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Multi-project wafer service
Known as:
Multi Project Chip
, Multi Project Wafer
, MPC
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Multi-project chip (MPC), also known as multi-project wafer (MPW), services integrate onto microelectronics wafers a number of different integrated…
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Related topics
Related topics
7 relations
Broader (3)
Electronic design automation
Electronic engineering
Semiconductor device fabrication
Foundry model
Integrated circuit
MOSIS
WaferCatalyst
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Development of a Multi-project Fan-Out Wafer Level Packaging Platform
T. Braun
,
S. Raatz
,
+14 authors
M. Kaynak
Electronic Components and Technology Conference
2017
Corpus ID: 31491084
Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in…
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2015
2015
MMI-based polarization beam splitter/combiner for InP photonic integrated circuits
M. Felicetti
,
K. Kojima
,
+4 authors
E. Yagyu
2015
Corpus ID: 16443626
An MMI-based polarization splitter/combiner with a TE-TM splitting ratio above 15 dB over a 21 nm wavelength range is…
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2013
2013
Semi-insulating substrate based generic InP photonic integration platform
F. Soares
,
K. Janiak
,
J. Kreissl
,
M. Moehrle
,
N. Grote
Microtechnologies for the New Millennium
2013
Corpus ID: 109722402
In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being…
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2011
2011
Optimal wafer cutting in shuttle layout problems
Lasse Nisted
,
David Pisinger
,
A. Altman
Journal of combinatorial optimization
2011
Corpus ID: 8661004
A major cost in semiconductor manufacturing is the generation of photo masks which are used to produce the dies. When producing…
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Highly Cited
2010
Highly Cited
2010
A 0.13µm SiGe BiCMOS technology featuring fT/fmax of 240/330 GHz and gate delays below 3 ps
H. Rücker
,
B. Heinemann
,
+19 authors
Y. Yamamoto
IEEE Bipolar/BiCMOS Circuits and Technology…
2010
Corpus ID: 12107058
A 0.13 µm SiGe BiCMOS technology for millimeter wave applications is presented. This technology features high-speed HBTs (f<inf>T…
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2007
2007
CMOS-integrated silicon 3d force sensor system for micro component coordinate measurement machines
B. Levey
,
P. Gieschke
,
M. Doelle
,
A. Trautmann
,
P. Ruther
,
O. Paul
IEEE/LEOS International Conference on Optical…
2007
Corpus ID: 43697088
This paper reports a CMOS-integrated three-axial force sensor system realized using a post-CMOS compatible low-temperature…
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2007
2007
A CMOS integrated circuit for DNA hybridization detection with digital output and temperature control
A. Caboni
,
Daniela Loi
,
M. Barbaro
Ph.D Research in Microelectronics and Electronics…
2007
Corpus ID: 43473123
A CMOS integrated circuit hosting an array of 80 sensors for DNA hybridization detection was designed. Each biosensor is made up…
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2006
2006
Design Space Exploration for Minimizing Multi-Project Wafer Production Cost
Rung-Bin Lin
,
Meng-Chiou Wu
,
Wei-Chiu Tseng
,
Ming-Hsine Kuo
,
Tsai-Ying Lin
,
Shr-Cheng Tsai
Asia and South Pacific Conference on Design…
2006
Corpus ID: 9886920
Chip floorplan in a reticle for Multi-Project Wafer (MPW) plays a key role in deciding chip fabrication cost. In this paper, we…
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2005
2005
An innovative model of multi-project wafer service in the foundry industry
Tai-Yih Yang
,
L. Tong
,
Benjamin J. C. Yuan
International Journal of Technology Management
2005
Corpus ID: 34115506
The cost of masks is rising rapidly as semiconductor manufacturing technology advances. This increase in cost is a major issue in…
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2005
2005
Multiple project wafers for medium-volume IC production
Meng-Chiou Wu
,
Rung-Bin Lin
IEEE International Symposium on Circuits and…
2005
Corpus ID: 16510670
The multi-project wafer (MPW) is commonly used for low-volume IC production. In this paper, we study whether it can be used for…
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