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Quad Flat Package

Known as: Vqfp, TQFP, Plastic quad flat pack 
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such… 
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Related topics

Related topics

19 relations
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Modelling methodology for thermal analysis of hot solder dip process
2010
2010
Interface delamination analysis of TQFP package during solder reflow
2006
2006
Drop impact analysis of Sn-Ag-Cu solder joints using dynamic high-strain rate plastic strain as the impact damage driving force
Board-level drop reliability test and analysis requires dynamic characterization of high strain-rate properties of bulk solder… 
2005
2005
High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits
Application of low-cost commercial plastic encapsulated microcircuits (PEMs) for military and aerospace applications requires… 
2005
2005
Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies
In this study, thermal cycling test from -40/spl deg/C to 125/spl deg/C with 1 hour per cycle for Sn/sub -3.8/Ag/sub -0.7/Cu… 
2005
2005
Identification and Counter Abstraction for Full Virtual Symmetry
Symmetry reduction is an effective approach for dealing with the state explosion problem: when applicable, it enables exponential… 
2004
2004
Harsh solder joint reliability tests by impact drop and highly accelerated life test (HALT)
In this work, board level impact drop test and highly accelerated life test (HALT) were conducted on lead-free soldered… 
2003
2003
Optimization of TQFP molding process using neuro-fuzzy-GA approach
1998
1998
A jitter-tolerant 4.5 Gb/s CMOS interconnect for digital display
The digital display interface for flat panels is an emerging field that requires a robust high-speed interface for uncompromised… 
1996
1996
Fatigue life estimation of surface mount solder joints
A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The… 
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