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Bump mapping
Known as:
Bump
, Bump Map
, Bumpmap
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Bump mapping is a technique in computer graphics for simulating bumps and wrinkles on the surface of an object. This is achieved by perturbing the…
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Related topics
Related topics
49 relations
3D rendering
3Dc
ATI Rage
ATi Radeon R100 Series
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Broader (2)
Texture mapping
Virtual reality
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2013
Highly Cited
2013
DISCOVERY OF A RICH CLUSTER AT z = 1.63 USING THE REST-FRAME 1.6 μm “STELLAR BUMP SEQUENCE” METHOD
A. Muzzin
,
G. Wilson
,
+5 authors
A. Rettura
2013
Corpus ID: 51356919
We present a new two-color algorithm, the “Stellar Bump Sequence” (SBS), that is optimized for robustly identifying candidate…
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Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
N. Khan
,
V. S. Rao
,
+5 authors
L. Ebin
Electronic Components and Technology Conference
2008
Corpus ID: 40004399
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via…
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2008
2008
Carbon nanotube bumps for LSI interconnect
I. Soga
,
D. Kondo
,
+5 authors
T. Fujii
Electronic Components and Technology Conference
2008
Corpus ID: 22994343
We demonstrate, for the first time, carbon nanotube (CNT) flip chip bumps for LSI modules. The CNT bump is composed of a bundle…
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2006
2006
Auditory Feedback for Brain Computer Interface Management - An EEG Data Sonification Approach
Tomasz M. Rutkowski
,
Francois-Benois Vialatte
,
A. Cichocki
,
D. Mandic
,
A. Barros
International Conference on Knowledge-Based…
2006
Corpus ID: 3047080
An auditory feedback for Brain Computer Interface (BCI) applications is proposed. This is achieved based on the so-called…
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Review
2005
Review
2005
Low-cost wafer bumping
P. Gruber
,
L. Bélanger
,
+7 authors
M. Turgeon
IBM Journal of Research and Development
2005
Corpus ID: 13151753
As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several…
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Highly Cited
2004
Highly Cited
2004
Micro Cu Bump Interconnection on 3D Chip Stacking Technology
K. Tanida
,
M. Umemoto
,
N. Tanaka
,
Y. Tomita
,
Kenji Takahashi
2004
Corpus ID: 59328117
The three-dimensional (3D) chip stacking LSI technology under development at the Association of Super-Advanced Electronic…
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Highly Cited
2003
Highly Cited
2003
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications
C. Yin
,
M. Alam
,
Y. Chan
,
C. Bailey
,
Hua Lu
Microelectronics and reliability
2003
Corpus ID: 1952493
1998
1998
Gouraud bump mapping
I. Ernst
,
H. Rüsseler
,
H. Schulz
,
O. Wittig
Workshop on Graphics Hardware
1998
Corpus ID: 5199445
In this paper a new low cost bump mapping hardware is prcsented. The new hardware approach does not rely on per pixel lighting…
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Highly Cited
1994
Highly Cited
1994
The velocity field created by a shallow bump in a boundary layer
M. Gaster
,
C. Grosch
,
T. Jackson
1994
Corpus ID: 39506710
The results of measurements of the disturbance velocity field generated in a boundary layer by a shallow three‐dimensional bump…
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Highly Cited
1978
Highly Cited
1978
Primary Distance Perception
J. M. Foley
1978
Corpus ID: 124262969
Most of the time we do not bump into obstacles, fall into holes, or reach for objects well beyond our grasp. We are able to…
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