Skip to search formSkip to main contentSkip to account menu

Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… 
Wikipedia (opens in a new tab)

Related topics

Related topics

2 relations
Ball grid arrayPrinted circuit board

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2018
Review
2018
Implications of cohesive strength in asteroid interiors and surfaces and its measurement
AbstractRecent observations and theory have indicated that rubble pile asteroids may have a small, but finite, level of tensile… 
2018
2018
Hypervelocity Cratering of Cold Iron
Hypervelocity impacts have become a key tool for future research about the structure of interstellar bodies. NASA has proposed a… 
2012
2012
P/2010 A2 LINEAR - II. Dynamical dust modelling
P/2010 A2 is an object on an asteroidal orbit that was observed to have an extended tail or debris trail in January 2010. In thi… 
2012
2012
Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading
Lead-free (LF) solder joints of portable devices are frequently subjected to unintentional drop, bend, shear and thermal cycling… 
2012
2012
A dynamic study of pad structure impact on bond pad/low-K layer stress in copper wire bond
In recent years, many OSAT (Outsourced Semiconductor Assembly and Test) companies start to explore copper wire bond process… 
2011
2011
Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions
In this paper, we report a comprehensive set of accelerated thermal cycling (ATC) tests that were performed on test vehicles with… 
2010
2010
Effects of pre-stressing on solder joint failure by pad cratering
The present work addresses a significant risk generally overlooked in the design and accelerated testing of high reliability… 
2010
2010
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the… 
2009
2009
On the nature of pad cratering
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… 
2004
2004
“Comet‐tail” ejecta streaks: A predicted cratering landform unique to Titan
Abstract— A model for an impact ejecta landform peculiar to Saturn's moon Titan is presented. Expansion of the ejecta plume from… 
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)