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Thermal profiling
Known as:
Thermal profile
A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow…
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8 relations
Kapton
Printed circuit board
Process Window Index
Reflow oven
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
High Thermal Conductivity Structured Carriers for Catalytic Processes Intensification
V. Palma
,
Domenico Pisano
,
M. Martino
,
A. Ricca
,
P. Ciambelli
2015
Corpus ID: 66167836
Process intensification is conceived as a way to optimize fixed and operating costs in an industrial plant. It is not only…
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2013
2013
Thermal-aware mapping of streaming applications on 3D Multi-Processor Systems
Marco Cox
,
Ashutosh Kumar Singh
,
Akash Kumar
,
H. Corporaal
The 11th IEEE Symposium on Embedded Systems for…
2013
Corpus ID: 9166802
Implementing Multi-Processor-Systems-on-Chip (MPSoCs) in 3-Dimensional (3D) ICs has many benefits, but the increased power…
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2013
2013
Study of the induration phenomena in single pellet to traveling grate furnace
F. P. Vitoretti
,
J. A. Castro
2013
Corpus ID: 54502175
Review
2010
Review
2010
Characteristic Temperature Curves for Aluminum Alloys during Friction Stir Welding
C. Hamilton
,
S. Dymek
,
A. Sommers
2010
Corpus ID: 53485682
Review of published friction stir welding (FSW) data across numerous aluminum alloys demonstrates that a characteristic…
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2009
2009
Junction-level thermal extraction and simulation of 3DICs
S. Melamed
,
T. Thorolfsson
,
A. Srinivasan
,
E. Cheng
,
P. Franzon
,
W. R. Davis
IEEE International Conference on 3D System…
2009
Corpus ID: 881395
In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable…
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2008
2008
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints
D. Shirley
,
H. Ghorbani
,
J. K. Spelt
Microelectronics and reliability
2008
Corpus ID: 7515423
2007
2007
Optimisation d'un procédé de pyrolyse en four tournant : application à la production de charbons actifs
Idriss Ahmed Hared
2007
Corpus ID: 190168920
Les charbons actifs sont utilises dans de nombreux procedes comme le traitement de l'eau, la separation des gaz, la refrigeration…
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2004
2004
Characterization of Heat-Assisted Magnetic Recording Channels
R. Radhakrishnan
,
B. Vasic
,
F. Erden
,
C. He
Advances in Information Recording
2004
Corpus ID: 22765863
The storage capacity of hard disk drives has increased tremendously over the last decade. However, the rate of increase has…
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2001
2001
Thermal profiling of electronic assemblies.
M. Wickham
,
C. Hunt
2001
Corpus ID: 182759094
With the advent of lead-free soldering there is a greater need for thermal profiling of electronic assemblies during soldering…
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1993
1993
HEAT: a FORTRAN computer program for calculating 1-D conductive and advective heat transport in geological formations
P. Caritat
1993
Corpus ID: 61098574
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