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Wafering

Wafering is the process by which a silicon crystal (boule) is made into wafers. This process is usually carried out by a multi wire saw which cuts… Expand
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Papers overview

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2012
2012
A new technique for the laser wafering of semiconductors is presented using sub surface laser engraving. In the laser wafering… Expand
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2010
2010
The 'Stress induced LIft-off Method' (SLiM-Cut) is a kerf-free method for thin silicon fabrication, being developed at imec for… Expand
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2009
2009
A novel ion beam-induced cleaving process for slicing c-Si wafers ranging in thickness from 20µm to 150µm with near zero kerf… Expand
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2009
2009
Wafers for the PV industry are mainly sawn with a multi-wire slurry saw. This process is slow (it takes almost half a day to… Expand
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2009
2009
The toxicology of gallium arsenide is well established; it is classified by the state of California as a known carcinogen… Expand
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2008
2008
The focus of the photovoltaic industry is a continuous reduction of the cost of solar energy. Lowering the wafer thickness during… Expand
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2004
2004
In this work is presented a study on the surface microdomain formation in quasi-SLN Z-cut 3" crystals, with an accurate control… Expand
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Highly Cited
1999
Highly Cited
1999
Silicon wafers are used for production of most microchips. Various processes are needed to transfer a silicon crystal ingot into… Expand
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1993
1993
The design of a new aeroservoelastic wing configuration is detailed. The design uses a torque plate mounted within an aerodynamic… Expand
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1969
1969
Numerous research workers in industrial and educational institutions throughout the world have investigated the process of wafer… Expand
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