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Organic solderability preservative
Known as:
OSP
, Organic surface protection
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively…
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Related topics
Related topics
2 relations
Printed circuit board
Soldering
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Failure analysis on bad wetting of ENIG surface finish pads
Weiming Li
16th International Conference on Electronic…
2015
Corpus ID: 43349062
Electroless nickel/immersion gold (ENIG) is an effective surface finish, which guarantees good corrosion resistance, a long shelf…
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2015
2015
Chemical composition and antioxidant activity of Origanum vulgare subsp. vulgare essential oil from Iran
M. Vazirian
,
M. Mohammadi
,
M. Farzaei
,
G. Amin
,
Y. Amanzadeh
2015
Corpus ID: 43985728
Background and Objectives: Essential oils are very complex mixture of components and their composition may vary in different…
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2013
2013
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
Chin-Hung Kuo
,
Hsin-Hui Hua
,
Ho-Yang Chan
,
Tsung-Hsun Yang
,
Kuen-Song Lin
,
Cheng-En Ho
Microelectron. Reliab.
2013
Corpus ID: 6456959
2011
2011
Aristotle on Various Types of Alteration in De Anima II 5
J. Bowin
2011
Corpus ID: 14993369
In De Anima II 5,417a21-b16, Aristotle makes a number of distinctions between types of transitions, affections, and alterations…
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2007
2007
Organic solderability preservative for forming undercoat composition
ウィトルド・パウ
,
ブライアン・ラルソン
2007
Corpus ID: 105935076
【課題】 本発明の目的は、有機系はんだ付け保護(OSP)被覆の前に前処理組成物を使用する改良されたOSP被覆方法を提供することである。 【解決手段】 本発明は、脂肪族カルボン酸とアミン及びアンモニアからなる群より選択される添加剤との希薄溶液を含む前処理組成物と1つ以上の銅表面を接触させる工程、その後、有機系はんだ付け保護組成物と前記1つ以上の銅表面を接触させる工程を含む銅表面のはんだ付け性を向上する改良された方法に関する。 本発明の改良された有機系はんだ付け保護方法は、より優れた外観及び色を有するより均一な被覆を形成する。 【選択図】 なし
2006
2006
Preparation and Evaluation of Poly(vinyl pyridine) Copolymers for Organic Solderability Preservatives
J. Im
,
Hyun-Jun Lee
,
+4 authors
Ho-Suk Choi
2006
Corpus ID: 92338348
Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine…
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Highly Cited
2005
Highly Cited
2005
Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
D.Y.R. Chong
,
F. Che
,
J. Pang
,
K. Ng
,
J.Y.N. Tan
,
Patrick T. H. Low
Proceedings Electronic Components and Technology…
2005
Corpus ID: 15126625
2004
2004
WL-CSP reliability with various solder alloys and die thicknesses
B. Keser
,
Li Wetz
,
Jerry White
Microelectron. Reliab.
2004
Corpus ID: 28753663
2003
2003
New Application of the SERA Method-Assessment of the Protective Effectiveness of Organic Solderability Preservatives
P. Bratin
,
G. Chalyt
,
R. Gluzman
2003
Corpus ID: 18512623
rganic coatings have been successfully used in the past for inhibition of copper corrosion. 0 The most widely used coatings are…
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2001
2001
Board level reliability of PBGA using flex substrate
S. Hung
,
P. Zheng
,
S. Ho
,
S. C. Lee
,
H. N. Chen
,
J. D. Wu
Microelectron. Reliab.
2001
Corpus ID: 30322038
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