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BCB protein, Arabidopsis

Known as: blue copper-binding protein, Arabidopsis 
 
National Institutes of Health

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2 relations

Broader (2)

Arabidopsis ProteinsCarrier Proteins

Papers overview

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2016
2016
Self-aligned BCB planarization method for high-frequency signal injection in a VCSEL with an integrated modulator
The huge increase of datacom capacities requires lasers sources with more and more bandwidth performances. Vertical-Cavity… Expand
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2015
2015
Vertical integration of memristors onto foundry CMOS dies using wafer-scale integration
As Moore's law scaling approaches its physical limit, there is increased interest in memristors as a replacement to transistors… Expand
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Highly Cited
2013
Highly Cited
2013
Ultra thin DVS-BCB adhesive bonding of III-V wafers dies and multiple dies to a patterned silicon-on-insulator substrate
Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerged as one… Expand
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2012
2012
TERAHERTZ INTERFEROMETER FOR INTEGRATED GOUBAU-LINE WAVEGUIDES
An integrated Terahertz Mach-Zehnder interferometer is presented in order to perform difierential measurements in a chip. Both… Expand
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2012
2012
Multiple die-to-wafer adhesive bonding for heterogeneous integration
A new process for bonding of III-V dies to processed silicon-on-insulator waveguide circuits using divynilsiloxane… Expand
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2007
2007
Surface modification with cross-linked random copolymers: Minimum effective thickness
Ultrathin films of benzocyclobutene (BCB)-functionalized random copolymer with styrene and methyl methacrylate, P(S-r-BCB-r-MMA… Expand
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Highly Cited
2006
Highly Cited
2006
Laser emission and photodetection in an InP/InGaAsP layer integrated on and coupled to a Silicon-on-Insulator waveguide circuit.
Laser emission from an InP/InGaAsP thin film epitaxial layer bonded to a Silicon-on-Insulator waveguide circuit was observed… Expand
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2005
2005
Magnetic nanocomposites for organic compatible miniaturized antennas and inductors
Current wireless systems are limited by RF technologies in their size, communication range, efficiency and cost. RF circuits are… Expand
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2005
2005
Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies
This paper reports on the development and optimization of 0/1-level packaged coplanar waveguide (CPW) lines and radio-frequency… Expand
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2005
2005
High-speed 850 nm AlGaAs/GaAs vertical cavity surface emitting laser with low parasitic capacitance fabricated using BCB planarization technique
12.5 Gbps operation of low-k benzocyclobutene (BCB)-planarized 850 nm AIGaAs-based VCSEL is presented. The chip capacitance is 70… Expand
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