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Solder mask
Known as:
Solder bridge
, Solder-stop mask
, Liquid photoimageable solder mask
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Solder mask or solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed…
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Related topics
Related topics
11 relations
Bead probe technology
Dip soldering
Electronic design automation
Flexible circuit
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2010
2010
Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging
C. Jang
,
Samson Yoon
,
B. Han
IEEE transactions on components and packaging…
2010
Corpus ID: 31164826
An advanced method based on the digital image correlation technique is implemented for characterization of hygroscopic swelling…
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2009
2009
Underfill delamination to chip sidewall in advanced flip chip packages
Marie-Claude Paquet
,
J. Sylvestre
,
Emmanuelle Gros
,
N. Boyer
Electronic Components and Technology Conference
2009
Corpus ID: 28486622
A number of failure mechanisms related to the underfill material in flip chip plastic ball grid array packages are well…
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Highly Cited
2007
Highly Cited
2007
The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties
S. Wiese
,
M. Roellig
,
Maik Mueller
,
K. Wolter
International Conference on Thermal, Mechanical…
2007
Corpus ID: 17069227
2006
2006
Sea-of-leads MEMS I/O interconnects for low-k IC packaging
B. Dang
,
M. Bakir
,
C. Patel
,
H. Thacker
,
J. Meindl
Journal of microelectromechanical systems
2006
Corpus ID: 22559401
Technology feasibility of MEMS-type chip I/O interconnects (namely Sea-of-Leads or SoL) is demonstrated. Acting like a spring, a…
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2006
2006
Micro impact characterisation of solder joint for drop impact application
E. Wong
,
Y. Mai
,
+4 authors
Chang-Lin Yeh
Electronic Components and Technology Conference
2006
Corpus ID: 20768252
Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests…
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2006
2006
Electronics reliability prognosis through material modeling and simulation
Loren Nasser
,
Maggie Curtin Vextec
IEEE Aerospace Conference
2006
Corpus ID: 23311964
Electronic systems, such as power supplies, are complex multilayered devices consisting of different materials with inherent…
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Highly Cited
2005
Highly Cited
2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
E. Wong
,
R. Rajoo
,
Y. Mai
,
S. Sean
,
K. T. Tsai
,
L. Yap
Proceedings Electronic Components and Technology…
2005
Corpus ID: 37686623
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact…
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2005
2005
High Strain Rate Testing of Solder Interconnections
K. T. Tsai
,
F. Liu
,
E. Wong
,
R. Rajoo
Conference on High Density Microsystem Design and…
2005
Corpus ID: 1374475
Understanding the response of the board-to-package (2nd level) interconnections to loading at high strain rates is essential for…
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2004
2004
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages
T. Y. Tee
,
Z. Zhong
Microelectronics and reliability
2004
Corpus ID: 34026831
Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
M. Alam
,
Y. Chan
,
K. Tu
2003
Corpus ID: 97083111
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and…
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