FAQ

Thermal copper pillar bump

Known as: Thermal bump 
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

2000-2017
0120002017

Related topics

Related topics

3 relations
Flip chipOptical amplifierWafer

Related mentions per year

Related mentions per year

1966-2018
1960198020002020
Thermal copper pillar bump
Optical amplifier
Wafer
Flip chip

Papers overview

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2017
2017
FAME : A new beamline for X-ray absorption investigations of very-diluted systems of environmental, material and biological interests
FAME is the French Absorption spectroscopy beamline in Material and Environmental sciences at the ESRF (France), operational… (More)
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2012
2012
Thermal management of packages with 3D die stacking
The objective of thermal design requirement for 3D stacked die package is to maintain the junction temperatures of active devices… (More)
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2008
2008
Method for improved thermal performance of flip chip on flex power devices
A thermal solution for flip chip preamp die on flex applications was realized via a new flex design. This design incorporates an… (More)
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Review
2003
Review
2003
The ISOPHOT - MAMBO survey of 3CR radio sources: Further evidence for the unified schemes
We present the complete set of ISOPHOT observations of 3CR radio galaxies and quasars, which are contained in the ISO Data… (More)
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2000
2000
Dust emission from 3C radio galaxies and quasars: New ISO observations favour the unified scheme
In order to test the unified scheme for luminous radio galaxies and quasars we observed 10 galaxy/quasar pairs from the 3CR… (More)
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