Package on package

Known as: Stacked package, PoP memory, Multi-stacked package 
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages… (More)
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Topic mentions per year

Topic mentions per year

1999-2016
0204019992016

Papers overview

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2011
2011
This paper presents a novel enabling technique exploiting interposer approach such as silicon and package interposer in the area… (More)
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2010
2010
The 3D market continues to be driven by mobile applications. The technology integrates devices or packages in the vertical… (More)
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2009
2009
In the past decade, compact components such as Chip Scale Packages and flip chips were the work horses of miniaturization… (More)
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2009
2009
A study was initiated in order to thermally quantify the characteristics of package-on-package (POP), which has been deployed in… (More)
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2008
2008
POP (package-on-package) integration is achieved by stacking laminate substrate packages in vertical direction and… (More)
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2008
2008
The needs to integrate devices into portable products with smaller form factor and more functionality have fueled enormous growth… (More)
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2007
2007
The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system… (More)
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2007
2007
BGA package warpage during reflow soldering can cause open solder joint failure and in PoP case it's more critical to top joint… (More)
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2007
2007
This paper presents information concerning high density package-on-package (PoP) development which utilizes 0.5 mm top land pitch… (More)
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2006
2006
This paper outlines package stacking process guidelines for a package-on-package (PoP) configuration. PoP stacks currently in… (More)
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