Skip to search formSkip to main contentSkip to account menu

Multi-project wafer service

Known as: Multi Project Chip, Multi Project Wafer, MPC 
Multi-project chip (MPC), also known as multi-project wafer (MPW), services integrate onto microelectronics wafers a number of different integrated… 
Wikipedia (opens in a new tab)

Related topics

Related topics

7 relations

Broader (3)

Electronic design automationElectronic engineeringSemiconductor device fabrication
Foundry modelIntegrated circuitMOSISWaferCatalyst

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Prototyping of an HV-CMOS demonstrator for the High Luminosity-LHC upgrade
HV-CMOS sensors can offer important advantages in terms of material budget, granularity and cost for large area tracking systems… 
2015
2015
MMI-based polarization beam splitter/combiner for InP photonic integrated circuits
An MMI-based polarization splitter/combiner with a TE-TM splitting ratio above 15 dB over a 21 nm wavelength range is… 
2013
2013
Semi-insulating substrate based generic InP photonic integration platform
In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being… 
2012
2012
An InP-based generic integration technology platform
This paper describes an InP foundry for receiver-type photonic-integrated circuits. A low-contrast-, a medium-contrast-, and a… 
2011
2011
Optimal wafer cutting in shuttle layout problems
A major cost in semiconductor manufacturing is the generation of photo masks which are used to produce the dies. When producing… 
Highly Cited
2010
Highly Cited
2010
A 0.13µm SiGe BiCMOS technology featuring fT/fmax of 240/330 GHz and gate delays below 3 ps
A 0.13 µm SiGe BiCMOS technology for millimeter wave applications is presented. This technology features high-speed HBTs (f<inf>T… 
2007
2007
CMOS-integrated silicon 3d force sensor system for micro component coordinate measurement machines
This paper reports a CMOS-integrated three-axial force sensor system realized using a post-CMOS compatible low-temperature… 
2007
2007
Reticle Exposure Plans for Multi-Project Wafers
A reticle exposure plan for a multi-project wafer (MPW) defines the sites where reticle images are printed on the wafer. In this… 
2006
2006
Design Space Exploration for Minimizing Multi-Project Wafer Production Cost
Chip floorplan in a reticle for Multi-Project Wafer (MPW) plays a key role in deciding chip fabrication cost. In this paper, we… 
2005
2005
An innovative model of multi-project wafer service in the foundry industry
The cost of masks is rising rapidly as semiconductor manufacturing technology advances. This increase in cost is a major issue in… 
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)