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Lab-On-A-Chip Devices

Known as: Device, Lab-On-A-Chip, Lab On A Chip Devices, Devices, Lab-On-A-Chip 
Microdevices that combine microfluidics technology with electrical and/or mechanical functions for analyzing very small fluid volumes. They consist… 
National Institutes of Health

Related topics

Related topics

6 relations
MicrobiologicalMicrochemistryMicrochip Analytical Proceduresstandards characteristics

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Microchip Analytical DevicesNanochip Analytical Devices

Papers overview

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2012
2012
Failure analyse of the welding point in flip-chip BGA packages in the drop-free
The failure of plastic ball grid array in vibration and shock under intense dynamic loading will be studied in the project. This… 
2011
2011
A sample-in result-out lab-on-a-chip device: from prototype to mass fabrication
In this paper we demonstrate the development of an integrated lab-on-a-chip system for the point-of-care diagnostics of Coeliac… 
2010
2010
Design and fabrication of Poly(dimethylsiloxane) arrayed waveguide grating.
We have designed, fabricated and characterized poly(dimethylsiloxane) (PDMS) arrayed waveguide grating (AWG) with four-channel… 
2006
2006
SU-8 microfluidic mixer for use in lab-on-a-chip devices for biological fluids analyses
This paper describes an easy-to-fabricate and low-cost SU-8 microfluidic mixer suitable for enabling a mixing process based on… 
2006
2006
Challenges in Manufacturing Reliable Lead Free Components
The recent push for lead free products is resulting in significant changes in packaging materials. Manufacturers of electronic… 
2005
2005
Indoor navigation with pseudolites (fake GPS sat.)
This Master Thesis was conducted by Rikard Eriksson and Vlad Badea for their Master of Science degree in Electronics Design… 
2004
2004
Thermal fatigue modelling for SnAgCu and SnPb solder joints
Thermal fatigue of solder joints is investigated by means of the finite element method (FEM). During the usual thermal cycle… 
2004
2004
Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill
Package reliability needs to be considered for the design of mixed flip-chip (FC)-wire bond (WB) stacked die BGA module with… 
1998
1998
Flip-Chip Modules for Millimeter-Wave Sensor Applications
In this paper the design of a W-band flip-chip (FC) sensor module is presented. The module incorporates two MMICs, a voltage… 
1997
1997
Integrierte piezosensitive und kapazitive Ein-Chip-Silizium-Mikrofone
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