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Quad Flat Package

Known as: Vqfp, TQFP, Plastic quad flat pack 
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such… Expand
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Papers overview

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2012
2012
Interfacial delamination has become one of the most important reliability issues in the microelectronic industry, and therefore… Expand
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2010
2010
Abstract The reliability of Sn–Ag–Cu–Ce lead-free soldered joints in quad flat packages under thermal cycling was investigated… Expand
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Highly Cited
2007
Highly Cited
2007
Abstract In several cases producing new or recovering defective products takes place on a common facility, with these activities… Expand
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2005
2005
Application of low-cost commercial plastic encapsulated microcircuits (PEMs) for military and aerospace applications requires… Expand
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2005
2005
In this study, thermal cycling test from -40/spl deg/C to 125/spl deg/C with 1 hour per cycle for Sn/sub -3.8/Ag/sub -0.7/Cu… Expand
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Highly Cited
2004
Highly Cited
2004
In this paper, a pseudopolynomial time algorithm is presented for solving the integral time-dependent quickest flow problem… Expand
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2003
2003
This paper focuses on an integrated optimization problem that involves multiple qualitative and quantitative responses in the… Expand
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1999
1999
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), methods for thermal characterization of active… Expand
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1996
1996
A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The… Expand
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Highly Cited
1991
Highly Cited
1991
A quantum flux parametron (QFP), a single quantum flux superconductive device that has a potential of up to 100-GHz switching… Expand
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