Lead frame

Lead frames are the metal structures inside a chip package that carry signals from the die to the outside. The die inside the package is typically… (More)
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Papers overview

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2013
2013
It is well-known that thick substrate core has obviously increased package thickness and also weakened device performance… (More)
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2011
2011
The response surface methodology (RSM) for modelling IC packages is presented. The segmentation of the lead frame of an IC… (More)
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2011
2011
Several candidate alloys have been suggested as high-temperature lead-free solder for Si die attachment by different researchers… (More)
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2011
2011
QFN and Dual row QFN (DR-QFN) are mature packages which the current industry can only provide IC assembly for body size less than… (More)
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2010
2010
In today's lead frame IC packages, the cost of lead frames account for one of the largest portion of material costs. Etched lead… (More)
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2006
2006
End customer in circuit test rejects at a rate of 2-5% was sent back to manufacturer for analysis and inspection. Electrical… (More)
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2006
2006
It was discussed the lead-frame driving structure moving along straight rail intermittently, especially the 3D cam in the… (More)
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2001
2001
This paper presents a direct extraction method to construct the electrical models of lead-frame plastic CSPs (Chip Scale Packages… (More)
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1999
1999
The inspection of lead-frame is important in semiconductor industry. During the production process, the quality control of lead… (More)
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1999
1999
Copper alloys have recently been finding increasing demand for lead frame due to their electrical property. There is, however, a… (More)
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