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BCB protein, Arabidopsis

Known as: blue copper-binding protein, Arabidopsis 
 
National Institutes of Health

Topic mentions per year

Topic mentions per year

1997-2015
01219972015

Related topics

Related topics

2 relations

Broader (2)

Arabidopsis ProteinsCarrier Proteins

Related mentions per year

Related mentions per year

1942-2018
19401960198020002020
BCB protein, Arabidopsis
Carrier Proteins
Arabidopsis Proteins

Papers overview

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2016
2016
Ambipolar transport in solution-deposited pentacene transistors enhanced by molecular engineering of device contacts
We report ambipolar transport in bottom gold contact, pentacene field-effect transistors (FETs) fabricated by spin-coating and… (More)
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2016
2016
Vertical-Cavity Surface-Emitting Lasers: Large Signal Dynamics and Silicon Photonics Integration
The GaAs-based vertical-cavity surface-emitting laser (VCSEL) is the standard light source in today’s optical interconnects, due… (More)
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2015
2015
High-responsivity InGaAs/InP photodetectors integrated on silicon-on-insulator waveguide circuits
This paper presents a high responsivity InGaAs / InP PIN photodetector bonded on silicon-on-insulator (SOI) waveguide circuit… (More)
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2013
2013
Silicon-on-insulator spectrometers with integrated GaInAsSb photodiodes for wide-band spectroscopy from 1510 to 2300 nm.
We present a silicon-on-insulator (SOI) based spectrometer platform for a wide operational wavelength range. Both planar concave… (More)
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2011
2011
1310-nm Hybrid III–V/Si Fabry–Pérot Laser Based on Adhesive Bonding
An evanescently coupled, hybrid III-V/Silicon Fabry-Pérot laser based on adhesive divinyl siloxane-benzocyclobutene (DVS-BCB… (More)
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2010
2010
Influence of transposition and insertion of additional binding domain on expression and characteristics of xylanase C of Clostridium thermocellum.
Clostridium thermocellum encodes a xylanase gene (xynC) which is the major component of its cellulosome. XynC is a multidomain… (More)
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2008
2008
Bonding interfaces in wafer-level metal/adhesive bonded 3D integration
This paper examines the bonding interfaces in a back-end- of-line (BEOL) compatible wafer-level three-dimensional (3D) integrated… (More)
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Highly Cited
2006
Highly Cited
2006
Laser emission and photodetection in an InP/InGaAsP layer integrated on and coupled to a Silicon-on-Insulator waveguide circuit.
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator waveguide circuit was observed… (More)
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2006
2006
BCB (Benzocylcobutene) process integration for the RF passive device
For the on-chip antenna (OCA) application, the authors successful integrate the radio frequency (RF) component (inductor) by the… (More)
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1997
1997
Spin-cast planarization of liquid-crystal-on-silicon microdisplays.
A simplified method for planarizing liquid-crystal-on-silicon (LCOS) backplanes is presented. The method relies on the… (More)
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