Thermal copper pillar bump
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FAME is the French Absorption spectroscopy beamline in Material and Environmental sciences at the ESRF (France), operational… (More)
The objective of thermal design requirement for 3D stacked die package is to maintain the junction temperatures of active devices… (More)
A thermal solution for flip chip preamp die on flex applications was realized via a new flex design. This design incorporates an… (More)
We present the complete set of ISOPHOT observations of 3CR radio galaxies and quasars, which are contained in the ISO Data… (More)
In order to test the unified scheme for luminous radio galaxies and quasars we observed 10 galaxy/quasar pairs from the 3CR… (More)