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Solder Joint Device Component

Known as: Solder Joint 
A connection between objects formed by solder.
National Institutes of Health

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Related topics

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Medical Device Component or Accessory

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2009
Highly Cited
2009
Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
Highly Cited
2008
Highly Cited
2008
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints were examined. A clear dependence… 
Highly Cited
2007
Highly Cited
2007
Delamination strength of YBCO coated conductors under transverse tensile stress
We present a new experimental technique to measure the delamination strength under transverse tensile stress of YBa2Cu3O7… 
Highly Cited
2005
Highly Cited
2005
BGA brittle fracture - alternative solder joint integrity test methods
  • K. Newman
  • Proceedings Electronic Components and Technology…
  • 2005
  • Corpus ID: 20653288
A solder ball shear and pull testing study was conducted on 27 unique package constructions, evaluated under a wide variety of… 
Highly Cited
2004
Highly Cited
2004
Effect of thermal aging on board level drop reliability for Pb-free BGA packages
The drive for Pb-free solders in the microelectronics industry presents several new reliability challenges. Examples include… 
Review
2004
Review
2004
Recent advances in flip-chip underfill: materials, process, and reliability
In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the… 
Highly Cited
2004
Highly Cited
2004
Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact
Board level solder joint reliability performance during drop test is a critical concern to semiconductor and electronic product… 
Highly Cited
2003
Highly Cited
2003
Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
Electromigration of eutectic SnPb flip chip solder joints and their mean-time-to-failure (MTTF) have been studied in the… 
Review
2001
Review
2001
An overview of solder bump shape prediction algorithms with validations
The trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more, higher… 
Highly Cited
1998
Highly Cited
1998
Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
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