FAQ

Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

2003-2018
05101520032018

Related topics

Related topics

2 relations
Ball grid arrayPrinted circuit board

Related mentions per year

Related mentions per year

1937-2018
19401960198020002020
Pad cratering
Printed circuit board
Ball grid array

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In… (More)
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2014
2014
Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
In automotive electronics, complex automotive functionalities are managed by car's computers such as electronic control units… (More)
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2013
2013
A novel soldering method to evaluate PCB pad cratering for pin-pull testing
The pin-pull test has attracted attention because it can detect a high percentage of laminate cracking failures. In this study, a… (More)
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2011
2011
Method for early detection of PCB bending induced pad cratering
The pad cratering phenomenon has caused considerable concern as a type of latent defect that can impact long term reliability… (More)
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Review
2010
Review
2010
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies, particularly in lead-free products. The… (More)
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2010
2010
Failure mechanism and mitigation of PCB pad cratering
Pad cratering of printed circuit board (PCB) is becoming a prevailing issue encountered in the PCB assemblies which is… (More)
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2010
2010
Effects of pre-stressing on solder joint failure by pad cratering
The present work addresses a significant risk generally overlooked in the design and accelerated testing of high reliability… (More)
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2009
2009
On the nature of pad cratering
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… (More)
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2008
2008
Assessment of PCB pad cratering resistance by joint level testing
Cracking of the laminate under the solder connect pads, known as pad craters, is a reliability issue related to mechanical… (More)
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2008
2008
A new method to evaluate BGA pad cratering in lead-free soldering
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow… (More)
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