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Multi-project wafer service

Known as: Multi Project Chip, Multi Project Wafer, MPC 
Multi-project chip (MPC), also known as multi-project wafer (MPW), services integrate onto microelectronics wafers a number of different integrated… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in… 
2015
2015
An MMI-based polarization splitter/combiner with a TE-TM splitting ratio above 15 dB over a 21 nm wavelength range is… 
2013
2013
In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being… 
2011
2011
A major cost in semiconductor manufacturing is the generation of photo masks which are used to produce the dies. When producing… 
Highly Cited
2010
Highly Cited
2010
A 0.13 µm SiGe BiCMOS technology for millimeter wave applications is presented. This technology features high-speed HBTs (f<inf>T… 
2007
2007
This paper reports a CMOS-integrated three-axial force sensor system realized using a post-CMOS compatible low-temperature… 
2007
2007
A CMOS integrated circuit hosting an array of 80 sensors for DNA hybridization detection was designed. Each biosensor is made up… 
2006
2006
Chip floorplan in a reticle for Multi-Project Wafer (MPW) plays a key role in deciding chip fabrication cost. In this paper, we… 
2005
2005
The cost of masks is rising rapidly as semiconductor manufacturing technology advances. This increase in cost is a major issue in… 
2005
2005
The multi-project wafer (MPW) is commonly used for low-volume IC production. In this paper, we study whether it can be used for…