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Land grid array

Known as: Array, Ceramic land grid array, LGA 
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when… 
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Papers overview

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Review
2009
Review
2009
ABSTRACT Background The study obtained information on key growth promotion and developmental household and community health… 
2008
2008
For many years, the Flip Chip Plastic Ball Grid Array (FC-PBGA) has been the preferred packaging solution for microprocessors and… 
2008
2008
A very compact dual-band LTCC module supporting WiMAX IEEE 802.16e-2005 and Wi-Fi IEEE 802.11a/b/g standards is presented. The… 
2004
2004
提供一种在元件侧接地电极(6)和基板侧接地电极(9),及元件侧周边电极(7)和基板侧周边电极(10)通过共晶焊锡(16)进行锡焊的构造的连接盘栅格阵列型封装中,在元件侧接地电极(6)中的锡焊区域(18)内,以形成贯通安装基板(3)的气体抽出用贯通孔(15… 
2000
2000
Since its first technology qualification in 1996 in IBM’s Advanced Semiconductor Technology Center (ASTC), Hopewell Junction, NY… 
1986
1986
Photogeologic analysis and fieldworks in the Bunge Glacier area indicate symptoms of the Late Quaternary tectonic phenomena in… 
1983
1983
Pingos have previously been recorded from East and West Greenland, but not from North Greenland. Two finds in Peary Land…