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Package Type
Kinds of packages that bulk drug substances and final drug dosage forms are contained in, including both the immediate (or primary) and secondary…
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Glass Packaging Device
Package Type Not Stated
Pouch - device
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
The effect of improper conformal coating on SnPb and Pb-free BGA solder joints during thermal cycling: Experiments and modeling
Maxim Serebreni
,
R. Wilcoxon
,
D. Hillman
,
N. Blattau
,
C. Hillman
Semiconductor Thermal Measurement and Management…
2017
Corpus ID: 6218849
Electronic components, such as ball grid array (BGA), chip scale packages (CSP) and bottom terminated components (BTC) used in…
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2013
2013
Advancements in Package-on-Package (PoP) technology, delivering performance, form factor & cost benefits in next generation Smartphone processors
H. Eslampour
,
M. Joshi
,
Seong-Su Park
,
HanGil Shin
,
JaeHan Chung
IEEE 63rd Electronic Components and Technology…
2013
Corpus ID: 6874673
The explosive growth and adoption of Smartphones in the mobile market has led to its proliferation into feature-rich phones…
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2011
2011
Effects of package type, die size, material and interconnection on the junction-to-case thermal resistance of power MOSFET packages
Cong Yue
,
Jun Lu
,
Xiaotian Zhang
,
Y. Ho
12th International Conference on Electronic…
2011
Corpus ID: 8795278
In this paper, RthJC (junction-to-case thermal resistance) of power device packages including TO (Transistor Outline), DPAK and…
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2010
2010
Physiological and enzymatic alterations in papaya seed during storage
D. Dias
,
W. T. Estanislau
,
F. Finger
,
E. M. Alvarenga
,
L. Dias
2010
Corpus ID: 42473070
O trabalho foi realizado com objetivo de avaliar as alteracoes fisiologicas e enzimaticas em sementes de mamao (Carica papaya L…
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2008
2008
4.5 kV 1000 A Class SiC pn Diode Modules with Resin Mold Package and Ceramic Flat Package
Y. Sugawara
,
S. Ogata
,
+5 authors
A. Tanaka
International Symposium on Power Semiconductor…
2008
Corpus ID: 40025146
4.5 kV 1000 A class high heat resistive SiC pn diode modules of both a resin mold package type using a new mold resin, Nanotec…
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2004
2004
Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop
M. Hanabe
,
S. Canumalla
Proceedings. 54th Electronic Components and…
2004
Corpus ID: 35805242
Interconnection shear strength tests performed on three different package constructions at two different test speeds indicate…
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2004
2004
3D structure design and reliability analysis of wafer level package with bubble-like stress buffer layer
Chang-Chun Lee
,
Hsing-Chih Liu
,
M. Yew
,
K. Chiang
The Ninth Intersociety Conference on Thermal and…
2004
Corpus ID: 25989823
With the present trend of multi-function and minimizing of size, the conventional electronic package type no longer meets the…
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1997
1997
Glass direct bonding technology for hermetic seal package
D. Ando
,
K. Oishi
,
T. Nakamura
,
S. Umeda
Proceedings IEEE The Tenth Annual International…
1997
Corpus ID: 53697291
A new SMD type hermetic seal package using glass wafers has been developed for SAW (surface acoustic wave) resonators. This…
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1984
1984
Effect of Package Type and Storage Time-temperature on Weight Loss, Firmness, and Spoilage of Rabbiteye Blueberries
W. Miller
,
R. McDonald
,
C. Melvin
,
K. A. Munroe
Hortscience
1984
Corpus ID: 88829008
Rabbiteye blueberries, Vaccinium ashei (Reade), were stored in each of 3 containers and 4 time-temperature regimes: 24 hr at 1°C…
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1976
1976
Quantitative Analysis of the Rescue of RNA Sequences by Mammalian Type C Viruses
R. Goldberg
,
R. Levin
,
W. Parks
,
E. Scolnick
Journal of Virology
1976
Corpus ID: 10495600
The specificity and quantitation of the rescue of RNA sequences by mammalian type C viruses has been investigated. Type C viruses…
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