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Solder Joint Device Component
Known as:
Solder Joint
A connection between objects formed by solder.
National Institutes of Health
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Related topics
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Medical Device Component or Accessory
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2011
Highly Cited
2011
Feature-Extraction-Based Inspection Algorithm for IC Solder Joints
Fupei Wu
,
Xianmin Zhang
IEEE Transactions on Components, Packaging, and…
2011
Corpus ID: 23663676
In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards (PCBs), an automatic…
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Highly Cited
2009
Highly Cited
2009
Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
A. Yu
,
J. Lau
,
+11 authors
Carl Chen
Electronic Components and Technology Conference
2009
Corpus ID: 24393277
High density three dimensional (3D) interconnects formed by high aspect ratio through silicon vias (TSVs) and fine pitch solder…
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Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
N. Khan
,
V. S. Rao
,
+5 authors
L. Ebin
Electronic Components and Technology Conference
2008
Corpus ID: 40004399
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via…
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Highly Cited
2006
Highly Cited
2006
Interface failure in lead free solder joints
R. Darveaux
,
C. Reichman
,
N. Islam
Electronic Components and Technology Conference
2006
Corpus ID: 20377706
The phenomenon of interface failure in lead free solder joints was explored using solder joint array tensile testing. The effects…
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Highly Cited
2006
Highly Cited
2006
Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling
P. Lall
,
S. Gupte
,
P. Choudhary
,
J. Suhling
Electronic Components and Technology Conference
2006
Corpus ID: 21410467
In this paper, the modeling approaches for first-level solder interconnects in shock and drop of electronics assemblies have been…
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Highly Cited
2005
Highly Cited
2005
A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability
D. Reiff
,
E. Bradley
Proceedings Electronic Components and Technology…
2005
Corpus ID: 38993575
Portable electronic products such as cell phones are often subjected to drop tests to simulate consumer usage and to ensure…
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Highly Cited
2004
Highly Cited
2004
Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength
I. E. Anderson
,
J. Harringa
2004
Corpus ID: 56053778
The shear strength behavior and microstructural effects after aging for 100 h and 1,000 h at 150°C are reported for near-eutectic…
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Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
M. Alam
,
Y. Chan
,
K. Tu
2003
Corpus ID: 97083111
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and…
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Highly Cited
1998
Highly Cited
1998
High performance no-flow underfills for low-cost flip-chip applications: material characterization
C. Wong
,
S. Shi
,
G. Jefferson
1998
Corpus ID: 2339208
Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill…
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Highly Cited
1998
Highly Cited
1998
Chip scale package (CSP) solder joint reliability and modeling
M. Amagai
2nd IEMT/IMC Symposium (IEEE Cat. No.98EX225)
1998
Corpus ID: 23751548
A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue…
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