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Electromigration

Known as: Electron wind, EM, Migration 
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between… 
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Related topics

Related topics

32 relations
AntifuseBlack's equationCentral processing unitCopper interconnect

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2011
Highly Cited
2011
Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers
We present a process for the void-free filling of sub-100 nm trenches with copper or copper-manganese alloy by chemical vapor… 
2007
2007
IBM POWER6 microprocessor physical design and design methodology
The IBM POWER6™ microprocessor is a 790 million-transistor chip that runs at a clock frequency of greater than 4 GHz. The… 
Highly Cited
2006
Highly Cited
2006
Thermally Activated Variable Attenuation of Long-Range Surface Plasmon-Polariton Waves
A thermally activated variable attenuator for long-range (low-loss) surface plasmon-polariton (LRSPP) waves is discussed in this… 
2005
2005
Electric current effect on microstructure of ball grid array solder joint
Review
2004
Review
2004
Reliability issues for flip-chip packages
2004
2004
A numerical model of stress driven grain boundary diffusion
Highly Cited
2003
Highly Cited
2003
On the thermal stability of metal particles supported on a thin alumina film
1997
1997
In situ monitoring of the surface reconstructions on InP(001) prepared by molecular beam epitaxy
Reflection anisotropy spectroscopy (RAS) and reflection high-energy electron diffraction (RHEED) were applied to study clean InP… 
Highly Cited
1994
Highly Cited
1994
Electromigration and electronic device degradation
Reliability and Electromigration Degradation of GaAs Microwave Monolithic Integrated Circuits (A. Christou). Simulation and… 
Highly Cited
1993
Highly Cited
1993
Electromigration characteristics of copper interconnects
The electromigration characteristics of electroless plated copper interconnects have been investigated under DC and time-varying… 
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