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Electromigration
Known as:
Electron wind
, EM
, Migration
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Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between…
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Related topics
Related topics
32 relations
Antifuse
Black's equation
Central processing unit
Copper interconnect
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2011
Highly Cited
2011
Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers
Y. Au
,
Youbo Lin
,
R. Gordon
2011
Corpus ID: 44673084
We present a process for the void-free filling of sub-100 nm trenches with copper or copper-manganese alloy by chemical vapor…
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2007
2007
Ultrafast Temperature Profile Calculation in Ic Chips
T. Kemper
,
Y. Zhang
,
Z. Bian
,
A. Shakouri
2007
Corpus ID: 16115386
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity…
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Highly Cited
2006
Highly Cited
2006
Thermally Activated Variable Attenuation of Long-Range Surface Plasmon-Polariton Waves
G. Gagnon
,
N. Lahoud
,
G. Mattiussi
,
P. Berini
Journal of Lightwave Technology
2006
Corpus ID: 34288476
A thermally activated variable attenuator for long-range (low-loss) surface plasmon-polariton (LRSPP) waves is discussed in this…
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2004
2004
A numerical model of stress driven grain boundary diffusion
J. Sethian
,
J. Wilkening
2004
Corpus ID: 29462689
2004
2004
Packaging of copper/low-k IC devices: a novel direct fine pitch gold wirebond ball interconnects onto copper/low-k terminal pads
S. Chungpaiboonpatana
,
F. Shi
IEEE Transactions on Advanced Packaging
2004
Corpus ID: 22635778
The trend toward finer pitch and higher performance devices has driven the semiconductor industry to incorporate copper and low-k…
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Highly Cited
2003
Highly Cited
2003
On the thermal stability of metal particles supported on a thin alumina film
M. Heemeier
,
S. Stempel
,
+5 authors
H. Freund
2003
Corpus ID: 59130033
1999
1999
Conductive filament formation failure in a printed circuit board
K. Rogers
,
C. Hillman
,
M. Pecht
,
Suzanne Nachbor
1999
Corpus ID: 110528676
A defective printed circuit board assembly that exhibited excessive current leakage was examined to determine the responsible…
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1997
1997
In situ monitoring of the surface reconstructions on InP(001) prepared by molecular beam epitaxy
K. Ozanyan
,
P. Parbrook
,
M. Hopkinson
,
C. Whitehouse
,
Z. Sobiesierski
,
D. Westwood
1997
Corpus ID: 122325424
Reflection anisotropy spectroscopy (RAS) and reflection high-energy electron diffraction (RHEED) were applied to study clean InP…
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Highly Cited
1994
Highly Cited
1994
Electromigration and electronic device degradation
A. Christou
1994
Corpus ID: 109625447
Reliability and Electromigration Degradation of GaAs Microwave Monolithic Integrated Circuits (A. Christou). Simulation and…
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Highly Cited
1993
Highly Cited
1993
Electromigration characteristics of copper interconnects
Jiang Tao
,
Nathan W. Cheung
,
Chenming Hu
IEEE Electron Device Letters
1993
Corpus ID: 45925851
The electromigration characteristics of electroless plated copper interconnects have been investigated under DC and time-varying…
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