Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)

In this paper, we focus how to overcome process challenges, such as die shift and warpage, and to fabricate thin embedded wafer level packages (EMWLPs) with 200μm-thick eventually. The initial warpage of reconfigured wafer after post mold curing (PMC) was about 1.0 ∼ 1.4mm range. After PMC, the molded wafer was background to 200μm thickness and… CONTINUE READING