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Bump mapping

Known as: Bump, Bump Map, Bumpmap 
Bump mapping is a technique in computer graphics for simulating bumps and wrinkles on the surface of an object. This is achieved by perturbing the… 
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Related topics

Related topics

49 relations
3D rendering3DcATI RageATi Radeon R100 Series

Broader (2)

Texture mappingVirtual reality

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2013
Highly Cited
2013
DISCOVERY OF A RICH CLUSTER AT z = 1.63 USING THE REST-FRAME 1.6 μm “STELLAR BUMP SEQUENCE” METHOD
We present a new two-color algorithm, the “Stellar Bump Sequence” (SBS), that is optimized for robustly identifying candidate… 
Highly Cited
2011
Highly Cited
2011
How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?
Handling and shipping thin wafers (≦200μm) through all the semiconductor fabrication and packaging assembly processes are very… 
Highly Cited
2010
Highly Cited
2010
ELECTRONIC SPECTROSCOPY OF MEDIUM-SIZED POLYCYCLIC AROMATIC HYDROCARBONS: IMPLICATIONS FOR THE CARRIERS OF THE 2175 Å UV BUMP
Mixtures of polycyclic aromatic hydrocarbons (PAHs) have been produced by means of laser pyrolysis. The main fraction of the… 
Highly Cited
2009
Highly Cited
2009
Study of 15µm pitch solder microbumps for 3D IC integration
Developments of ultra fine pitch and high density solder microbumps and assembly process for low cost 3D stacking technologies… 
2008
2008
Carbon nanotube bumps for LSI interconnect
We demonstrate, for the first time, carbon nanotube (CNT) flip chip bumps for LSI modules. The CNT bump is composed of a bundle… 
Highly Cited
2005
Highly Cited
2005
FUSE Measurements of Far-Ultraviolet Extinction. II. Magellanic Cloud Sight Lines
We present an extinction analysis of nine reddened/comparison star pairs in the Large and Small Magellanic Clouds (LMC and SMC… 
Highly Cited
2004
Highly Cited
2004
Fullerenes and Buckyonions in the Interstellar Medium
We show that photoabsorption by fullerenes and buckyonions (multishell fullerenes) explain the shape, width, and peak energy of… 
Highly Cited
2004
Highly Cited
2004
Micro Cu Bump Interconnection on 3D Chip Stacking Technology
The three-dimensional (3D) chip stacking LSI technology under development at the Association of Super-Advanced Electronic… 
Highly Cited
2003
Highly Cited
2003
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy
Even though electroless Ni-P and Sn-Ag-Cu solders are widely used materials in flip-chip bumping technologies, interfacial… 
1998
1998
Gouraud bump mapping
In this paper a new low cost bump mapping hardware is prcsented. The new hardware approach does not rely on per pixel lighting… 
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