Organic solderability preservative

Known as: OSP, Organic surface protection

Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively…

Wikipedia

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.

2015

Failure analysis on bad wetting of ENIG surface finish pads

Weiming Li
16th International Conference on Electronic…
2015
Corpus ID: 43349062

Electroless nickel/immersion gold (ENIG) is an effective surface finish, which guarantees good corrosion resistance, a long shelf…

2015

Chemical composition and antioxidant activity of Origanum vulgare subsp. vulgare essential oil from Iran

M. Vazirian, M. Mohammadi, M. Farzaei, G. Amin, Y. Amanzadeh
2015
Corpus ID: 43985728

Background and Objectives: Essential oils are very complex mixture of components and their composition may vary in different…

2013

Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations

Chin-Hung Kuo, Hsin-Hui Hua, Ho-Yang Chan, Tsung-Hsun Yang, Kuen-Song Lin, Cheng-En Ho
Microelectron. Reliab.
2013
Corpus ID: 6456959

2011

Aristotle on Various Types of Alteration in De Anima II 5

J. Bowin
2011
Corpus ID: 14993369

In De Anima II 5,417a21-b16, Aristotle makes a number of distinctions between types of transitions, affections, and alterations…

2007

Organic solderability preservative for forming undercoat composition

【課題】本発明の目的は、有機系はんだ付け保護（ＯＳＰ）被覆の前に前処理組成物を使用する改良されたＯＳＰ被覆方法を提供することである。【解決手段】本発明は、脂肪族カルボン酸とアミン及びアンモニアからなる群より選択される添加剤との希薄溶液を含む前処理組成物と１つ以上の銅表面を接触させる工程、その後、有機系はんだ付け保護組成物と前記１つ以上の銅表面を接触させる工程を含む銅表面のはんだ付け性を向上する改良された方法に関する。本発明の改良された有機系はんだ付け保護方法は、より優れた外観及び色を有するより均一な被覆を形成する。【選択図】なし

2006

Preparation and Evaluation of Poly(vinyl pyridine) Copolymers for Organic Solderability Preservatives