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FOUP

FOUP is an acronym for Front Opening Unified Pod or Front Opening Universal Pod. It is a specialised plastic enclosure designed to hold silicon… 
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Related topics

Related topics

4 relations
Radio frequencySMIF (interface)Wafer (electronics)

Broader (1)

Semiconductor device fabrication

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Impact of FOUP environment on product yield in advanced technologies
Historically, much attention has been given to the unit processes and the integration of those unit processes to improve product… 
2014
2014
Advanced FOUP purge using diffusers for FOUP door-off application
In a number of key IC fabrication steps in-process wafers are sensitive to moisture, oxygen and other airborne molecular… 
2013
2013
Purging of foup for 450 mm wafer manufacturing
This study is designated to experimentally determine the effect of clean dry air (CDA) purging rate on purging efficiency in a… 
2012
2012
FOUP environment control and condense reduction
The effects on the mini-environment of FOUP (Front Opening Unified Pod) by N2 purge are evaluated with various processes. From… 
2009
2009
Ant Colony Optimization Approaches for Scheduling Jobs with Incompatible Families on Parallel Batch Machines
In this paper, we suggest an Ant Colony System (ACS) to solve a scheduling problem for jobs with incompatible families on… 
2009
2009
NN-Based Key-Variable Selection Method for Enhancing Virtual Metrology Accuracy
This paper proposes an advanced key-variable selection method, the neural-network-based stepwise selection (NN-based SS) method… 
2009
2009
Dynamic Analysis on Particle Concentration Induced by Opening the Door of a Front Opening Unified Pod (FOUP) that Loaded with 25 Pieces of 300 mm Wafer Manufacturing Processes
This study investigates experimentally and numerically the influences of FOUP door opening speed (V(subscript door)) and the… 
2004
2004
Comparative factory analysis of standard FOUP capacities
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening… 
2003
2003
The evaluation of manual FOUP handling in 300-mm wafer fab
Semiconductor manufacturing industry is moving into the production of 300-mm wafers. To solve the increased workload problem in… 
2001
2001
Improvement of 300mm FOUP mini-environment
Evaluates both mechanical and process characteristics of FOUPs (front opening unifed pods) and improves performance through… 
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