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Package on package

Known as: Stacked package, PoP memory, Multi-stacked package 
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages… Expand
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2016
Highly Cited
2016
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of… Expand
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2015
2015
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased… Expand
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2011
2011
This paper discusses a new 3D “Package-Interposer-Package” (PIP) solution suitable for combining multiple memory, ASICs, stacked… Expand
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2009
2009
The need to integrate more device technology in a given board space for handheld applications such as mobile phones has driven… Expand
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Highly Cited
2009
Highly Cited
2009
A simple top-down method for realizing an array of vertically stacked nanowires is presented. The process utilizes the… Expand
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2008
2008
  • C. Yang
  • 10th Electronics Packaging Technology Conference
  • 2008
  • Corpus ID: 40812616
PoP, Package-on-Package, becomes more and more popular in IC packaging industry because it provides a practical solution to… Expand
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2008
2008
In recent years, Package on Package (PoP), in which a top memory packaging system is connected to a bottom logic package via… Expand
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Highly Cited
2007
Highly Cited
2007
This paper presents information concerning high density package-on-package (PoP) development which utilizes 0.5 mm top land pitch… Expand
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2007
2007
  • K. Ishibashi
  • Proceedings 57th Electronic Components and…
  • 2007
  • Corpus ID: 44048375
BGA package warpage during reflow soldering can cause open solder joint failure and in PoP case it's more critical to top joint… Expand
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2007
2007
Fast growing package-on-package (POP) technology provides cost effective format to ASIC and memory devices. Similar to die… Expand
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