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Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… 
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Papers overview

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Review
2018
Review
2018
AbstractRecent observations and theory have indicated that rubble pile asteroids may have a small, but finite, level of tensile… 
2015
2015
The number of splashed fingers generated by a solid projectile's impact onto a viscous liquid layer is experimentally studied. A… 
2013
2013
2013
2013
P/2010 A2 is an object on an asteroidal orbit that was observed to have an extended tail or debris trail in January 2010. In thi… 
2012
2012
Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging… 
2012
2012
Effects of solder alloy, volume and pad finishes on various aspects of microstructure and the corresponding thermomechanical… 
2010
2010
Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the… 
2009
2009
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… 
2008
2008
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow…