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Thermal copper pillar bump

Known as: Bump, Thermal bump 
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in… 
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Related topics

Related topics

3 relations
Flip chipOptical amplifierWafer (electronics)

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2013
Highly Cited
2013
DISCOVERY OF A RICH CLUSTER AT z = 1.63 USING THE REST-FRAME 1.6 μm “STELLAR BUMP SEQUENCE” METHOD
We present a new two-color algorithm, the “Stellar Bump Sequence” (SBS), that is optimized for robustly identifying candidate… 
Review
2011
Review
2011
Reddening and metallicity maps of the Milky Way bulge from VVV and 2MASS. I. The method and minor axis maps
We present a method to obtain reddening maps and to trace structure and metallicity gradients of the bulge using data from the… 
Highly Cited
2010
Highly Cited
2010
Challenges in chip design for the AGIPD detector
Highly Cited
2009
Highly Cited
2009
Near-infrared properties of 12 globular clusters towards the inner bulge of the Galaxy
We present near-infrared colour–magnitude diagrams and physical parameters for a sample of 12 galactic globular clusters located… 
Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via… 
Highly Cited
2006
Highly Cited
2006
Accepted for publication in Astrophysical Journal Letters Preprint typeset using L ATEX style emulateapj v. 10/09/06 THE ARCHES CLUSTER MASS FUNCTION
  • 2006
  • Corpus ID: 15341477
Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu addition in Sn–3.5%Ag solder on the dissolution rate of Cu metallization
The dissolution of thin film under-bump-metallization (UBM) by molten solder has been one of the most serious processing problems… 
Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and… 
Highly Cited
2001
Highly Cited
2001
SUBMITTED TO THE ASTROPHYSICAL JOURNAL LETTERS Preprint typeset using L ATEX style emulateapj v. 04/03/99
  • 2001
  • Corpus ID: 6212494
Highly Cited
2000
Highly Cited
2000
Description and evaluation of the FAST-Net smart pixel-based optical interconnection prototype
The design, packaging approach, and experimental evaluation of the free-space accelerator for switching terabit networks (FAST… 
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