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Solder mask

Known as: Solder bridge, Solder-stop mask, Liquid photoimageable solder mask 
Solder mask or solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed… 
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Related topics

Related topics

11 relations
Bead probe technologyDip solderingElectronic design automationFlexible circuit

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging
An advanced method based on the digital image correlation technique is implemented for characterization of hygroscopic swelling… 
2009
2009
Chemical and Mechanical Analysis of PCB Surface Treated by Argon Plasma to Enhance Interfacial Adhesion
Plasma treatment of printed circuit board (PCB) is a common step in the electronic packaging processes in order to modify the… 
2009
2009
Underfill delamination to chip sidewall in advanced flip chip packages
A number of failure mechanisms related to the underfill material in flip chip plastic ball grid array packages are well… 
2006
2006
Micro impact characterisation of solder joint for drop impact application
Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests… 
2006
2006
Electronics reliability prognosis through material modeling and simulation
Electronic systems, such as power supplies, are complex multilayered devices consisting of different materials with inherent… 
2006
2006
Sea-of-leads MEMS I/O interconnects for low-k IC packaging
Technology feasibility of MEMS-type chip I/O interconnects (namely Sea-of-Leads or SoL) is demonstrated. Acting like a spring, a… 
Highly Cited
2005
Highly Cited
2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact… 
2005
2005
High Strain Rate Testing of Solder Interconnections
Understanding the response of the board-to-package (2nd level) interconnections to loading at high strain rates is essential for… 
2005
2005
Solid state UV laser technology for electronic packaging applications
This presentation introduces solid state UV laser drilling technology for electronic packaging applications which mainly includes… 
Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and… 
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