Thermal management of high-power LEDs

Known as: MCPCB, Thermal management of high power LED 
In order to maintain a low junction temperature to keep good performance of an LED, every method of removing heat from LEDs should be considered… (More)
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Topic mentions per year

Topic mentions per year

2004-2016
051020042016

Papers overview

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2014
2014
To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board… (More)
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2013
2013
This paper presents the thermal analysis and validation of high power LED system with simulation and experimental methods. A 3W… (More)
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2012
2012
High-power Light Emitting Diode (LED) technology has developed rapidly in recent years from illumination to display applications… (More)
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2012
2012
Experimental studies on micro/nanostructure patterned surfaces combining hydrophobic and hydrophilic zones for nucleation boiling… (More)
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2011
2011
Investigations deal with development of cost effective thermal management for power LEDs. The technique involves usage of FR4… (More)
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2010
2010
Thermal management of high power LED packages is crucial to realize a reliable lighting performance. It is known that the die… (More)
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2010
2010
To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat… (More)
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2009
2009
This paper is to evaluate the thermal performances of a Direct Plated Copper (DPC) substrates attached on a high performance… (More)
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2008
2008
Thermal management and package materials in high power light emitting diodes (HPLEDs) are now critical design issues to limit… (More)
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2008
2008
The reliability of packaged electronics strongly depends on the die attach quality because any void or a small delamination may… (More)
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