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Advanced silicon etching

Known as: ASE, Advanced Silicon Etch 
Advanced silicon etching (ASE) is a deep reactive ion etching (DRIE) technique to rapidly etch deep and high aspect ratio structures in silicon.ASE… 
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Papers overview

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2016
2016
We introduce a state-of-the-art self-aligned contact (SAC) process and patterning process developed by new patterning technology… 
2015
2015
This paper analyzes the impact of the interconnect variation at the system level in terms of clock frequency based on a fast and… 
Highly Cited
2011
Highly Cited
2011
A spacer-type self-aligned double pattering (SADP) is a pitch-splitting sidewall image method that is a major option for sub-30nm… 
2009
2009
Delays in readiness of next generation lithography (NGL) suggest the use of existing methods to enable the production of key… 
Highly Cited
2007
Highly Cited
2007
Abstract This paper describes experiments in which mechanisms of crystal growth are inferred from the surface nanotopography of… 
2006
2006
In this letter, the authors introduce a novel self-aligned etch-stopper sidewall-contact hydrogenated amorphous silicon (a-Si : H… 
Highly Cited
2003
Highly Cited
2003
In ICP-RIE process, there have been many investigations on etching rate. However, only few published reports mentioned the… 
1998
1998
A high performance silicon dry etch process (STS Advanced Silicon Etch ASE) which in many cases is a beneficial replacement for… 
1994
1994
This research was designed to ascertain which CO2 laser exposure parameters result in consistent etching of enamel. Fourteen non… 
1989
1989
The effect of fluid flow, transport, and reaction on the shape evolution of two‐dimensional cavities during wet chemical etching…