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Pad cratering
Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB…
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2 relations
Ball grid array
Printed circuit board
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Review
2018
Review
2018
Implications of cohesive strength in asteroid interiors and surfaces and its measurement
D. Scheeres
,
Diego Paul Sánchez Lana
Progress in Earth and Planetary Science
2018
Corpus ID: 13750894
AbstractRecent observations and theory have indicated that rubble pile asteroids may have a small, but finite, level of tensile…
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2012
2012
P/2010 A2 LINEAR - II. Dynamical dust modelling
J. Kleyna
,
O. Hainaut
,
K. Meech
2012
Corpus ID: 119216333
P/2010 A2 is an object on an asteroidal orbit that was observed to have an extended tail or debris trail in January 2010. In thi…
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2012
2012
Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading
Hongbin Shi
,
Daquan Yu
,
T. Ueda
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 42799756
Lead-free (LF) solder joints of portable devices are frequently subjected to unintentional drop, bend, shear and thermal cycling…
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2012
2012
A dynamic study of pad structure impact on bond pad/low-K layer stress in copper wire bond
Y. B. Yang
,
N. Kumar
,
+4 authors
William G. Ramroth
Electronic Packaging Technology Conference
2012
Corpus ID: 45550325
In recent years, many OSAT (Outsourced Semiconductor Assembly and Test) companies start to explore copper wire bond process…
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2011
2011
Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions
Hongtao Ma
,
M. Ahmad
,
K. Liu
IEEE Transactions on Components, Packaging, and…
2011
Corpus ID: 7998253
In this paper, we report a comprehensive set of accelerated thermal cycling (ATC) tests that were performed on test vehicles with…
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2011
2011
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
Hongbin Shi
,
Fa Xing Che
,
T. Ueda
Microelectronics and reliability
2011
Corpus ID: 8470277
2010
2010
Effects of pre-stressing on solder joint failure by pad cratering
V. Raghavan
,
B. Roggeman
,
M. Meilunas
,
P. Borgesen
Electronic Components and Technology Conference
2010
Corpus ID: 42385418
The present work addresses a significant risk generally overlooked in the design and accelerated testing of high reliability…
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2010
2010
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Chaoran Yang
,
F. Song
,
S. Lee
,
K. Newman
Electronic Components and Technology Conference
2010
Corpus ID: 29497613
Pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under the…
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2009
2009
On the nature of pad cratering
G. Godbole
,
B. Roggeman
,
P. Borgesen
,
K. Srihari
Electronic Components and Technology Conference
2009
Corpus ID: 45677308
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad…
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2004
2004
“Comet‐tail” ejecta streaks: A predicted cratering landform unique to Titan
R. Lorenz
2004
Corpus ID: 17849637
Abstract— A model for an impact ejecta landform peculiar to Saturn's moon Titan is presented. Expansion of the ejecta plume from…
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