Wafering

Wafering is the process by which a silicon crystal (boule) is made into wafers. This process is usually carried out by a multi wire saw which cuts… (More)
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Topic mentions per year

Topic mentions per year

1986-2016
024619862016

Papers overview

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2017
2017
Numerous research workers in industrial and educational institutions throughout the world have investigated the process of wafer… (More)
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2015
2015
The deteriorated area of the multicrystalline silicon (mc-Si) ingots grown by directional solidification, commonly known as the… (More)
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2014
2014
The SLIM-cut technique provides a way to obtain thin silicon foils without a standard sawing step, thus avoiding kerf losses… (More)
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2012
2012
A new technique for the laser wafering of semiconductors is presented using sub surface laser engraving. In the laser wafering… (More)
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Review
2012
Review
2012
Silicon substrates form the foundation of modern microelectronics. Whereas the first 50 years of silicon wafer technology were… (More)
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2010
2010
More than 90% of commercial solar cells are produced using mono- and poly-crystalline silicon, with estimated about 15,000 MT of… (More)
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Review
2010
Review
2010
Eliminating high absorber material loss while allowing thin and ultra-thin crystalline silicon PV has been a “Holy Grail” of the… (More)
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2009
2009
A novel ion beam-induced cleaving process for slicing c-Si wafers ranging in thickness from 20µm to 150µm with near zero kerf… (More)
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2009
2009
Wafers for the PV industry are mainly sawn with a multi-wire slurry saw. This process is slow (it takes almost half a day to… (More)
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2008
2008
We present a new wafering method for the production of ultra-thin crystalline silicon. This new lift-off process, named SLIM-cut… (More)
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