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Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… 
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Related topics

2 relations
Ball grid arrayPrinted circuit board

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2018
Review
2018
Implications of cohesive strength in asteroid interiors and surfaces and its measurement
AbstractRecent observations and theory have indicated that rubble pile asteroids may have a small, but finite, level of tensile… 
2015
2015
Fingering induced by a solid sphere impact to viscous fluid
The number of splashed fingers generated by a solid projectile's impact onto a viscous liquid layer is experimentally studied. A… 
2013
2013
Solder joint reliability under realistic service conditions
2013
2013
P/2010 A2 LINEAR - II. Dynamical dust modelling
P/2010 A2 is an object on an asteroidal orbit that was observed to have an extended tail or debris trail in January 2010. In thi… 
2012
2012
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging
Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging… 
2012
2012
Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure
Effects of solder alloy, volume and pad finishes on various aspects of microstructure and the corresponding thermomechanical… 
2011
2011
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
2010
2010
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the… 
2009
2009
On the nature of pad cratering
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… 
2008
2008
A new method to evaluate BGA pad cratering in lead-free soldering
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow… 
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