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Package on package

Known as: Stacked package, PoP memory, Multi-stacked package 
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages… 
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Related topics

Related topics

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Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
2 . 5 D and 3 D Semiconductor Package Technology : Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D… 
Review
2010
Review
2010
Package–on–Package – Review on a Promising Packaging Technology
Package-on-Package (PoP) components are BGA packages stacked on each other. With this method not only board space is saved, but… 
2010
2010
Package on package
The package on package structure is provided. Package on package in accordance with one embodiment of the present invention is… 
2010
2010
Development of a new Package-on-Package (PoP) structure for next-generation portable electronics
Package-on-Package (PoP) is one of the major 3D packaging approaches. It vertically combines discrete memory and logic Ball Grid… 
2010
2010
Study on heat dissipation in Package-on-Package (POP)
  • X. QiuJun Wang
  • 11th International Conference on Electronic…
  • 2010
  • Corpus ID: 22412718
Higher packaging density is driven by the multi-functional requirements and size shrinkage in handheld applications, which was… 
2009
2009
Thermal design optimization of a package on package
In the past decade, compact components such as Chip Scale Packages and flip chips were the work horses of miniaturization… 
2008
2008
Thermal Characterization of Package-on-Package (PoP) Configuration through Modeling
PoP, Package-on-Package, becomes more and more popular in IC packaging industry because it provides a practical solution to… 
2007
2007
PoP (Package-on-Package) Stacking Yield Loss Study
  • K. Ishibashi
  • Proceedings 57th Electronic Components and…
  • 2007
  • Corpus ID: 44048375
BGA package warpage during reflow soldering can cause open solder joint failure and in PoP case it's more critical to top joint… 
2007
2007
Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill
In spite of a great success of stacked package (PoP) in the market, some reliability issues have been raised. One of them is a… 
2007
2007
Development of thin Flip-Chip BGA for Package on Package
A thin flip-chip (FC) BGA with a 65 nm device has been developed for the bottom package of package on package (PoP) packaging for… 
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