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Power Module Device Component
Known as:
Power Module
An independent electronic device designed to supply power to other devices.
National Institutes of Health
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Medical Device Component or Accessory
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Implementing Smart Homes with Open Source Solutions
H. Lin
2013
Corpus ID: 18451791
A Smart home provides living environment with comfortable, convenient, energy saving, safety and health care place to people live…
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2013
2013
A Novel Soft-Switched Auxiliary Resonant Circuit of a PFC ZVT-PWM Boost Converter for an Integrated Multichip Power Module Fabrication
Yong-Wook Kim
,
Jun-Ho Kim
,
Ki-Young Choi
,
B. Suh
,
Rae-Young Kim
IEEE transactions on industry applications
2013
Corpus ID: 7440561
This paper proposes a novel soft-switched auxiliary resonant circuit to provide a zero-voltage transition at turn on for a…
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2012
2012
Short-circuit ruggedness of high-voltage IGBTs
J. Lutz
,
T. Basler
28th International Conference on Microelectronics…
2012
Corpus ID: 7220282
The IGBT can run into different short-circuit types (SC I, SC II, SC III). Especially in SC II and III, an interaction between…
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Highly Cited
2010
Highly Cited
2010
Power circuit design for clean switching
R. Bayerer
,
D. Domes
6th International Conference on Integrated Power…
2010
Corpus ID: 14015879
Power circuit design has a strong impact on switching characteristics of power semiconductors and current sharing of paralleled…
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2008
2008
Transient thermal analysis of power devices based on Fourier-series thermal model
B. Du
,
J. Hudgins
,
E. Santi
,
A. Bryant
,
P. Palmer
,
H. Mantooth
IEEE Power Electronics Specialists Conference
2008
Corpus ID: 33813870
A new thermal model based on Fourier series expansion method has been presented for dynamic thermal analysis on power devices…
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2006
2006
Novel Electro-Thermal Coupling Simulation Technique for Dynamic Analysis of HV (Hybrid Vehicle) Inverter
T. Kojima
,
Y. Nishibe
,
+4 authors
K. Hamada
2006
Corpus ID: 15059687
This paper describes a novel electro-thermal coupling simulation technique mainly focused on the dynamic analysis of the HV…
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Review
2006
Review
2006
Industrial and lab-scale power module technologies : A review
L. Ménager
,
C. Martin
,
B. Allard
,
V. Bley
Annual Conference of the IEEE Industrial…
2006
Corpus ID: 27422809
In industrial power modules, the most common die-level interconnect technology is wire bonding. In niche markets, where…
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2006
2006
Progress in Silicon Carbide Power Devices
A. Agarwal
,
M. Das
,
+5 authors
J. Zhang
Device Research Conference
2006
Corpus ID: 21147111
SiC materials and device technology has entered a new era with the commercialization and acceptance of 600 V/10 A and 1200 V/10 A…
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2004
2004
Comparative evaluation of three-phase high power factor AC-DC converter concepts for application in future more electric aircrafts
G. Gong
,
M. Heldwein
,
U. Drofenik
,
K. Mino
,
J. Kolar
Nineteenth Annual IEEE Applied Power Electronics…
2004
Corpus ID: 6154526
A passive 12-pulse rectifier system, a two-level, and a three-level active three-phase PWM rectifier system are analyzed for…
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2004
2004
Inside a power module
C. Martin
,
J. Schanen
,
R. Pasterczyk
Conference Record of the IEEE Industry…
2004
Corpus ID: 15265973
Due to high current commutation speed, it has become necessary to minimize stray inductances to reduce over voltage. This is a…
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