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Solder Joint Device Component

Known as: Solder Joint 
A connection between objects formed by solder.
National Institutes of Health

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Medical Device Component or Accessory

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2011
Highly Cited
2011
Feature-Extraction-Based Inspection Algorithm for IC Solder Joints
In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards (PCBs), an automatic… 
Highly Cited
2009
Highly Cited
2009
Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
High density three dimensional (3D) interconnects formed by high aspect ratio through silicon vias (TSVs) and fine pitch solder… 
Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via… 
Highly Cited
2006
Highly Cited
2006
Interface failure in lead free solder joints
The phenomenon of interface failure in lead free solder joints was explored using solder joint array tensile testing. The effects… 
Highly Cited
2006
Highly Cited
2006
Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling
In this paper, the modeling approaches for first-level solder interconnects in shock and drop of electronics assemblies have been… 
Highly Cited
2005
Highly Cited
2005
A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability
  • D. ReiffE. Bradley
  • Proceedings Electronic Components and Technology…
  • 2005
  • Corpus ID: 38993575
Portable electronic products such as cell phones are often subjected to drop tests to simulate consumer usage and to ensure… 
Highly Cited
2004
Highly Cited
2004
Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength
The shear strength behavior and microstructural effects after aging for 100 h and 1,000 h at 150°C are reported for near-eutectic… 
Highly Cited
2003
Highly Cited
2003
Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization
The work presented here focuses on the role of 0.5 wt % Cu in the interfacial reaction between the molten Sn−3.5%Ag solder and… 
Highly Cited
1998
Highly Cited
1998
High performance no-flow underfills for low-cost flip-chip applications: material characterization
Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill… 
Highly Cited
1998
Highly Cited
1998
Chip scale package (CSP) solder joint reliability and modeling
  • M. Amagai
  • 2nd IEMT/IMC Symposium (IEEE Cat. No.98EX225)
  • 1998
  • Corpus ID: 23751548
A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue… 
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