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Pad cratering

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB… Expand
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Related topics

Related topics

2 relations
Ball grid arrayPrinted circuit board

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Hypervelocity Cratering of Cold Iron
Hypervelocity impacts have become a key tool for future research about the structure of interstellar bodies. NASA has proposed a… Expand
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2017
2017
Cometary impact rates on the Moon and planets during the late heavy bombardment
Context. The Nice model predicts that the trans-planetary planetesimal disk made a large or even dominant contribution to the… Expand
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2013
2013
P/2010 A2 LINEAR - II. Dynamical dust modelling
P/2010 A2 is an object on an asteroidal orbit that was observed to have an extended tail or debris trail in January 2010. In thi… Expand
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2012
2012
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging
Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging… Expand
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2012
2012
A dynamic study of pad structure impact on bond pad/low-K layer stress in copper wire bond
In recent years, many OSAT (Outsourced Semiconductor Assembly and Test) companies start to explore copper wire bond process… Expand
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2010
2010
Failure mechanism and mitigation of PCB pad cratering
Pad cratering of printed circuit board (PCB) is becoming a prevailing issue encountered in the PCB assemblies which is… Expand
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2010
2010
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the… Expand
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2009
2009
On the nature of pad cratering
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad… Expand
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2008
2008
A new method to evaluate BGA pad cratering in lead-free soldering
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow… Expand
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2008
2008
Assessment of PCB pad cratering resistance by joint level testing
Cracking of the laminate under the solder connect pads, known as pad craters, is a reliability issue related to mechanical… Expand
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