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Daisy chain (electrical engineering)

Known as: Daisy chain, Scuzzy chain, Daisy chain (information technology) 
In electrical and electronic engineering a daisy chain is a wiring scheme in which multiple devices are wired together in sequence or in a ring… 
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Related topics

Related topics

50 relations
AmplifierAnalog signalApple Desktop BusApple Thunderbolt Display

Broader (1)

Electrical engineering

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Ultra-thin chips of less than 20μm become flexible, allowing integration of silicon IC technology with highly flexible… 
2012
2012
Reliability of column/board/CCGA attachment
Commercial-off-the-shelf column grid array packaging (COTS CCGA) technologies are now being considered for use in a number of… 
2012
2012
A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment
2011
2011
Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch
The demand for high-density electronic applications is growing. This work develops a novel chip-on-flex (COF) package with… 
2010
2010
New Masterless Modular Current-Sharing technique for DC/DC Parallel converters
This article presents a new Masterless Modular Current-Sharing (MMCS) technique. Current-sharing modules are identical and placed… 
2009
2009
Cu lateral interconnects formed between 100-µm-thick self-assembled chips on flexible substrates
A very new interconnection method, namely Cu lateral interconnection is proposed and tested for the heterogeneous multi-chip… 
2009
2009
Embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)
For maximizing space efficiency and reducing process steps, embedded chip-in-flex (CIF) packages using wafer level package (WLP… 
2007
2007
Ultrasonic Anisotropic Conductive Films (ACFs) Bonding of Flexible Substrates on Organic Rigid Boards at Room Temperature
In this study, a novel anisotropic conductive film (ACF) bonding method for flexible substrate-organic rigid board bonding was… 
2006
2006
Daisy Chain for Power Reduction in Inductive-Coupling CMOS Link
This paper discusses a daisy chain of current-drive transmitters in inductive-coupling CMOS links. Current is reused by multiple… 
2000
2000
Vibration fatigue of /spl mu/BGA solder joint
This paper studies the vibration fatigue failure of /spl mu/BGA solder-joints reflowed with different temperature profiles, and… 
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