Skip to search formSkip to main contentSkip to account menu

MSL3 gene

Known as: DROSOPHILA MSL3-LIKE 1, MALE-SPECIFIC LETHAL 3, DROSOPHILA, HOMOLOG OF, MSL3 
National Institutes of Health

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
Acquisition of a side population fraction augments malignant phenotype in ovarian cancer
Side population (SP) cells harbor malignant phenotypes in cancer. The aim of this study was to identify genes that modulate the… 
2018
2018
Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process
Development of 2.1D package with organic interposer in panel size based on the high resolution dry film photo resist and the… 
2017
2017
Novel ultra-fine line 2.1D package with organic interposer
2.1D package technology (chip on substrate) as a potential low cost solution for 2.5D silicon interposer package (chip on wafer… 
2017
2017
Flip Chip Solder Joint Pad Optimizations for a Connectivity SiP Application
System-in-Package (SiP) is becoming more and more important in integrating functionality while reducing final product form… 
2015
2015
A comparative study of the relative performances of the sinter-silver die attach materials
Die attach materials play an important role in meeting the demanding thermal management requirements of high power devices… 
2012
2012
Molding void issue and solution of a Package-in-Package
To enables new functionality in the shortest time-to-market by stacking packages and KGD, Package-in-Package (PiP) structure has… 
2011
2011
Moisture absorption of molding compound and organic substrate
The moisture absorption experiments of 8 kinds of molding compound and two kinds of organic substrate at 30°C/60% RH was… 
2011
2011
Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)
In this paper, we focus how to overcome process challenges, such as die shift and warpage, and to fabricate thin embedded wafer… 
2008
2008
An introduction of QFN-SIP package: Process challenges and technical issues
The continuous need for higher levels of integration, lower costs and a growing awareness of complete system configuration is the… 
2006
2006
Impact of hygroswelling and vapor pressure on delamination
In this paper, resolving methods for several key issues in simulation of interface delamination of plastic package under… 
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)