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Surface-mount technology

Known as: Surface mount devices, Very Small Outline Package, Surface mounted 
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface… 
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Related topics

Related topics

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Automated optical inspectionBead probe technologyBoard-to-board connectorBreadboard

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2012
Highly Cited
2012
A Broadband LTE/WWAN Antenna Design for Tablet PC
A broadband yet compact antenna design applicable to tablets and laptops is proposed. The antenna provides an extensive coverage… 
Highly Cited
2009
Highly Cited
2009
A novel passive phase modulator based on LH delay lines for chipless microwave RFID applications
This paper discusses novel techniques to overcome problems arising when porting the surface acoustic wave approach of building… 
2008
2008
Optimal fault-tolerant control strategy for multi-phase motor drives under an open circuit phase fault condition
In this paper an optimal disturbance-free control strategy suitable for open-phase fault operation of multi-phase current… 
2008
2008
A new architecture for low cost Power Hardware in the Loop testing of power electronics equipments
The paper presents a critical analysis of the current status in the field of power hardware in the loop testing. The authors… 
Highly Cited
2006
Highly Cited
2006
On the role of moving elastic–plastic boundaries in strain gradient plasticity
Gradient plasticity theories which are used to describe size effects require nonstandard boundary conditions. We believe that the… 
Highly Cited
2005
Highly Cited
2005
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact… 
2004
2004
Thermal fatigue modelling for SnAgCu and SnPb solder joints
Thermal fatigue of solder joints is investigated by means of the finite element method (FEM). During the usual thermal cycle… 
Highly Cited
2003
Highly Cited
2003
Ultralow-profile micromachined power inductors with highly laminated Ni/Fe cores: application to low-megahertz DC-DC converters
Micromachined inductors with submillimeter profiles and comparable electrical performance to thicker, commercially-available… 
Highly Cited
2002
Highly Cited
2002
Design and selection of AC machines for saliency-based sensorless control
This paper presents a design method for introducing a measurable saliency in the spatial impedances of structurally symmetrical… 
1995
1995
Surface Mount Technology for PC Boards
An Introduction to Surface Mount Technology Surface-Mount Components (SMCs) SMT Manufacturing Methods System Design… 
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