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Dram Mass Unit
Known as:
[fdr_us]
, Avoirdupois Dram
, 1 [oz_av]/16
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The non-SI unit of mass equal to 1/16 Avoirdupois ounce or 1/256 Avoirdupois pound. One dram equals approximately 1.7718451953125 grams.
National Institutes of Health
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Apothecaries Dram Mass Unit
Clinical Data Interchange Standards Consortium Terminology
Papers overview
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2017
2017
Mapping of CMOS FET degradation in bias space—Application to dram peripheral devices
B. Kaczer
,
J. Franco
,
+9 authors
N. Horiguchi
2017
Corpus ID: 44184127
Mapping and visualization of all degradation modes in both n- and p-channel field effect transistors, specifically devices for…
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2014
2014
Continued frequency scaling in 3D ICs through micro-fluidic cooling
Caleb Serafy
,
Ankur Srivastava
,
D. Yeung
Intersociety Conference on Thermal and…
2014
Corpus ID: 8781017
Core scaling has largely replaced frequency scaling in general purpose microprocessors in the last decade. This is largely…
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2013
2013
4T DRAM based on Self-controllable Voltage Level technique for low leakage power in VLSI
L. Singh
,
A. Somkuwar
2013
Corpus ID: 2409830
In present trend of integration will continue in the projected future. When comparing the integration density of integrated…
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2009
2009
A Novel Approach to Analyze and Model Feature Size Effects in CMP
J. Urbach
,
R. Rzehak
IEEE transactions on semiconductor manufacturing
2009
Corpus ID: 27154155
In order to characterize and model the pitch dependency of the step-height decay in a typical oxide CMP process, we measured…
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2000
2000
A 60-MHz 240-mW MPEG-4 videophone LSI with 16-Mb embedded DRAM
Masafumi Takahashi
,
T. Nishikawa
,
+16 authors
T. Furuyama
IEEE Journal of Solid-State Circuits
2000
Corpus ID: 16139887
A 240-mW single-chip MPEG-4 videophone LSI with a 16-Mb embedded DRAM is fabricated utilizing a 0.25-/spl mu/m CMOS triple-well…
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1999
1999
Current state of 300-mm lithography in a pilot line environment
A. Charles
,
J. Maltabes
,
+7 authors
R. Otto
Advanced Lithography
1999
Corpus ID: 108887927
SEMICONDUCTOR300 (SC300) is the first pilot manufacturing facility for 300 mm wafers in the world. This company, a joint venture…
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1997
1997
Low-Power and High-Speed Advantages of DRAM-Logic Integration for Multimedia Systems (Special Issue on Low-Power and High-Speed LSI Technologies)
Takao Watanabe
,
R. Fujita
,
K. Yanagisawa
1997
Corpus ID: 60486134
1995
1995
New recipe for a wee DRAM
S. Streiffer
,
A. Kingon
Nature
1995
Corpus ID: 4355650
1993
1993
250 Mbyte/sec synchronous DRAM using a 3-stage-pipelined architecture
Y. Takai
,
M. Nagase
,
+6 authors
H. Watanabe
Symposium on VLSI Circuits
1993
Corpus ID: 62229126
A 3.3 V 512 k/spl times/18/spl times/2 bank synchronous DRAM has been developed using a novel 3-stage-pipelined architecture. The…
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1990
1990
1X deep-UV lithography with chemical amplification for 1-micron DRAM production
J. Maltabes
,
S. Holmes
,
+8 authors
Hiroshi Ito
Advanced Lithography
1990
Corpus ID: 135530076
This paper describes methods used and results obtained in the production of 1-megabit (Mb) DRAM chips, using a chemically…
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