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Daisy chain (electrical engineering)
Known as:
Daisy chain
, Scuzzy chain
, Daisy chain (information technology)
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In electrical and electronic engineering a daisy chain is a wiring scheme in which multiple devices are wired together in sequence or in a ring…
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Related topics
Related topics
50 relations
Amplifier
Analog signal
Apple Desktop Bus
Apple Thunderbolt Display
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Broader (1)
Electrical engineering
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
D. A. van den Ende
,
F. Verhoeven
,
+4 authors
J. van den Brand
European Microelectronics and Packaging…
2013
Corpus ID: 25644754
Ultra-thin chips of less than 20μm become flexible, allowing integration of silicon IC technology with highly flexible…
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2012
2012
Reliability of column/board/CCGA attachment
R. Ghaffarian
Intersociety Conference on Thermal and…
2012
Corpus ID: 20632312
Commercial-off-the-shelf column grid array packaging (COTS CCGA) technologies are now being considered for use in a number of…
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2012
2012
A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment
Qianwen Chen
,
Dingyou Zhang
,
+6 authors
Jian-Qiang Lu
2012
Corpus ID: 53451478
2011
2011
Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch
Su-Tsai Lu
,
Yu-Min Lin
,
Chun-Chih Chuang
,
Tai-Hong Chen
,
Wen-Hwa Chen
IEEE Transactions on Components, Packaging, and…
2011
Corpus ID: 22806518
The demand for high-density electronic applications is growing. This work develops a novel chip-on-flex (COF) package with…
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2010
2010
New Masterless Modular Current-Sharing technique for DC/DC Parallel converters
Mathieu Le Bolloch
,
Marc Cousineai
,
T. Meynard
Proceedings of 14th International Power…
2010
Corpus ID: 34465436
This article presents a new Masterless Modular Current-Sharing (MMCS) technique. Current-sharing modules are identical and placed…
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2009
2009
Cu lateral interconnects formed between 100-µm-thick self-assembled chips on flexible substrates
M. Murugesan
,
J. Bea
,
+8 authors
M. Koyanagi
Electronic Components and Technology Conference
2009
Corpus ID: 39172515
A very new interconnection method, namely Cu lateral interconnection is proposed and tested for the heterogeneous multi-chip…
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2009
2009
Embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)
Kyoung-Lim Suk
,
H.-Y Son
,
C. Chung
,
J. Kim
,
Jin-Woo Lee
,
K. Paik
Electronic Components and Technology Conference
2009
Corpus ID: 19516395
For maximizing space efficiency and reducing process steps, embedded chip-in-flex (CIF) packages using wafer level package (WLP…
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2007
2007
Ultrasonic Anisotropic Conductive Films (ACFs) Bonding of Flexible Substrates on Organic Rigid Boards at Room Temperature
Kiwon Lee
,
H. Kim
,
Il Kim
,
K. Paik
Proceedings 57th Electronic Components and…
2007
Corpus ID: 32556921
In this study, a novel anisotropic conductive film (ACF) bonding method for flexible substrate-organic rigid board bonding was…
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2006
2006
Daisy Chain for Power Reduction in Inductive-Coupling CMOS Link
M. Inoue
,
N. Miura
,
+5 authors
T. Kuroda
Symposium on VLSI Circuits, . Digest of Technical…
2006
Corpus ID: 17678766
This paper discusses a daisy chain of current-drive transmitters in inductive-coupling CMOS links. Current is reused by multiple…
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2000
2000
Vibration fatigue of /spl mu/BGA solder joint
P. Tu
,
Y. Chan
,
C. Tang
,
J. Lai
Proceedings. 50th Electronic Components and…
2000
Corpus ID: 55051501
This paper studies the vibration fatigue failure of /spl mu/BGA solder-joints reflowed with different temperature profiles, and…
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