FAQ

Thermal management of high-power LEDs

Known as: MCPCB, Thermal management of high power LED 
In order to maintain a low junction temperature to keep good performance of an LED, every method of removing heat from LEDs should be considered… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

2004-2016
051020042016

Related topics

Related topics

9 relations
Heat pipeHeat sinkIntegrated circuitJunction temperature
(More)

Related mentions per year

Related mentions per year

1954-2018
1960198020002020
Thermal management of high-power LEDs
Integrated circuit
Printed circuit board
Reliability engineering
Heat sink
Thermal resistance

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Copper-Core MCPCB With Thermal Vias for High-Power COB LED Modules
To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2013
2013
Thermal simulation analysis of high power LED system using two-resistor compact LED model
This paper presents the thermal analysis and validation of high power LED system with simulation and experimental methods. A 3W… (More)
  • figure 1
  • figure 2
  • figure 4
  • figure 3
  • table 1
Is this relevant?
2012
2012
Heat dissipation design and analysis of high power LED array using the finite element method
High-power Light Emitting Diode (LED) technology has developed rapidly in recent years from illumination to display applications… (More)
  • figure 1
  • figure 2
  • table 1
  • figure 3
  • figure 4
Is this relevant?
2012
2012
A nanostructure patterned heat spreader for on-chip thermal management of high-power LEDs
Experimental studies on micro/nanostructure patterned surfaces combining hydrophobic and hydrophilic zones for nucleation boiling… (More)
  • table 1
  • figure 1
  • figure 2
  • figure 4
  • figure 6
Is this relevant?
2011
2011
PCB thermal performance for power LEDs
Investigations deal with development of cost effective thermal management for power LEDs. The technique involves usage of FR4… (More)
  • figure 1
  • figure 2
  • figure 5
  • figure 6
  • figure 7
Is this relevant?
2010
2010
Numerical study on thermal management of high power LED die bonding technology
Thermal management of high power LED packages is crucial to realize a reliable lighting performance. It is known that the die… (More)
Is this relevant?
2010
2010
Optimized Thermal Management From a Chip to a Heat Sink for High-Power GaN-Based Light-Emitting Diodes
To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat… (More)
  • table I
  • figure 3
  • figure 1
  • figure 2
  • figure 5
Is this relevant?
2009
2009
High brightness LED assembly using DPC substrate and SuperMCPCB
This paper is to evaluate the thermal performances of a Direct Plated Copper (DPC) substrates attached on a high performance… (More)
  • figure 1
  • figure 4
  • figure 2
  • figure 5
  • figure 3
Is this relevant?
2008
2008
Thermal management and novel package design of high power light-emitting diodes
Thermal management and package materials in high power light emitting diodes (HPLEDs) are now critical design issues to limit… (More)
  • figure 1
  • table I
Is this relevant?
2008
2008
Thermal transient characteristics of die attach in high power LED PKG
The reliability of packaged electronics strongly depends on the die attach quality because any void or a small delamination may… (More)
  • figure 1
  • table 1
  • figure 4
  • figure 2
  • figure 3
Is this relevant?