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Thermal management of high-power LEDs
Known as:
MCPCB
, Thermal management
, Thermal management of high power LED
In order to maintain a low junction temperature to keep good performance of an LED, every method of removing heat from LEDs should be considered…
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Related topics
Related topics
11 relations
CFD in buildings
Heat pipe
Heat sink
Integrated circuit
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
New “real” bridgeless high efficiency AC-DC converter
A. Fardoun
,
E. Ismail
,
M. A. Al-Saffar
,
A. Sabzali
Applied Power Electronics Conference
2012
Corpus ID: 20359343
In this paper, a new bridgeless single-phase ac-dc converter with a natural power factor correction (PFC) is proposed. Compared…
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2010
2010
Leakage Aware Scheduling on Maximum Temperature Minimization for Periodic Hard Real-Time Systems
Huang Huang
,
Vivek Chaturvedi
,
Guanglei Liu
,
Gang Quan
10th IEEE International Conference on Computer…
2010
Corpus ID: 15611878
Thermal management is becoming a critical issue in computing system design as the processor power continues to grow exponentially…
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2008
2008
PC Board Thermal Management of High Power LEDs
J. Yu
,
W. Oepts
,
H. Konijn
Twenty-fourth Annual IEEE Semiconductor Thermal…
2008
Corpus ID: 45009782
Increasing requirements of closely packed high power LEDs pose challenges for PC board thermal management. This paper presents a…
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Highly Cited
2008
Highly Cited
2008
A Nanowatt Smart Temperature Sensor for Dynamic Thermal Management
P. Ituero
,
J. Ayala
,
M. López-Vallejo
IEEE Sensors Journal
2008
Corpus ID: 21257827
The amazing integration densities achieved by current submicron technologies pay the price of increasing static power dissipation…
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2007
2007
Thermal management methods for compact high power LED arrays
A. Christensen
,
Minseok Ha
,
S. Graham
SPIE Optical Engineering + Applications
2007
Corpus ID: 110412842
The package and system level temperature distributions of a high power (>1W) light emitting diode (LED) array has been…
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2007
2007
Novel packaging materials and thermal management of high-power LED packaging
Wang Xing
2007
Corpus ID: 138096229
Reasonable selection and efficient employment of packaging materials with high thermal conductivity are important for improving…
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2006
2006
Temperature-Aware On-Chip Networks
Li Shang
,
L. Peh
,
Amit Kumar
,
N. Jha
IEEE Micro
2006
Corpus ID: 3116704
On-chip networks are becoming increasingly popular as a way to connect high-performance single-chip computer systems, but thermal…
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2005
2005
Simulations of direct-die-attached microchannel coolers for the thermal management of GaN-on-SiC microwave amplifiers
J. Calame
,
R. Myers
,
F. Wood
,
S. Binari
IEEE transactions on components and packaging…
2005
Corpus ID: 33227650
This paper presents finite-element thermo-mechanical simulation studies of microchannel-based techniques to cool AlGaN/GaN high…
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1999
1999
Thick-film thermoelectric microdevices
J. Fleurial
,
G. J. Snyder
,
+6 authors
M. Nicolet
Eighteenth International Conference on…
1999
Corpus ID: 22177475
Miniaturized thermoelectric devices integrated into thermal management packages and low power, high voltage, electrical power…
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Highly Cited
1997
Highly Cited
1997
Thermal management system for high performance PowerPC/sup TM/ microprocessors
H. Sánchez
,
B. Kuttanna
,
+4 authors
J. Alvarez
Proceedings IEEE COMPCON 97. Digest of Papers
1997
Corpus ID: 2378886
Thermal management is an important design issue in high-performance, low-power portable computers. If the computer system is…
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