Solder Joint Device Component

Known as: Solder Joint 
A connection between objects formed by solder.
National Institutes of Health

Papers overview

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2009
2009
The effects of SAC alloy composition on aging resistance and reliability
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly… (More)
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Highly Cited
2008
Highly Cited
2008
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints were examined. A clear dependence… (More)
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Highly Cited
2008
Highly Cited
2008
The effects of aging temperature on SAC solder joint material behavior and reliability
The effects of aging on mechanical behavior of lead free solders have been examined by performing creep tests on four different… (More)
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Highly Cited
2007
Highly Cited
2007
The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly… (More)
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Highly Cited
2006
Highly Cited
2006
Reliability of the aging lead free solder joint
Solder materials demonstrate evolving microstructure and mechanical behavior that changes significantly with environmental… (More)
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Highly Cited
2006
Highly Cited
2006
Electromigration and thermomigration in flip chip solder joints
The article consists of a Powerpoint presentation on electromigration and thermo migration in flip chip solder joints. The areas… (More)
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2006
2006
Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact
Board level solder joint reliability performance during drop test is a critical concern to semiconductor and electronic product… (More)
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Highly Cited
2005
Highly Cited
2005
BGA brittle fracture - alternative solder joint integrity test methods
  • Keith Newman
  • Proceedings Electronic Components and Technology…
  • 2005
A solder ball shear and pull testing study was conducted on 27 unique package constructions, evaluated under a wide variety of… (More)
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Highly Cited
2003
Highly Cited
2003
Effect of Simulation Methodology on Solder Joint Crack Growth Correlation
A generalized solder joint fatigue life model for surface mount packages was previously published in Refs [1,2]. The model is… (More)
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2003
2003
Mean-time-to-failure study of flip chip solder joints on Cu Õ Ni „ V ... Õ Al thin-film under-bump-metallization
Electromigration of eutectic SnPb flip chip solder joints and their mean-time-to-failure ~MTTF! have been studied in the… (More)
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