Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

2003-2018
05101520032018

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In… (More)
  • table 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2014
2014
In automotive electronics, complex automotive functionalities are managed by car's computers such as electronic control units… (More)
  • figure 3
  • figure 1
  • figure 2
  • figure 4
  • figure 5
Is this relevant?
2013
2013
The pin-pull test has attracted attention because it can detect a high percentage of laminate cracking failures. In this study, a… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2011
2011
The pad cratering phenomenon has caused considerable concern as a type of latent defect that can impact long term reliability… (More)
  • figure 1
  • figure 2
  • table 1
  • figure 3
  • figure 4
Is this relevant?
Review
2010
Review
2010
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies, particularly in lead-free products. The… (More)
  • figure 1
  • table 1
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2010
2010
Pad cratering of printed circuit board (PCB) is becoming a prevailing issue encountered in the PCB assemblies which is… (More)
  • figure 1
  • figure 2
  • figure 3
  • table 1
  • figure 4
Is this relevant?
2010
2010
The present work addresses a significant risk generally overlooked in the design and accelerated testing of high reliability… (More)
  • figure 1
  • figure 3
  • figure 2
  • figure 4
  • figure 5
Is this relevant?
2009
2009
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 6
Is this relevant?
2008
2008
Cracking of the laminate under the solder connect pads, known as pad craters, is a reliability issue related to mechanical… (More)
  • figure 1
  • figure 3
  • figure 2
  • figure 4
  • figure 5
Is this relevant?
2008
2008
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • table 1
Is this relevant?