Thermal copper pillar bump

Known as: Thermal bump 
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in… (More)
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Topic mentions per year

Topic mentions per year

2000-2017
0120002017

Papers overview

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2017
2017
FAME is the French Absorption spectroscopy beamline in Material and Environmental sciences at the ESRF (France), operational… (More)
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2012
2012
The objective of thermal design requirement for 3D stacked die package is to maintain the junction temperatures of active devices… (More)
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2008
2008
A thermal solution for flip chip preamp die on flex applications was realized via a new flex design. This design incorporates an… (More)
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Review
2003
Review
2003
We present the complete set of ISOPHOT observations of 3CR radio galaxies and quasars, which are contained in the ISO Data… (More)
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2000
2000
In order to test the unified scheme for luminous radio galaxies and quasars we observed 10 galaxy/quasar pairs from the 3CR… (More)
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