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Thermal profiling
Known as:
Thermal profile
A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow…
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8 relations
Kapton
Printed circuit board
Process Window Index
Reflow oven
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
High Thermal Conductivity Structured Carriers for Catalytic Processes Intensification
V. Palma
,
Domenico Pisano
,
M. Martino
,
A. Ricca
,
P. Ciambelli
2015
Corpus ID: 66167836
Process intensification is conceived as a way to optimize fixed and operating costs in an industrial plant. It is not only…
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2013
2013
New multiplex PCR assays for estimating genetic diversity in rainbow trout ( Oncorhynchus mykiss ) by polymorphism of microsatellite DNA
D. Kaczmarczyk
,
A. Kaczor
2013
Corpus ID: 62835939
Multiplex PCR is a useful technique for estimating genetic diversity. This paper presents 3 new sets of primer pairs for…
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2009
2009
Junction-level thermal extraction and simulation of 3DICs
S. Melamed
,
T. Thorolfsson
,
A. Srinivasan
,
E. Cheng
,
P. Franzon
,
W. R. Davis
IEEE International Conference on 3D System…
2009
Corpus ID: 881395
In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable…
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2009
2009
A Framework for 2.5D NoC Exploration Using Homogeneous Networks over Heterogeneous Floorplans
V. D. Paulo
,
Cristinel Ababei
International Conference on Reconfigurable…
2009
Corpus ID: 17021949
In this paper, we propose a new 2.5D NoC architecture that uses a homogeneous network on one layer on top of a heterogeneous…
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2007
2007
Optimisation d'un procédé de pyrolyse en four tournant : application à la production de charbons actifs
Idriss Ahmed Hared
2007
Corpus ID: 190168920
Les charbons actifs sont utilises dans de nombreux procedes comme le traitement de l'eau, la separation des gaz, la refrigeration…
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2007
2007
Thermal-aware steiner routing for 3D stacked ICs
M. Pathak
,
S. Lim
IEEE/ACM International Conference on Computer…
2007
Corpus ID: 1665394
In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins…
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2006
2006
A versatile, via terminated electromigration test structure for various stress modes used during fast wafer level reliability (fWLR) testing
A. Pietsch
,
A. Martin
,
J. Fazekas
IEEE transactions on semiconductor manufacturing
2006
Corpus ID: 21900939
A multipurpose electromigration (EM) test structure designed for advanced fast wafer level reliability (WLR) tests is described…
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2004
2004
Characterization of Heat-Assisted Magnetic Recording Channels
R. Radhakrishnan
,
B. Vasic
,
F. Erden
,
C. He
Advances in Information Recording
2004
Corpus ID: 22765863
The storage capacity of hard disk drives has increased tremendously over the last decade. However, the rate of increase has…
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2001
2001
Thermal profiling of electronic assemblies.
M. Wickham
,
C. Hunt
2001
Corpus ID: 182759094
With the advent of lead-free soldering there is a greater need for thermal profiling of electronic assemblies during soldering…
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Review
2000
Review
2000
A High-Efficiency Refractive Secondary Solar Concentrator for High Temperature Solar Thermal Applications
M. Piszczor
,
R. Macosko
2000
Corpus ID: 110017079
A refractive secondary solar concentrator is a non-imaging optical device that accepts focused solar energy from a primary…
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