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Package on package

Known as: Stacked package, PoP memory, Multi-stacked package 
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages… 
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Papers overview

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2020
2020
The Lakefield processor combines heterogeneous 3D die stacking also called Foveros, with hybrid computing to enable a new class… 
Highly Cited
2016
Highly Cited
2016
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of… 
2015
2015
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased… 
2011
2011
This paper discusses a new 3D “Package-Interposer-Package” (PIP) solution suitable for combining multiple memory, ASICs, stacked… 
Highly Cited
2009
Highly Cited
2009
A simple top-down method for realizing an array of vertically stacked nanowires is presented. The process utilizes the… 
2009
2009
The need to integrate more device technology in a given board space for handheld applications such as mobile phones has driven… 
Highly Cited
2007
Highly Cited
2007
This paper presents information concerning high density package-on-package (PoP) development which utilizes 0.5 mm top land pitch… 
2007
2007
  • K. Ishibashi
  • Proceedings 57th Electronic Components and…
  • 2007
  • Corpus ID: 44048375
BGA package warpage during reflow soldering can cause open solder joint failure and in PoP case it's more critical to top joint…