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Bump mapping
Known as:
Bump
, Bump Map
, Bumpmap
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Bump mapping is a technique in computer graphics for simulating bumps and wrinkles on the surface of an object. This is achieved by perturbing the…
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Related topics
Related topics
49 relations
3D rendering
3Dc
ATI Rage
ATi Radeon R100 Series
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Broader (2)
Texture mapping
Virtual reality
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Review
2015
Review
2015
THE HUBBLE SPACE TELESCOPE UV LEGACY SURVEY OF GALACTIC GLOBULAR CLUSTERS. III. A QUINTUPLE STELLAR POPULATION IN NGC 2808
A. Milone
,
A. Marino
,
+9 authors
P. Ventura
2015
Corpus ID: 118444080
In this study we present the first results from multi-wavelength Hubble Space Telescope (HST) observations of the Galactic…
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Highly Cited
2013
Highly Cited
2013
DISCOVERY OF A RICH CLUSTER AT z = 1.63 USING THE REST-FRAME 1.6 μm “STELLAR BUMP SEQUENCE” METHOD
A. Muzzin
,
G. Wilson
,
+5 authors
A. Rettura
2013
Corpus ID: 51356919
We present a new two-color algorithm, the “Stellar Bump Sequence” (SBS), that is optimized for robustly identifying candidate…
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Highly Cited
2011
Highly Cited
2011
Characterization of Medipix3 With Synchrotron Radiation
E. Gimenez
,
R. Ballabriga
,
+6 authors
D. Turecek
IEEE Transactions on Nuclear Science
2011
Corpus ID: 21445085
Medipix3 is the latest generation of photon counting readout chips of the Medipix family. With the same dimensions as Medipix2…
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Highly Cited
2010
Highly Cited
2010
ZnO nanowires grown on SOI CMOS substrate for ethanol sensing
S. Santra
,
P. Guha
,
+7 authors
F. Udrea
2010
Corpus ID: 97466389
Highly Cited
2008
Highly Cited
2008
Damage mechanics of electromigration induced failure
C. Basaran
,
Minghui Lin
2008
Corpus ID: 16173384
Highly Cited
2008
Highly Cited
2008
A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect
K. Kumagai
,
Y. Yoneda
,
+5 authors
Y. Mabuchi
Electronic Components and Technology Conference
2008
Corpus ID: 21573203
A novel silicon interposer (SilP) BGA package (PKG) - SilP PKG - has been developed and qualified through test chip. It features…
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Highly Cited
2005
Highly Cited
2005
Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
C. Basaran
,
Hua Ye
,
D. Hopkins
,
D. Frear
,
J. K. Lin
2005
Corpus ID: 16982023
The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different…
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Highly Cited
2000
Highly Cited
2000
256-channel bidirectional optical interconnect using VCSELs and photodiodes on CMOS
D. Plant
,
J. Trezza
,
+6 authors
W. Luo
International Topical Meeting on Optics in…
2000
Corpus ID: 46553844
2D Parallel Optical Interconnects are capable of providing large connectivity between elements in computing and switching systems…
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1998
1998
Gouraud bump mapping
I. Ernst
,
H. Rüsseler
,
H. Schulz
,
O. Wittig
Workshop on Graphics Hardware
1998
Corpus ID: 5199445
In this paper a new low cost bump mapping hardware is prcsented. The new hardware approach does not rely on per pixel lighting…
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Highly Cited
1997
Highly Cited
1997
A critical investigation on the discrepancy between the observational and the theoretical red giant luminosity function ‘bump’
S. Cassisi
,
M. Salaris
,
M. Salaris
1997
Corpus ID: 15436579
New theoretical evaluations of the RGB luminosity function 'bump' and the ZAHB luminosity covering the range of metallicities…
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