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coenzyme Q10 600 MG Oral Wafer [Chew Q]

Known as: Chew Q ubidecarenone 600 MG Oral Wafer, Chew Q 600 MG Oral Wafer, CoQ-10 600 MG Oral Wafer [Chew Q] 
National Institutes of Health

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Oral Wafer

Papers overview

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2017
2017
Physical analysis approach to investigate wafer backside discoloration
This paper illustrates physical analysis approach to understand the nature of wafer backside metallization (BSM) discoloration… Expand
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2012
2012
Transistor architecture impact on wafer inspection
  • T. Crimmins
  • Advanced Lithography
  • 2012
    • Corpus ID: 109071325
Pitch and CD scaling have been the main drivers of wafer inspection (WI) requirements, with tighter pitches and smaller CD's… Expand
2009
2009
Productivity improvement in the wafer backside cleaning before exposure
In the photolithography process, with the miniaturization of pattern size, depth of focus (D.O.F) is also becoming smaller and… Expand
2009
2009
CD and defect improvement challenges for immersion processes
The intention of this study is to develop an immersion lithography process using advanced track solutions to achieve world class… Expand
2007
2007
Bi-Directional Reflectivity of Surfaces with Anisotropic Roughness on the Wafer Backside
  • P. Hsu, R. Buchanan
  • 15th International Conference on Advanced Thermal…
  • 2007
    • Corpus ID: 16985304
Light scattering from rough surfaces is an area of research that has received a great deal of interest from several engineering… Expand
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2006
2006
Ribbon Growth on Substrate and Molded Wafer-Two Low Cost Silicon Ribbon Materials for PV
This paper focuses on two very promising silicon ribbon materials currently produced for research: ribbon growth on substrate… Expand
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2004
2004
New LDMOS Model Delivers Powerful Transistor Library— Part 2: Library Applications
Last month, Part 1 of this article introduced the new CMC (Curtice/Modelithics/Cree) non-linear LDMOS FET transistor model. The… Expand
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2001
2001
Aerial image sensor for self-calibration of wafer steppers
The requirement for higher resolution is pushing up the NA of the projection lens. As a result, DOF becomes shallower, and the… Expand
1996
1996
Wafer-Stepper mit einer Schnittstelle
Wafer-Stepper mit einer Schnittstelle (200), einer Kammereinheit (100) und einer Haupteinheit (300), die eine Steuerlogik zum… Expand
1987
1987
Prüfeinrichtung zur Wafer-Prüfung
Prufeinrichtung zum Prufen von Chips aufweisende Wafers (35) auf elektrische Fehlerfreiheit der Chips. Sie weist eine an einem… Expand
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