DMAIC Approach to Improve the Capability of SMT Solder Printing Process

@article{Li2008DMAICAT,
  title={DMAIC Approach to Improve the Capability of SMT Solder Printing Process},
  author={M. H. Li and Abbas Al-Refaie and Cheng-Yu Yang},
  journal={IEEE Transactions on Electronics Packaging Manufacturing},
  year={2008},
  volume={31},
  pages={126-133}
}
One of the major manufacturing processes of surface-mount technology (SMT) is the solder paste printing process. In this process, the thickness of deposited solder paste on printed circuit board (PCB) pads is a key quality characteristic (QCH) of main concern. In practice, large deviations of solder thickness from a nominal value result in SMT defects that may cause PCB failure. This paper implements the define-measure-analyze-improve-control (DMAIC) approach to improve the capability of the… CONTINUE READING
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