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Multi-project wafer service

Known as: Multi Project Chip, Multi Project Wafer, MPC 
Multi-project chip (MPC), also known as multi-project wafer (MPW), services integrate onto microelectronics wafers a number of different integrated… Expand
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Papers overview

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2018
2018
A digital cell library operating in the near-threshold voltage (NTV) region is presented to obtain both high energy efficiency… Expand
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2017
2017
Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in… Expand
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2015
2015
Characterization of quanta image sensor pixels with deep sub-electron read noise is reported. Pixels with conversion gain of $423… Expand
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2014
2014
In this paper we report on the progress in the development of modelocked ring lasers that are integrated on a single chip in the… Expand
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2014
2014
This paper describes design methodologies developed for silicon photonics integrated circuits. The approach presented is inspired… Expand
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2013
2013
In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being… Expand
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2012
2012
A monolithic InGaAsP/InP 4 × 4 cross-connect is designed, fabricated and demonstrated. Each of the four inputs fan out to two… Expand
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2011
2011
We demonstrate one of the first monolithically integrated multiwavelength lasers fabricated in an industrial fab exploring a… Expand
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Highly Cited
2009
Highly Cited
2009
A 0.13 µm SiGe BiCMOS technology for millimeter wave applications is presented. This technology features high-speed HBTs (f<inf>T… Expand
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2007
2007
A CMOS integrated circuit hosting an array of 80 sensors for DNA hybridization detection was designed. Each biosensor is made up… Expand
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