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Multi-project wafer service

Known as: Multi Project Chip, Multi Project Wafer, MPC 
Multi-project chip (MPC), also known as multi-project wafer (MPW), services integrate onto microelectronics wafers a number of different integrated… 
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Papers overview

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2017
2017
Optical sensors based on Fiber Bragg Gratings (FBGs) are used in several applications and industries. In order for fiber optic… 
2017
2017
Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in… 
Highly Cited
2016
Highly Cited
2016
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and… 
Review
2015
Review
2015
Integrated quantum photonic applications, providing physically guaranteed communications security, subshot-noise measurement, and… 
2014
2014
This paper describes design methodologies developed for silicon photonics integrated circuits. The approach presented is inspired… 
2014
2014
In this paper we report on the progress in the development of modelocked ring lasers that are integrated on a single chip in the… 
Review
2012
Review
2012
An overview is presented of the current state‐of‐the‐art in silicon nanophotonic ring resonators. Basic theory of ring resonators… 
2012
2012
A monolithic InGaAsP/InP 4 × 4 cross-connect is designed, fabricated and demonstrated. Each of the four inputs fan out to two… 
2011
2011
We demonstrate one of the first monolithically integrated multiwavelength lasers fabricated in an industrial fab exploring a… 
Highly Cited
2010
Highly Cited
2010
A 0.13 µm SiGe BiCMOS technology for millimeter wave applications is presented. This technology features high-speed HBTs (f<inf>T…