Physical vapor deposition

Known as: Physical vapour deposition 
Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films. PVD uses physical process… (More)
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Topic mentions per year

Topic mentions per year

1980-2017
0204019802017

Papers overview

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2012
2012
A helicon antenna that sits remotely outside the vacuum system is attached to a magnetron sputtering system. This increases the… (More)
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2011
2011
We report the growth of high quality zinc oxide (ZnO) nanowires on [100] n-type silicon substrates using a physical vapor… (More)
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2006
2006
Ionized metal physical vapor deposition is being increasingly used to deposit diffusion barriers and Cu seed layers into high… (More)
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2005
2005
We present the use of an oblique angle physical vapor deposition sOAPVDd technique with substrate rotation to obtain conformal… (More)
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2004
2004
It is well established that low pressure physical vapor deposition processes such as thermal evaporation and the many variants of… (More)
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2001
2001
Ionized metal physical vapor deposition ~IMPVD! is a process in which sputtered metal atoms from a magnetron target are ionized… (More)
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2001
2001
Low-pressure sputtering and ionized vapor deposition processes create atomic fluxes with kinetic energies in the 1.0–20 eV (and… (More)
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2000
2000
Ionized metal physical vapor deposition ~IMPVD! is a process in which sputtered metal atoms from a magnetron target are ionized… (More)
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Review
1997
Review
1997
Interconnects, once the technological backwater of integrated circuit technology, now dominate integrated circuit cost and… (More)
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1997
1997
The filling of deep vias and trenches with metal for interconnect layers in microelectronic devices requires anisotropic… (More)
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