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Equivalent oxide thickness
Known as:
EOT
An Equivalent oxide thickness is a distance, usually given in nanometers (nm), which indicates how thick a silicon oxide film would need to be to…
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2 relations
Doping (semiconductor)
Semiconductor
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2014
Highly Cited
2014
Extreme Rainfall Variability in Australia: Patterns, Drivers, and Predictability*
A. King
,
N. Klingaman
,
L. Alexander
,
M. Donat
,
N. Jourdain
,
P. Maher
2014
Corpus ID: 53354177
AbstractLeading patterns of observed monthly extreme rainfall variability in Australia are examined using an empirical orthogonal…
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Review
2010
Review
2010
A Survey of Environment-, Operator-, and Task-adapted Controllers for Teleoperation Systems
Carolina Passenberg
,
A. Peer
,
M. Buss
2010
Corpus ID: 14608043
Highly Cited
2008
Highly Cited
2008
A 32nm logic technology featuring 2nd-generation high-k + metal-gate transistors, enhanced channel strain and 0.171μm2 SRAM cell size in a 291Mb array
S. Natarajan
,
M. Armstrong
,
+40 authors
K. Zhang
IEEE International Electron Devices Meeting
2008
Corpus ID: 27551897
A 32 nm generation logic technology is described incorporating 2nd-generation high-k + metal-gate technology, 193 nm immersion…
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Highly Cited
2008
Highly Cited
2008
A cost effective 32nm high-K/ metal gate CMOS technology for low power applications with single-metal/gate-first process
X. Chen
,
S. Samavedam
,
+43 authors
A. Steegen
Symposium on VLSI Technology
2008
Corpus ID: 6186135
For the first time, we have demonstrated a 32 nm high-k/metal gate (HK-MG) low power CMOS platform technology with low standby…
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Highly Cited
2007
Highly Cited
2007
Charge trapping characteristics of atomic-layer-deposited HfO2 films with Al2O3 as a blocking oxide for high-density non-volatile memory device applications
S. Maikap
,
H. Y. Lee
,
+6 authors
M. Tsai
2007
Corpus ID: 53374291
Charge trapping characteristics of high-relative permittivity (high-κ) HfO2 films with Al2O3 as a blocking oxide in p-Si/SiO2…
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Review
2006
Review
2006
Overview and status of metal S/D Schottky-barrier MOSFET technology
J. Larson
,
J. Snyder
IEEE Transactions on Electron Devices
2006
Corpus ID: 1516723
In this paper, the metal source/drain (S/D) Schottky-barrier (SB) MOSFET technology is reviewed. The technology offers several…
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Highly Cited
2006
Highly Cited
2006
How light emerges from an illuminated array of subwavelength holes
J. Bravo-Abad
,
A. Degiron
,
+4 authors
T. Ebbesen
2006
Corpus ID: 121201118
The extraordinary optical transmission through periodic arrays of subwavelength holes has been studied extensively since it was…
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Highly Cited
2006
Highly Cited
2006
Estimation of fixed charge densities in hafnium-silicate gate dielectrics
Vidya S. Kaushik
,
Barry J. O’Sullivan
,
+10 authors
M. Heyns
IEEE Transactions on Electron Devices
2006
Corpus ID: 33235182
In this paper, an effective technique and methodology for the estimation of fixed charge components in high-k stacks was…
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Highly Cited
2000
Highly Cited
2000
Electrical characteristics of high quality La2O3 gate dielectric with equivalent oxide thickness of 5 /spl Aring/
Y.H. Wu
,
M.Y. Yang
,
A. Chin
,
W. Chen
,
C. Kwei
IEEE Electron Device Letters
2000
Corpus ID: 530175
Electrical and reliability properties of ultrathin La/sub 2/O/sub 3/ gate dielectric have been investigated. The measured…
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Highly Cited
1996
Highly Cited
1996
Gate oxide scaling limits and projection
C. Hu
1996
Corpus ID: 9460483
MOSFET gate oxide scaling limits are examined with respect to time-dependent breakdown, defects, plasma process damage, mobility…
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