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Selective soldering
Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat…
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Related topics
Related topics
7 relations
Dip soldering
Gerber format
Printed circuit board
Reflow oven
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Solderability and reliability evolution of no clean solder fluxes for selective soldering
Emmanuelle Guéné
European Microelectronics and Packaging…
2017
Corpus ID: 13851878
Flux consumption for wave soldering tends to decrease, mainly due to its gradual replacement by reflow soldering methods (i.e…
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2016
2016
How to Use the Right Flux for the Selective Soldering Application
B. Tolla
,
D. Jean
,
Xiang Wei
2016
Corpus ID: 26783618
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for…
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2012
2012
Process parameter optimization of selective soldering
Z. Oláh
,
M. Ruszinkó
,
R. Bátorfi
,
Z. Illyefalvi-Vitéz
International Symposium for Design and Technology…
2012
Corpus ID: 33550964
The topic of this paper refers to selective miniwave soldering. Experiments with a commercially available machine were made to…
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2012
2012
Evaluation of soldering processes for high efficiency solar cells
P. Gierth
,
L. Rebenklau
,
Alexander Michaelis
Information Security Solutions Europe
2012
Corpus ID: 44536700
Solar cells have to be connected electrically to each other in a solar module. During the last years, new connection techniques…
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2008
2008
Method for selective solder paste application for BGA rework
O. Krammer
,
I. Kobolak
Information Security Solutions Europe
2008
Corpus ID: 40224268
The reflow soldering of BGA (ball grid array) packaged components always raise quality and reliability issues since bridges and…
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2008
2008
Eddy Current Induced Heating for the Solder Reflow of Area Array Packages
Mingyu Li
,
Hongbo Xu
,
S. Lee
,
Jongmyung Kim
,
Daewon Kim
IEEE Transactions on Advanced Packaging
2008
Corpus ID: 45972225
This paper presents a feasibility study of using eddy current induced heating for the solder reflow of area array packages. With…
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2007
2007
Soldering Technology for 3D PCB Assemblies with Microwave Heating
M. Nowottnick
,
R. Diehm
IEEE International Symposium on Industrial…
2007
Corpus ID: 23867506
This paper is showing results from a joint research project "MICROFLOW", funded by the German Department for Education and…
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2006
2006
Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning
S. Ebbens
,
D. Hutt
,
Changqing Liu
Electronic Packaging Technology Conference
2006
Corpus ID: 8676389
The aim of this study is to investigate the feasibility of depositing a self-assembled monolayer (SAM) coating using ink-jet…
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2006
2006
Selective Soldering with Precise Amounts of Liquid Solder
J. Niemeier
,
G. Seliger
,
J. Seutemann
1st Electronic Systemintegration Technology…
2006
Corpus ID: 37179177
Selective soldering methods are established in the market for joining electric or electronic components with printed circuit…
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2003
2003
Lead-Free Selective Soldering : The Wave of the Future
Bob Klenke
2003
Corpus ID: 29510710
The European perspective on waste management and recycling as described in the European Union’s Waste of Electrical and…
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