expand
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1996
1996
Nineteen-nm depth ultra shallow and 1.7 k/spl Omega//sq. low resistive junctions were fabricated by Sb implantation. The… Expand
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1990
1990
Notch ductility, fracture toughness and tensile property trends of two high copper content, submerged arc welds with 288{degree}C… Expand
1984
1984
The behaviour of ion-implanted arsenic in 〈100〉-oriented silicon single crystals exposed to continuous incoherent light from a… Expand
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