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Package on package

Known as: Stacked package, PoP memory, Multi-stacked package 
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages… Expand
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Papers overview

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2016
2016
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of… Expand
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2010
2010
Higher packaging density is driven by the multi-functional requirements and size shrinkage in handheld applications, which was… Expand
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2010
2010
Package warpage is a primary concern in a package-on-package. To enhance the accuracy of modeling prediction, viscoelastic… Expand
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2009
2009
The need to integrate more device technology in a given board space for handheld applications such as mobile phones has driven… Expand
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2009
2009
As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become… Expand
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Highly Cited
2009
Highly Cited
2009
A simple top-down method for realizing an array of vertically stacked nanowires is presented. The process utilizes the… Expand
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2008
2008
The need to integrate devices in the vertical dimension to reduce space, thickness, and cost for handheld applications has fueled… Expand
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2007
2007
This paper presents information concerning high density package-on-package (PoP) development which utilizes 0.5 mm top land pitch… Expand
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2007
2007
In spite of a great success of stacked package (PoP) in the market, some reliability issues have been raised. One of them is a… Expand
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2007
2007
  • Kazuo Ishibashi
  • Proceedings 57th Electronic Components and…
  • 2007
  • Corpus ID: 44048375
BGA package warpage during reflow soldering can cause open solder joint failure and in PoP case it's more critical to top joint… Expand
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