Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 237,159,853 papers from all fields of science
Search
Sign In
Create Free Account
Bump mapping
Known as:
Bump
, Bump Map
, Bumpmap
Expand
Bump mapping is a technique in computer graphics for simulating bumps and wrinkles on the surface of an object. This is achieved by perturbing the…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
49 relations
3D rendering
3Dc
ATI Rage
ATi Radeon R100 Series
Expand
Broader (2)
Texture mapping
Virtual reality
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Pentaquarks and resonances in the $pJ/\psi$ spectrum
V. Anisovich
,
M. Matveev
,
J. Nyíri
,
A. Sarantsev
,
A. Semenova
2015
Corpus ID: 117715900
We consider exotic baryons with hidden charm as antiquark-diquark-diquark composite systems. Spin and isospin structure of such…
Expand
2013
2013
Novel Bumping Process for Solder on Pad Technology
Kwang-Seong Choi
,
Ho-Eun Bae
,
Hyun-Cheol Bae
,
Y. Eom
2013
Corpus ID: 62578062
A novel bumping process using solder bump maker is developed for the maskless low‐volume solder on pad (SoP) technology of fine…
Expand
2013
2013
Compact and Accurate 3-D Face Modeling Using an RGB-D Camera: Let's Open the Door to 3-D Video Conference
Pavan Kumar Anasosalu Vasu
,
D. Thomas
,
A. Sugimoto
IEEE International Conference on Computer Vision…
2013
Corpus ID: 2524753
We present a method for producing an accurate and compact 3-D face model in real time using a low cost RGB-D sensor like the…
Expand
2013
2013
Optimization of Material and Process for Fine Pitch LVSoP Technology
Y. Eom
,
Jihye Son
,
Hyun-Cheol Bae
,
Kwang-Seong Choi
,
H. Choi
2013
Corpus ID: 58407891
For the formation of solder bumps with a fine pitch of 130 μm on a printed circuit board substrate, low‐volume solder on pad…
Expand
2010
2010
Novel Maskless Bumping for 3D Integration
Kwang-Seong Choi
,
Ki-Jun Sung
,
+4 authors
Y. Eom
2010
Corpus ID: 62253583
A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point…
Expand
2007
2007
A Complete Read-Out Channel With Embedded Wilkinson A/D Converter for X-Ray Spectrometry
A. Rossini
,
S. Caccia
,
+7 authors
N. Ratti
IEEE Transactions on Nuclear Science
2007
Corpus ID: 20273023
This paper presents a complete read-out channel suitable for large arrays of X-ray detectors to be used for spectrometry…
Expand
2005
2005
Wavelet bump extraction (WBE) for editing variable amplitude fatigue loadings.
S. Abdullah
2005
Corpus ID: 112429564
In durability testing of automobiles, load histories collected for laboratory testing are often lengthy in time. Therefore, a…
Expand
1992
1992
Flip-chip bonding optimizes opto-ICs
M. Wale
,
M. Goodwin
IEEE Circuits and Devices Magazine
1992
Corpus ID: 8449409
The development of fabrication techniques for optical components and hybrid assemblies based on flip-chip bonding is outlined. It…
Expand
1992
1992
Paradigms for the shaping of surfaces in a virtual environment
S. Bryson
Proceedings of the Twenty-Fifth Hawaii…
1992
Corpus ID: 6269365
This paper describes several paradigms for the direct manipulation of a surface in computer graphics. The surface is considered…
Expand
Highly Cited
1980
Highly Cited
1980
MINOS/AUGMENTED User's Manual.
B. Murtagh
,
M. Saunders
1980
Corpus ID: 56527337
Abstract : The scope of this manual is restricted to matters additional to those covered in the MINOS User's Guide (2). We assume…
Expand