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Organic solderability preservative

Known as: OSP, Organic surface protection 
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively… Expand
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
  • W. Li
  • 16th International Conference on Electronic…
  • 2015
  • Corpus ID: 43349062
Electroless nickel/immersion gold (ENIG) is an effective surface finish, which guarantees good corrosion resistance, a long shelf… Expand
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2015
2015
Background and Objectives: Essential oils are very complex mixture of components and their composition may vary in different… Expand
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2015
2015
The invention belongs to the circuit board production technical field and relates to a method for producing an organic… Expand
2011
2011
In De Anima II 5,417a21-b16, Aristotle makes a number of distinctions between types of transitions, affections, and alterations… Expand
2008
2008
The paper describes that the application of the lead-free soldering for 5-surface finishs.In substance,the OSP is substituted… Expand
2007
2007
【課題】 本発明の目的は、有機系はんだ付け保護(OSP)被覆の前に前処理組成物を使用する改良されたOSP被覆方法を提供することである。 【解決手段】 本発明は、脂肪族カルボン酸とアミン及びアンモニアからなる群より選択される添加剤との希薄溶液を含む前処理組成物と1つ以上の銅表面を接触させる工程、その後、有機系はんだ付け保護組成物と前記1つ以上の銅表面を接触させる工程を含む銅表面のはんだ付け性を向上する改良された方法に関する。 本発明の改良された有機系はんだ付け保護方法は、より優れた外観及び色を有するより均一な被覆を形成する。 【選択図】 なし 
2006
2006
Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine… Expand
2005
2005
Modifications in the structure of wood preserving quaternary ammonium compounds (QACs) may result in improvements in leaching of… Expand
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2004
2004
Abstract WL-CSP is a low profile, true chip size package that is entirely built on a wafer using front-end and back-end… Expand
2003
2003
rganic coatings have been successfully used in the past for inhibition of copper corrosion. 0 The most widely used coatings are… Expand
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