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Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… Expand
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Related topics

2 relations
Ball grid arrayPrinted circuit board

Papers overview

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2018
2018
Hypervelocity Cratering of Cold Iron
Hypervelocity impacts have become a key tool for future research about the structure of interstellar bodies. NASA has proposed a… Expand
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2017
2017
Cometary impact rates on the Moon and planets during the late heavy bombardment
Context. The Nice model predicts that the trans-planetary planetesimal disk made a large or even dominant contribution to the… Expand
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2015
2015
Fingering induced by a solid sphere impact to viscous fluid
The number of splashed fingers generated by a solid projectile's impact onto a viscous liquid layer is experimentally studied. A… Expand
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2013
2013
P/2010 A2 LINEAR II: Dynamical dust modelling
P/2010 A2 is an object on an asteroidal orbit that was observed to have an extended tail or debris trail in January 2010. In thi… Expand
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2010
2010
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the… Expand
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2010
2010
Failure mechanism and mitigation of PCB pad cratering
Pad cratering of printed circuit board (PCB) is becoming a prevailing issue encountered in the PCB assemblies which is… Expand
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2010
2010
Effects of pre-stressing on solder joint failure by pad cratering
The present work addresses a significant risk generally overlooked in the design and accelerated testing of high reliability… Expand
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2009
2009
On the nature of pad cratering
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… Expand
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2008
2008
Assessment of PCB pad cratering resistance by joint level testing
Cracking of the laminate under the solder connect pads, known as pad craters, is a reliability issue related to mechanical… Expand
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2008
2008
A new method to evaluate BGA pad cratering in lead-free soldering
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow… Expand
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