Multi-project wafer service

Known as: Multi Project Chip, Multi Project Wafer, MPC 
Multi-project chip (MPC), also known as multi-project wafer (MPW), services integrate onto microelectronics wafers a number of different integrated… (More)
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Papers overview

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2017
2017
Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in… (More)
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2015
2015
Characterization of quanta image sensor pixels with deep sub-electron read noise is reported. Pixels with conversion gain of $423… (More)
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2013
2013
We demonstrated monolithic integration of pseudo-spin-MOSFETs (PS-MOSFETs) using vendor-made MOSFETs fabricated in a low-cost… (More)
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2012
2012
We report on several multi-project wafer (MPW) platforms for optoelectronic systems, which support monolithic integration of… (More)
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2011
2011
We demonstrate one of the first monolithically integrated multiwavelength lasers fabricated in an industrial fab exploring a… (More)
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2007
2007
While the SOI (Silicon-On-Insulator) device concept is very old, commercialization of the technology is relatively new and… (More)
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2006
2006
Chip floorplan in a reticle for Multi-Project Wafer (MPW) plays a key role in deciding chip fabrication cost. In this paper, we… (More)
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2005
2005
The cost of masks is rising rapidly as semiconductor manufacturing technology advances. This increase in cost is a major issue in… (More)
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2005
2005
Multi-project wafer has become a low-cost avenue to gain access to more advanced process technology via amortizing mask cost… (More)
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2005
2005
A multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In… (More)
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