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Hot Interconnects

Known as: Symposium on High Performance Interconnects 
Hot Interconnects is an IEEE sponsored international symposium on High Performance Interconnects held every year starting 1993. The symposium intends… 
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Related topics

Related topics

2 relations
Electrical connectionHot Chips

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
Novel Approach for Improved Signal Integrity and Power Dissipation Using MLGNR Interconnects
In order to reduce the crosstalk-induced delay along with the impact of peak noise on the victim line, this paper introduces a… 
2018
2018
Modeling and Performance Analysis of MLGNR Interconnects
In this work, we have presented the temperature-dependent analytical time domain model for top-contact multilayer graphene… 
2018
2018
Preeminent Buffer Insertion Technique For Long Advanced On-Chip Graphene Interconnects
Graphene has become as one of the prospective on-chip VLSI interconnect materials due to its several superior electrical and… 
2015
2015
An odd-even model for diagnosis of shorts on NoC interconnects
Interconnect shorts in a network-on-chip (NoC) have caused data overloading and misrouting that make an extra burden on… 
2015
2015
Implementing Ultra Low Latency Data Center Services with Programmable Logic
Data centers require many low-level network services to implement high-level applications. Key-Value Store (KVS) is a critical… 
2011
2011
A Cost-Efficient L1–L2 Multicore Interconnect: Performance, Power, and Area Considerations
Processor manufacturers use advances in manufacturing technologies to increase the number of cores on chip in order to scale… 
2009
2009
LEAD FREE MICROELECTRONICS PACKAGING FOR BIOMEDICAL APPLICATIONS
Global environmental concerns and pending legislation have driven the action towards Pb free electronics. Biomedical… 
2008
2008
Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints
For the future advanced applications in consumer electronic products, the need of flexible interconnects increases rapidly. The… 
2008
2008
The observation of stress-induced leakage current of damascene interconnects after bias temperature aging
Time-dependent dielectric breakdown (TDDB) was investigated, noting the time variation of stress-induce leakage current (SILC… 
Review
2005
Review
2005
Hot Chips and Hot Interconnects for High End Computing Systems
I will discuss several processors: 1. The Cray proprietary processor used in the Cray X1; 2. The IBM Power 3 and Power 4 used in… 
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