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Lead frame

Lead frames are the metal structures inside a chip package that carry signals from the die to the outside. The die inside the package is typically… 
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Related topics

7 relations
Chip carrierDual in-line packageFailure of electronic componentsQuad Flat No-leads package

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2014
Review
2014
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review
2013
2013
Novel packaging design for high-power GaN-on-Si high electron mobility transistors (HEMTs)
2009
2009
Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs
2008
2008
Sulfur-contamination of high power white LED
2006
2006
Simulation and analysis for typical package assembly manufacture
The manufacturing process for package assembly is a key to assuring the reliability and quality of the semiconductor products… 
2005
2005
A new ART-counterpropagation neural network for solving a forecasting problem
2005
2005
High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits
Application of low-cost commercial plastic encapsulated microcircuits (PEMs) for military and aerospace applications requires… 
2002
2002
Trends and development of copper alloys for lead frame
Lead frames are one of the most important component parts of discrete and IC devices, which provide electrical interconnection to… 
2001
2001
Simultaneous switching noise suppression for high speed systems using embedded decoupling
High performance computing systems are driving towards higher clock speeds, more switching circuits, and lower operating voltages… 
1995
1995
Capacitive leadframe testing
Pin-level diagnosis of open solder joints allows manufacturers to tune SMT process for maximum output. Repair time and repair… 
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