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Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… Expand
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Papers overview

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2018
2018
Hypervelocity impacts have become a key tool for future research about the structure of interstellar bodies. NASA has proposed a… Expand
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2017
2017
Context. The Nice model predicts that the trans-planetary planetesimal disk made a large or even dominant contribution to the… Expand
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2015
2015
The number of splashed fingers generated by a solid projectile's impact onto a viscous liquid layer is experimentally studied. A… Expand
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2013
2013
P/2010 A2 is an object on an asteroidal orbit that was observed to have an extended tail or debris trail in January 2010. In thi… Expand
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2010
2010
Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the… Expand
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2010
2010
Pad cratering of printed circuit board (PCB) is becoming a prevailing issue encountered in the PCB assemblies which is… Expand
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2010
2010
The present work addresses a significant risk generally overlooked in the design and accelerated testing of high reliability… Expand
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2009
2009
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… Expand
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2008
2008
Cracking of the laminate under the solder connect pads, known as pad craters, is a reliability issue related to mechanical… Expand
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2008
2008
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow… Expand
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