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Eutectic bonding

Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a… 
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Related topics

Related topics

3 relations
Physical vapor depositionReactive bondingWafer bonding

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Molten salt-directed synthesis method for LiMn2O4 nanorods as a cathode material for a lithium-ion battery with superior cyclability
A molten salt synthesis technique has been used to prepare nanorods of Mn2O3 and single-crystal LiMn2O4 nanorods cathode material… 
2017
2017
Fracture toughness of ledeburitic Vanadis 6 steel after sub-zero treatment for 17 h and double tempering
The influence of sub-zero treatment on the fracture toughness of Cr-V ledeburitic steel Vanadis 6 was examined, in comparison… 
2017
2017
Formation of Cellular Structure on Metastable Solidification of Undercooled Eutectic CoSi-62 at. %
The relationship between emissivity, delay time, and surface growth for metastable solidification of CoSi-62 at. % eutectic… 
2010
2010
A New Two-Dimensional Actuator for Air Flow Micro-manipulation
A two dimensional pneumatic actuator based on silicon MEMS technology for objects micro-manipulation is presented. The device… 
2004
2004
Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging
Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio… 
2001
2001
Blanket Design Studies of a Lead-Bismuth Eutectic-Cooled Accelerator Transmutation of Waste System
Abstract The results of blanket design studies for a lead-bismuth eutectic (LBE)-cooled accelerator transmutation of waste system… 
Highly Cited
2000
Highly Cited
2000
In situ investigation of stage of the formation of eutectic alloys in Si–Au and Si–Al systems
Highly Cited
1989
Highly Cited
1989
Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopy
A new technique to produce perfect bonding between GaAs dice and alumina substrates is reported. Utilizing this technique, void… 
Review
1973
Review
1973
Electrochemical Studies of Titanium in Molten Fluorides
The electrochemical reduct ion of T i ( IV) in mol ten L i F N a F K F [46.5-11.542.0 mole per cent ( m / o ) ] at 500~ was s… 
1966
1966
ACTIVITY OF UCl$sub 3$ IN THE EUTECTIC MELT LiCl-KCl
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