Eutectic bonding

Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a… (More)
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Topic mentions per year

Topic mentions per year

2000-2017
05101520002017

Papers overview

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2014
2014
Glass (7740) and silicon (100) wafer are bonded using gold as the bonding medium and annealed to enhance the bonding strength at… (More)
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2014
2014
This paper presents a new method for wafer-level hermetic encapsulation of MEMS devices using low-temperature (280 to 300°C) Au… (More)
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2012
2012
This paper presents a novel gas microvalve design concept, in which a flow control gate is opened by a pneumatic pressure and… (More)
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2012
2012
Metal bonding is the most promising die-attach process in high power LED package, which has lower thermal resistance and higher… (More)
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2011
2011
An assembly method for three-dimensional microelements is presented. The assembly is done in situ with a micromanipulator in an… (More)
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2009
2009
Low-temperature Aluminum-Germanium (Al-Ge) eutectic bonding has been investigated for monolithic three-dimensional integrated… (More)
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2004
2004
Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio… (More)
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2003
2003
Conventional bonding techniques using gold-tin preform or paste often require a process temperature over 320/spl deg/C to ensure… (More)
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2001
2001
  • R. F. WoHenbuttel
  • 2001
Micromechanical smart sensor and actuator systems of high complexity bemme commercially viable when realized as a multi-wafer… (More)
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Highly Cited
2000
Highly Cited
2000
Silicon fusion and eutectic bonding processes based on the technique of localized heating have been successfully demonstrated… (More)
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