Thermal copper pillar bump

Known as: Bump, Thermal bump

The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in…

Papers overview

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2016

The peak luminosity achieved during Pb-Pb collisions in the LHC in 2015 (3x10 cm s ) well exceeded the 27 -2 -1 design luminosity…

2015

2014

: The development of vehicles having best ride comfort and safety of travelling passengers is of great interest for automotive…

2012

Persistent activity has been identified as a neural correlate of working memory [J. M. Fuster and G. E. Alexander, Science, 173…

2010

A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point…

2007

The decrease in feature sizes of microelectronic devices has underlined the need for higher number of input-outputs (I/Os) in…

2000

Lead-free soldering, originally started as an environmental issue, is evolving rapidly into a business survival tool for the…

1992

This paper describes several paradigms for the direct manipulation of a surface in computer graphics. The surface is considered…

1990

A technology is proposed for the fabrication of three-dimensional integrated circuits (3D-ICs) having a large number of device…

1969