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Thermal copper pillar bump

Known as: Bump, Thermal bump 
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in… Expand
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Papers overview

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Highly Cited
2013
Highly Cited
2013
This paper investigates the problem of vibration control in vehicle active suspension systems, whose aim is to stabilize the… Expand
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2009
2009
  • C.H. Lee
  • IEEE International Interconnect Technology…
  • 2009
  • Corpus ID: 6578734
Flipchip technologies have been evolved to grab the major portion of the high and medium performance markets, where the bump… Expand
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Highly Cited
2008
Highly Cited
2008
  • K. D. Do
  • IEEE Transactions on Control Systems Technology
  • 2008
  • Corpus ID: 37293248
A constructive method is presented to design cooperative controllers that force a group of N unicycle-type mobile robots with… Expand
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Highly Cited
2007
Highly Cited
2007
Principal curves are smooth one-dimensional curves that pass through the middle of a p-dimensional data set, providing a… Expand
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Highly Cited
2007
Highly Cited
2005
Highly Cited
2005
Range scanning, manual 3D editing, and other modeling approaches can provide information about the geometry of surfaces in the… Expand
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Highly Cited
2003
Highly Cited
2003
An efficient ghost-cell immersed boundary method (GCIBM) for simulating turbulent flows in complex geometries is presented. A… Expand
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Highly Cited
2000
Highly Cited
2000
In his book Explaining Behavior, Fred Dretske distinguishes between types of representational systems based on whether the… Expand
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Highly Cited
1997
Highly Cited
1997
Height coordinate ocean models commonly represent topography as a ‘‘staircase’’ of discontinuous steps that are fitted to the… Expand
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Highly Cited
1990
Highly Cited
1990
The intricate choreography necessary to do work in organizations requires effective coordination. This paper uses a variety of… Expand
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