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Printed Circuit Board Device Component
Known as:
PC (Printed Circuit) Board
, Printed Circuit Board
A circuit board that has connections that are preapplied, usually added using photo-resist and acid etching techniques.
National Institutes of Health
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Medical Device Component or Accessory
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2013
Highly Cited
2013
Understanding the effect of PCB layout on circuit performance in a high frequency gallium nitride based point of load converter
D. Reusch
,
J. Strydom
Applied Power Electronics Conference
2013
Corpus ID: 47558221
The introduction of enhancement mode gallium nitride based power devices such as the eGaN®FET offers the potential to achieve…
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Highly Cited
2012
Highly Cited
2012
A Broadband LTE/WWAN Antenna Design for Tablet PC
Shih-Hsun Chang
,
Wen-Jiao Liao
IEEE Transactions on Antennas and Propagation
2012
Corpus ID: 11796663
A broadband yet compact antenna design applicable to tablets and laptops is proposed. The antenna provides an extensive coverage…
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Highly Cited
2010
Highly Cited
2010
MULTIBAND FOLDED LOOP ANTENNA FOR SMART PHONES
C. Chiu
,
Chih Chang
,
Yu-Jen Chi
2010
Corpus ID: 18557178
This paper presents a multiband folded loop antenna for smart phone applications. The proposed antenna with a symmetric loop…
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Highly Cited
2008
Highly Cited
2008
Bandwidth‐enhanced internal PIFA with a coupling feed for quad‐band operation in the mobile phone
Kin‐Lu Wong
,
Chih-Hong Huang
2008
Corpus ID: 110429700
A novel bandwidth‐enhanced internal planar inverted‐F antenna (PIFA) for quad‐band operation in the mobile phone is presented…
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Highly Cited
2008
Highly Cited
2008
DMAIC Approach to Improve the Capability of SMT Solder Printing Process
M.-H.C. Li
,
Abbas Al-Refaie
,
Cheng-Yu Yang
IEEE transactions on electronics packaging…
2008
Corpus ID: 20084383
One of the major manufacturing processes of surface-mount technology (SMT) is the solder paste printing process. In this process…
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Highly Cited
2008
Highly Cited
2008
Coil Array Structures Compared for Contactless Battery Charging Platform
J. Achterberg
,
E. Lomonova
,
J. de Boeij
IEEE transactions on magnetics
2008
Corpus ID: 33203979
We propose two new coil topologies for a contactless battery charging platform. The new topologies consist of square printed…
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Highly Cited
2006
Highly Cited
2006
Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling
P. Lall
,
S. Gupte
,
P. Choudhary
,
J. Suhling
IEEE transactions on electronics packaging…
2006
Corpus ID: 1835127
Modeling approaches for first-level solder interconnects in shock and drop of electronics assemblies have been developed without…
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Highly Cited
2006
Highly Cited
2006
Performance and Characterization of New Micromachined High-Frequency Linear Arrays
M. Lukacs
,
Jianhua Yin
,
+5 authors
F. S. Foster
IEEE Transactions on Ultrasonics, Ferroelectrics…
2006
Corpus ID: 23362008
A new approach for fabricating high frequency (>20 MHz) linear array transducers, based on laser micromachining, has been…
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Highly Cited
2004
Highly Cited
2004
Sensor Network Localization via Received Signal Strength Measurements with Directional Antennas
J. Ash
,
L. Potter
2004
Corpus ID: 9506401
In wireless sensor networks position awareness is necessary to exploit the communication beneflts of directional antennas and for…
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Highly Cited
2000
Highly Cited
2000
Fate of bromine in pyrolysis of printed circuit board wastes.
Yi-Chi Chien
,
H. Paul Wang
,
Kuen-Song Lin
,
Y. Huang
,
Y.W Yang
Chemosphere
2000
Corpus ID: 20724016
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